JPH0577994U - Chip circuit component mounting device - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] The state when the suction head again moves to pick up the chip-shaped circuit component from the template with the chip-shaped circuit component stuck to the tip of the set nozzle of the suction head. By detecting, the defective product on the circuit board can be detected, and troubles such as damage to the chip-shaped circuit component can be prevented. [Configuration] Suction head 8 above template 6
By providing a detection means for detecting the presence or absence of the chip-shaped circuit component a at the tip of the set nozzle 81, the chip-shaped circuit component a is provided at the tip of the set nozzle 81 of the suction head 8.
When the suction head 8 shifts to the operation of picking up the chip-shaped circuit component a from the template 6 while sticking the chip-shaped circuit component a to the tip of the set nozzle 81 above the template 6, the chip-shaped circuit component a is detected by the detection means. Detected by.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a device for mounting a chip-shaped circuit component on a circuit board, and particularly detects that the chip-shaped circuit component is stuck to the tip of the set nozzle of the suction head and cannot be mounted normally on the circuit board. The present invention relates to a chip-shaped circuit component mounting device that can be used.

[0002]

[Prior Art]

 Conventionally, when a chip-shaped circuit component is mounted at a predetermined position on a circuit board, it has been carried out as follows using an automatic mounting device. In other words, the chip-shaped circuit components that are stored in bulk in multiple containers are taken out one by one into the multiple guide tubes that are piped to the distributor, and placed in the storage section that is formed at the specified position on the template. Send each and collect in there. The housing portion is arranged in accordance with the position where each chip-shaped circuit component is mounted on the circuit board. Then, after it is inspected whether or not the chip-shaped circuit components are stored in the respective storage portions of the template, the chip-shaped circuit components stored in the storage portion are stored by the component moving means having the suction head. It is moved and mounted on the circuit board while maintaining its relative position. As a result, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board. Adhesive and cream solder are applied to the circuit board in advance at the position where the chip-shaped circuit component should be mounted, and the mounted circuit component is temporarily fixed with this adhesive and cream solder before soldering or , Cure.

In the suction head, as shown in FIG. 4, set nozzles 81 for sucking the chip-shaped circuit component a are used, and the set nozzles 81 are attached to the suction head 8 at predetermined positions. The suction head 8 is provided with a vacuum chamber 84 which maintains a negative pressure on the back side to which the set nozzle 81 is attached. Immediately below the distributor of the multi-mounter device, the template receives the chip-shaped circuit component a at a predetermined position, respectively, and then the template moves to below the suction head 8, where the chip-shaped circuit is received at the predetermined position of the template. The component a is adsorbed by each set nozzle 81 of the suction head 8. Then, after the template is retracted from under the suction head 8, as shown in FIG. 4, the suction head 8 descends toward the circuit board 9 which is previously inserted under the suction head 8 and reaches the tip of the set nozzle 81. The adsorbed chip-shaped circuit component a is placed on the electrode lands d, d, and temporarily fixed by an adhesive and cream solder e applied in advance between them. Then, the negative pressure at the tip of the set nozzle 81 is released, and the suction head 8 returns upward.

[Problems that the device is trying to solve]

However, the tip end of the set nozzle 81 is made of an elastic member such as rubber, and the chip-shaped circuit component a is easily attached to the tip. For this reason, if the chip-shaped circuit component a is not sufficiently adhered by the adhesive applied on the circuit board 9 and the cream solder e, the chip-shaped circuit component a adsorbed at the tip of the set nozzle 81 of the suction head 8 will not contact the electrode land. d, the negative pressure at the tip of the set nozzle 81 is released, and when the suction head 8 returns upward, as in the chip-shaped circuit component a shown on the right in FIG. The chip-shaped circuit component a may not be placed on the circuit board 9 but may be lifted while being attached to the tip of the set nozzle 81. Then, the chip-shaped circuit component a to be mounted on the circuit board 9 is not mounted, causing a so-called "out-of-stock" problem.

Further, the suction head 8 shifts to the operation of picking up the chip-shaped circuit component a again from the template while the chip-shaped circuit component a is attached to the tip of the set nozzle 81, so that the chip is properly processed. The circuit-shaped circuit component a cannot be adsorbed, causing troubles such as damage to the chip-shaped circuit component a. Therefore, the present invention was made in order to solve the drawbacks of the conventional chip-shaped circuit component mounting device, and its purpose is to make the suction head re-template while the chip-shaped circuit component is attached to the tip of the set nozzle of the suction head. When the operation shifts to picking up the chip-shaped circuit component from that, it is possible to detect the state, and therefore detect the defective product on the circuit board and prevent troubles such as damage of the chip-shaped circuit component. An object is to provide a circuit component mounting device.

[0006]

[Means for Solving the Problems]

 That is, in order to achieve the above-mentioned object, the present invention has a plurality of containers 1, 1 ... In which a chip-shaped circuit component a is stored in a bulk form, and a chip-shaped circuit component a housed in each container 1, 1. Is distributed and supplied, a conveyor 7 that conveys the circuit board 9, and a path between the portion directly below the distributor 2 and the portion above the conveyor 7 and supplied from the same distributor 2 directly below the distributor 2. The container 6 for receiving the chip-shaped circuit component a is placed in a predetermined position with the template 6, and is moved up and down on the conveyor 7 and moved to the template 7 and is stored in the storage portion of the template 6. A set nose in which a circuit component is adsorbed from the same housing portion and the chip-shaped circuit component a adsorbed when the template 6 retracts from the conveyor 7 is mounted on the circuit board 9. In the chip-shaped circuit component mounting device including the suction head 8 having the suction head 8 having the 81, a detection means for detecting the presence or absence of the chip-shaped circuit component a at the tip of the set nozzle 81 of the suction head 8 is provided above the template 6. We propose a featured chip-shaped circuit component mounting device.

[0007]

[Action]

 According to the mounting apparatus of the present invention, the detection means for detecting the presence or absence of the chip-shaped circuit component a at the tip of the set nozzle 81 of the suction head 8 is provided above the template 6, so that the set nozzle 81 of the suction head 8 is When the suction head 8 moved from the template 6 to the operation of picking up the chip-shaped circuit component a while the chip-shaped circuit component a was stuck to the tip, the suction head 8 was stuck to the tip of the set nozzle 81 above the template 6. The chip-shaped circuit component a is detected by the detection means. Therefore, when such a state is detected, by stopping the operation of the mounting device, it is possible to prevent damage to the chip-shaped circuit component a and to recognize that the circuit board 9 is out of stock. Recover quickly.

[0008]

【Example】

 Next, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 shows an outline of the whole mounting device for a chip-shaped circuit component which is an embodiment of the present invention. That is, a plurality of containers 1 in which chip-shaped circuit components are stored in a bulk form are arranged, and a delivery section 11 which is an escapement is connected to the containers 1 via a tube 10. Further, the distributor 2 is arranged below the sending unit 11.

The distributor 2 includes a fixed frame 23 fixed below the delivery unit 11, and a movable frame 22 arranged in parallel thereunder and on which the template 6 is detachably attached. The fixed frame 23 and the movable frame 22 are connected to each other at their four corners by four columns having flexibility and having the same length. Further, between the fixed frame 23 and the movable frame 22, flexible guide tubes 21, 21 ... Which guide and convey the chip-shaped circuit component are arranged.

Below the movable frame 22, the template 6 placed on the transport table 65 is inserted and fixed. The template 6 has a guide case 61 serving as an accommodating portion provided on a base board 60 in accordance with a mounting position of a chip-shaped circuit component on a circuit board. Then, when this template 6 is inserted directly below the distributor 2, the lower end of the guide tube 21 connected to the movable frame 22 is positioned above each guide case 61 of the template 6.

At this time, the vacuum case 4 is placed under the template 6, and the lower surface side of the template 6 is maintained at a negative pressure. The template 6 has through holes (not shown) at the bottom of each guide case 61. Therefore, air is drawn from the guide tube 21 to the back surface side of the template 6 through the through hole formed at the bottom of the case 61, and an air flow is formed. Due to this air flow, the chip-shaped circuit components released from the delivery portion 11 to the guide tube 21 are forcibly transported to the guide case 61 of the template 6.

The template 6 placed on the transport table 65 is moved by a moving mechanism 66 between a position directly below the distributor 2 and a position directly below the suction head 8. As shown in FIG. 2, sensor panels 32, 32 are provided upright on both sides of a carrying table 65 on which the template 6 is placed, and the sensor panels 22, 22 are provided with detection means for detecting chip-shaped circuit parts a such as photoelectric sensors. It is provided. That is, the light source 31 and the light receiver 33 are arranged so as to face each other on the guide case 61 of the template 6, and if the chip-shaped circuit component a blocks the space between them, the existence of the chip-shaped circuit component a is detected. To be done. When the chip-shaped circuit component a is detected in this way, for example, the operation of the mounting device is stopped, the circuit board in which the defective product is produced is recovered, and recovery such as removal of the chip-shaped circuit component a from the suction head 8 is performed. .

[0013]

[Effect of the device]

 As described above, according to the present invention, when the suction head again shifts to the operation of picking up the chip-shaped circuit component from the template while the chip-shaped circuit component is attached to the tip of the set nozzle of the suction head, the state is detected. Therefore, it is possible to obtain a chip-shaped circuit component mounting device capable of detecting a defective product on the circuit board and preventing a trouble such as damage of the chip-shaped circuit component.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a chip-shaped circuit component mounting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a chip-shaped circuit component mounting device according to the embodiment.

FIG. 3 is a cross-sectional view of essential parts showing a chip-shaped circuit component mounting device according to the embodiment.

FIG. 4 is a cross-sectional view of essential parts in a state where a chip-shaped circuit component is mounted on a circuit board by the chip-shaped circuit component mounting device.

[Explanation of symbols]

 1 Container 2 Distributor 6 Template 7 Conveyor 8 Suction Head 9 Circuit Board 31 Light Source 33 Light Receiver 66 Template Moving Mechanism

Claims (1)

[Reference number] 0030995-01 [Claims for utility model registration] 1. A plurality of containers (1), (1) ... In which a chip-shaped circuit component (a) is housed in a bulk form, and a chip-shaped housed in each container (1), (1). A distributor (2) that distributes and supplies the circuit component (a), a conveyor (7) that conveys the circuit board (9), and a space immediately below the distributor (2) and above the conveyor (7). Round trip, distributor (2)
Just below the template (6) in which a storage unit for receiving the chip-shaped circuit component (a) supplied from the distributor (2) is arranged at a predetermined position, and the template (6) moves up and down on the conveyor (7), (7) A chip-shaped circuit that is sucked when the template (6) is retracted from the conveyor (7) by sucking the circuit components stored in the storage portion of the template (6) that has been moved up. Suction head (8) having a set nozzle (81) for mounting the component (a) on the circuit board (9)
In the chip-shaped circuit component mounting device including the above, a detection means for detecting the presence or absence of the chip-shaped circuit component (a) at the tip of the set nozzle (81) of the suction head (8) is provided above the template (6). A chip-shaped circuit component mounting device characterized by the above.