JPH04304000A - Method of mounting chiplike circuit parts - Google Patents

Abstract

PURPOSE:To remedy an omission of chip-like circuit parts without stopping the operation of a device even when the omission of chip-like circuit parts occurs in a housing section on a template. CONSTITUTION:Chip-like circuit parts are sent to the guide case 61 of a template from each container 1 through a guide tube 21 immediately below a distributor 2. Then the presence/absence of the chip-like circuit parts in the guide case 61 is inspected when the template 6 arrives at a position between a light source 15 and photoreceptor 9. When an omission of the parts is discriminated, the template 61 is returned to the section immediately below the distributor 2 and the chip-like circuit parts supplying operations are again performed while the supply of the chip-like circuit parts from each container 1 is stopped. Therefore, the chip-like circuit parts remaining in the distributor 2 undelivered are forcibly carried and the omission can be remedied.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention relates to a method for mounting chip-shaped circuit components on a circuit board using an automatic mounting device, and in particular to a method for easily recovering missing chip-shaped circuit components on the template. Regarding improvements to be made.

0002

2. Description of the Related Art Conventionally, when mounting a chip-shaped circuit component at a predetermined position on a circuit board, an automatic mounting device has been used in the following manner. That is, the chip-shaped circuit components stored in bulk in multiple containers are taken out one by one through multiple guide tubes connected to a distributor, and placed in storage sections formed at predetermined positions on the template. Send it to each person and collect it there. This storage section is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. After inspecting whether or not a chip-shaped circuit component is stored in each storage section of the template, when the chip-shaped circuit component stored in the storage section is stored by a component moving means having a suction head. is moved and mounted on the circuit board while maintaining its relative position. As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board. Adhesive is applied to the circuit board in advance at the position where the chip-shaped circuit component is to be mounted, and soldering is performed while the mounted circuit component is temporarily fixed with the adhesive.

As shown in FIG. 3, the suction head uses a set nozzle 81 for sucking chip-shaped circuit components, which is attached to each predetermined position of the suction head 8. This suction head 8 is provided with a vacuum chamber 84 that maintains a negative pressure on the rear side where the set nozzle 81 is attached. After the template receives each chip-shaped circuit component a at a predetermined position directly below the distributor, the template moves to below the suction head 8, where the chip-shaped circuit component a received at the predetermined position of the template is suctioned. They are each attracted to the set nozzles 81 of the head 8. After that, after the template is retracted from under the suction head 8,
As shown in FIG. 3, a circuit board c is inserted underneath. Then, the suction head 8 descends from the position shown in FIG.
Chip-shaped circuit component a attracted to the tip of the set nozzle 81
are placed on the electrode lands d and d, and temporarily fixed with an adhesive e previously applied between them. Thereafter, the suction head returns upward.

[Problem to be solved by the invention]

As already mentioned, in the mounting method using the conventional device, it is checked from the distributor 2 side whether each chip-shaped circuit component is stored in a predetermined storage portion on the template, that is, whether or not there is a missing part. After being inspected, the chip-shaped circuit component a is sucked and held by the suction head 8, and moved to and mounted on the circuit board c. At this time, if the chip-shaped circuit component a was not stored in a certain storage area on the template, the movement of the apparatus had to be temporarily stopped. Otherwise, as shown by the two-dot chain line in FIG. 3, some of the chip-shaped circuit components a that should be picked up by the set nozzle 81 will not be picked up, and some of the chip-shaped circuit components a will remain missing and remain in the circuit. It will be mounted on board c. Therefore,
Recovery such as collecting the missing circuit board c and supplementing the parts is time consuming. However, on the other hand, stopping the operation of the apparatus every time a part of the storage section on the template is missing to recover the missing item is also a major cause of lowering the operating rate of the apparatus. SUMMARY OF THE INVENTION The present invention has been made to solve the drawbacks of the conventional method for mounting chip-shaped circuit components. An object of the present invention is to provide a method for mounting a chip-shaped circuit component that can be recovered without stopping the operation of the circuit.

[0005]

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, the present invention has been implemented from a plurality of containers 1, 1... in which chip-shaped circuit components are stored in bulk, to a plurality of guide tubes 21 of a distributor 2, 21 to the storage part of the template 6 inserted directly under the distributor 2, and moving the template 6 from directly under the distributor 2 and placing the chip circuit in its predetermined position. A process of inspecting whether the components have been received, sending the template 6 to the suction head 8 side, sucking the chip-shaped circuit components stored in the storage portion with the suction head 8, and moving them to the circuit board c; In the method for mounting a chip-shaped circuit component, which includes a mounting process, in the process of inspecting whether the chip-shaped circuit component is received at a predetermined position of the template 6, any chip-shaped circuit component is not received. is detected, the template 6 is returned directly below the distributor 2 and the supply of chip-shaped circuit components from the container 1, 1... side is stopped, and the chip-shaped circuit is transferred from the distributor 2 to the storage section of the template 6. A method for mounting chip-shaped circuit components is proposed, which is characterized by carrying out a component feeding operation.

[0006]

[Operation] According to the mounting method of the present invention, when it is detected by the inspection means that no chip-shaped circuit component is stored in a certain storage portion of the template 6, the template 6 is returned to the position immediately below the distributor 6. container 1, 1
... Since the chip-shaped circuit components are fed from the distributor 6 to the storage section of the template 6 while the supply of chip-shaped circuit components from the side is stopped, the chip-shaped circuit components stagnant in the middle of the distributor 2 are There is an opportunity to receive the circuit components again into the storage section on the template 6 where the missing components have occurred. Therefore, even if a product is out of stock, there is no need to stop the operation of the device, and in many cases, by going through the above-mentioned process in addition to the normal process, it is possible to recover from the situation when a product is out of stock.

[0007]

Embodiments Next, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 shows an overview of an entire mounting apparatus for chip-shaped circuit components, which is an example of an apparatus for carrying out the present invention. That is, a plurality of containers 1 storing chip-shaped circuit components in bulk are arranged, and a delivery section 11 serving as an escapement is connected to the container 1 via a tube 10.
is connected. Further, a distributor 2 is arranged below this delivery section 11.

[0008] This distributor 2 has a fixed frame 23 fixed under the delivery section 11, and a movable frame 22 arranged parallel to this below and to the lower surface of which the template 6 is detachably attached. However, the fixed frame 23 and the movable frame 22 are connected to each other at their four corners by four flexible pillars of equal length. A vibrator 24 that vibrates the movable frame 22 is connected to the movable frame 22, thereby causing the movable frame 22 to vibrate horizontally. Furthermore, flexible guide tubes 21, 21, . . . for guiding and transporting chip-shaped circuit components are arranged between the fixed frame 23 and the movable frame 22.

A template 6 placed on a template frame 65 is inserted and fixed under the movable frame 22. This template 6 has a guide case 61 arranged on a base board 60 in accordance with the mounting position of the chip-shaped circuit component on the circuit board. When this template 6 is inserted directly under the distributor 2, the lower end of the guide tube 21 connected to the movable frame 22 is positioned above each guide case 61 of the template 6.

At this time, the vacuum case 4 is placed under the template 6, and the lower surface of the template 6 is maintained at negative pressure. Further, in the template 6, a through hole (not shown) is provided at the bottom of each guide case 61. Therefore, air is drawn from the guide tube 21 to the back side of the template 6 through the through hole provided at the bottom of the guide case 61, thereby forming an air flow. This air flow causes the guide tube 2 to flow from the delivery section 11.
The chip-shaped circuit component released into the template 6 is forcibly conveyed to the guide case 61 of the template 6.

The template 6 placed on the template frame 65 is moved between directly below the distributor 2 and directly below the suction head 8 by a moving mechanism 66. A light receiver 9 and a light source 15 are disposed facing each other above and below the moving path of the template 6.
Each guide case 61 depends on whether the light from the light source 15 is received by the light receiver 9 through the through hole of the template 6.
It is inspected whether chip-shaped circuit components are stored in the container, that is, if there are any missing parts. That is, when no chip-shaped circuit component is housed in each guide case 61, the air suction hole provided at the bottom of the case 61 is not blocked by the chip-shaped circuit component, so that the light source can pass through the hole. The light from 15 is received by the light receiver 9, and a missing chip-shaped circuit component is discovered.

The suction head 8 has a set nozzle (not shown) provided on its lower surface in accordance with the mounting position of the chip-shaped circuit component on the circuit board c. The tip of this set nozzle sucks the chip-shaped circuit component housed in the guide case 61 of the template 6, and mounts the chip-shaped circuit component on the circuit board c conveyed by the conveyor 7.

Using this apparatus, the mounting method according to the present invention is carried out through the process shown in the flow sheet of FIG. 2, for example. This will be explained with reference to FIG. 1. First, chip-shaped circuit components are supplied from each container 1 to the delivery section 11 via the tube 10. At the same time, the template 6 is inserted directly under the distributor 2, and while the vacuum case 4 under it is suctioning,
The chip-shaped circuit components are released into each guide tube 21 one by one in the delivery section 11. Then, this chip-shaped circuit component is sent into the guide case 61 of the template 6 through the guide tube 21. The chip-shaped circuit components are now supplied to each guide case 61 of the template 6.

Next, the template 6 is moved from directly below the distributor 2, and the presence or absence of chip-shaped circuit components in the guide case 61 is inspected at a position between the light source 15 and the light receiver 9. That is, if there is a missing item, the guide case 61 is empty, so light from the light source 15 leaks from the through hole at the bottom and is received by the light receiver 9. This result is processed by the controller 16, and if it is determined that there is a shortage, the template 6 is returned to the distribution position, that is, directly below the distributor 2. Then, the sending unit 11
is stopped, and while the supply of chip-shaped circuit components from each container 1 is stopped, the operation of supplying chip-shaped circuit components from the guide tube 21 is performed while sucking air again with the vacuum case 4. As a result, the chip-shaped circuit components that have been stagnant in the distributor 2 are forcibly conveyed, and the chip-shaped circuit components are received in the storage section 61 of the template 6 that is out of stock. Thereafter, the template 6 is moved from directly below the distributor 2, and the presence or absence of chip-shaped circuit components in the guide case 61 is inspected at a position between the light source 15 and the light receiver 9.

When the missing item is cured as described above or there is no missing item from the beginning, when the missing item is not inspected at the inspection position between the light source 15 and the light receiver 9, the template 6 is Move below the suction head 8. Next, the head 8 descends, and a set nozzle (
Each guide case 61 of the template 6 is attached to the tip of the template 6 (not shown).
The chip-shaped circuit component a inside is attracted. After that, the template 6 returns to the position directly under the distributor 2. Around this time, the suction head 8 further descends, and the chip-shaped circuit component is placed on the circuit board c that has been conveyed by the conveyor 7, and is temporarily fixed with adhesive applied on the circuit board c in advance. . Thereafter, the suction head returns upward, and the series of operations ends. Thereafter, by repeating this operation, chip-shaped circuit components are sequentially mounted on the circuit board c.

[0016]

As explained above, according to the present invention, even if a chip-shaped circuit component is missing in the storage section on the template, the chip can be recovered without stopping the operation of the device. A similar circuit component mounting method can be realized.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view showing a chip-shaped circuit component mounting device used in an embodiment of the present invention.

FIG. 2 is a free sheet showing the same example.

FIG. 3 is a sectional view of a main part of a mounting device showing a conventional chip-shaped circuit component mounting method.

[Explanation of symbols]

1 Container 2 Distributor 3 Parts receiver 6 Template 7 Conveyor 8 Suction head 9 Photo receiver 15 Light source 66 Template movement mechanism c Circuit board

Claims (1)

[Claims] Claim 1: A plurality of containers (1), (1)... in which chip-shaped circuit components are stored in bulk form are passed through a plurality of guide tubes (21), (21) of a distributor (2) to the same distributor. (2) The process of sending the chip-shaped circuit component to the storage part of the template (6) inserted directly under the distributor (2), and the process of moving the template (6) from directly under the distributor (2) and placing the chip in its predetermined position. A process of inspecting whether the chip-shaped circuit components are received, and sending the template (6) to the suction head (8) side, and sucking the chip-shaped circuit components stored in the storage part with the suction head (8). , circuit board (c)
In the method for mounting a chip-shaped circuit component, the template (6)
Template (6)
Place it directly under the distributor (2) and remove it from the container (1).
), (1) A chip characterized in that the chip-shaped circuit component is sent from the distributor (2) to the storage section of the template (6) while the supply of the chip-shaped circuit component from the... side is stopped. How to mount circuit components.