JP2008103405A - Mounting machine, and component cleaning method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting machine capable of destaticizing components and removing dust, and to provide a component cleaning method of the mounting machine. <P>SOLUTION: The mounting machine comprises: a nozzle 42 picking up a component C supplied to a component supply section for packaging on a substrate; and a cleaning unit 2 cleaning the component C. In the mounting machine, the cleaning unit 2 comprises an air blowing means 22 for blowing air containing ions to the component C picked up by the nozzle 42, and an air suction means 23 sucking air around the component. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mounting machine for mounting electronic components on a board and a method for cleaning the components.

  2. Description of the Related Art Conventionally, as a mounting machine for mounting an electronic component on a substrate, an electronic component supplied to a component supply unit is sucked by a suction nozzle of a head, transferred to a substrate position, and mounted.

  Such a mounting machine may not be able to accurately perform the component suction operation by the suction nozzle or the mounting operation on the board due to the influence of static electricity charged on the component.

Therefore, in Patent Document 1, an ion air ejector that blows air containing ions (ion air) is provided in a moving path of an adsorption nozzle that adsorbs an electronic component, and ion air is supplied from the ejector to a component at the tip of the adsorption nozzle. To eliminate static electricity.
JP-A-2001-352196 (Claims 1, 2, 3 and 4)

  However, in the conventional mounting machine shown in Patent Document 1, it is possible to remove the charge of the component and reduce the component take-away and mounting position shift. However, if dust or the like adheres to the component, the dust or the like is removed. In some cases, the solder may be scattered on the substrate to which the cream solder is applied to cause a substrate defect.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting machine and a method for cleaning the parts that can reliably remove the dust adhering to the parts without scattering the parts while discharging the parts. .

  The present invention provides the following means.

[1] A mounting machine including a nozzle that picks up a component supplied to a component supply unit and mounts the component on a substrate, and a cleaning unit that cleans the component.
The cleaning unit is
Air blowing means for blowing air containing ions to the parts picked up by the nozzle;
An air suction means for sucking air around the component.

[2] A component photographing camera that images the state of the component picked up by the nozzle,
The mounting machine according to the preceding item 1, wherein the cleaning unit is disposed between the component supply unit and the component photographing camera.

  [3] The mounting machine according to [1] or [2], wherein the component supply unit is provided with a tray feeder having a tray in which a plurality of components are arranged.

  [4] The mounting machine according to any one of items 1 to 3, wherein the cleaning unit is detachably attached to the mounting machine body.

[5] A component cleaning method for a mounting machine that picks up a component supplied to a component supply unit with a nozzle and mounts it on a substrate,
A component cleaning method for a mounting machine, wherein air containing ions is blown to a component picked up by the nozzle while air around the component is sucked.

  [6] The component cleaning method for a mounting machine according to item 5, wherein air containing ions is simultaneously blown to the nozzle together with the component.

  According to the mounting machine according to the invention [1], it is possible to remove static electricity from a component and also reliably collect and remove dust adhering to the component.

  With the mounting machine according to the invention [2], the moving distance of the head that moves from the component supply unit to the camera position through the cleaning unit can be shortened.

  According to the mounting machine according to the invention [3], dust can be reliably collected and removed from the components supplied from the tray feeder.

  According to the mounting machine concerning the said invention [4], when a cleaning unit is unnecessary, it can remove.

  According to the invention [5], it is possible to provide a component cleaning method for a mounting machine having the same effect as the above.

  According to the component cleaning method for a mounting machine of the above invention [6], it is possible to remove static electricity and collect and remove dust from the nozzle simultaneously with the component.

  FIG. 1 is a plan view showing an example of a mounting machine according to the present invention. As shown in FIG. 1, the mounting machine 1 includes a conveyor 12 that is disposed on a base 11 and conveys a substrate W, component supply units 13 that are provided on both sides of the conveyor 12, and a base 11. And an electronic component mounting head unit 14 provided.

  The component supply unit 13 is provided on the upstream side and the downstream side of the conveyor 12 on the front side and the rear side, respectively. In this embodiment, a plurality of tape feeders 15 as component supply devices are attached to the front upstream side through a feeder plate 111, and component supply containers such as pallets are stacked on the front downstream side. A tray-type component supply device (tray feeder 16) that can be attached is disposed. Further, a plurality of tape feeders 15 are arranged on the rear side upstream portion and downstream portion via a feeder plate 111 in a state where they are arranged. The components supplied from these component supply units 13 can be picked up by the head unit 14.

  The tape feeder 15 is loaded with a tape storing small pieces of components such as ICs and transistors at predetermined intervals, and the tapes are intermittently fed to sequentially supply the components stored on the tape. It is like that.

  The tray feeder 16 includes a magazine 163 in which a plurality of pallets 162 are stacked, and a component tray that stores (stores) electronic components is placed on each pallet 162. When each pallet 162 is pulled out from the magazine 163 and placed in the component supply unit 13, the components in the tray on the pallet 162 are appropriately picked up by each head 41 of the head unit 14.

  In the present embodiment, a waffle tray type tray feeder is used in which a relatively small tray (waffle tray) is set on a pallet (tray stock portion) 162 via an adapter plate (not shown). .

  In addition, on the front side and the rear side, component photographing cameras 17 and 17 are provided between the component supply unit 13 divided into the upstream side and the downstream side. The component photographing cameras 17 and 17 image the state of the component sucked by the head unit 14 and detect a positional deviation of the component.

  Further, a cleaning unit 2 described later in detail is provided between the tray feeder 16 and the component photographing camera 17 on the front side.

  The head unit 14 is movable in a region extending between the component supply unit 13 and the mounting position on the substrate W so that components can be picked up from the component supply unit 13 and mounted on the substrate W. Specifically, the head unit 14 is supported by a head unit support member 142 extending in the X-axis direction (the substrate transport direction of the conveyor 12) so as to be movable in the X-axis direction. The head unit support member 142 is supported at both ends thereof by guide rails 143 and 143 extending in the Y-axis direction (a direction perpendicular to the X-axis direction in a horizontal plane) so as to be movable in the Y-axis direction. The head unit 14 is driven in the X axis direction by the X axis motor 144 via the ball screw shaft 145, and the head unit support member 142 is driven in the Y axis direction by the Y axis motor 146 via the ball screw shaft 147. Movement is to be performed.

  In addition, a plurality of heads 41 are mounted on the head unit 14 side by side in the X-axis direction. Each head 41 is driven in the vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis motor as a drive source, and is rotated around the Z-axis (R-axis) by a rotation drive mechanism using an R-axis motor as a drive source. Direction).

  Each head 41 is provided with a suction nozzle 42 (see FIGS. 2 and 3) for sucking and mounting electronic components on the substrate. Each suction nozzle 42 is supplied with a negative pressure from a negative pressure means (not shown) at the time of supplying the component, and can suck the electronic component C with a suction force by the negative pressure.

  Further, as shown in FIG. 1, the head unit 14 is provided with a board photographing camera 18 composed of, for example, a CCD camera equipped with illumination. The board photographing camera 18 can photograph a position reference mark and a board ID mark provided on the board W carried into the mounting machine 1.

  As shown in FIGS. 2 to 4, the cleaning unit 2 includes a casing 21, an air blow means 22 for blowing air (ion air, ionized gas) containing ions to the part C, and air suction for sucking air and dust around the part. Means 23.

  The casing 21 is formed in a substantially L shape in a side view provided with a vertical portion and a horizontal portion. At the upper end of the vertical portion of the casing 21, a component cleaning unit 213 whose upper side is opened is provided, and the component C can be inserted and disposed in the component cleaning unit 213 from above.

  The air blowing means 22 includes an air blow type ionizer (static discharger) 221 provided outside the casing 21 and a plurality of air blowing means 22 disposed below the component cleaning unit 213 in the casing 21 with the discharge port facing upward. The air blow nozzle 222 and an air blow tube 223 for connecting the ionizer 221 and each air blow nozzle 222 in communication are provided. And the ion air discharge | released from the ionizer 221 is each discharged upward from each air blow nozzle 222 via the air blow tube 223.

  The plurality of air blow nozzles 222 are provided side by side in the X-axis direction corresponding to the parallel direction (X-axis direction) of the plurality of suction nozzles 42 provided in the head unit 14. Accordingly, ion air can be simultaneously blown from the blow nozzle 222 to all the parts C sucked by the plurality of suction nozzles 42 of the head unit 14.

  The air suction means 23 is configured to apply a negative pressure to the air suction tube 231 connected to the end of the horizontal portion of the casing 21, a dust collector 232 interposed in the middle of the air suction tube 231, and the air suction tube 231. A suction pump to be supplied (not shown). When a negative pressure is supplied into the air suction tube 231 by driving the suction pump, air in the entire area of the casing 21 is sucked into the air suction tube 231 from the periphery of the component cleaning unit 213 in the casing 21, and the dust collector 232. It is supposed to be discharged through.

  As shown in FIG. 4, the cleaning unit 2 having the above configuration is detachably attached to a feeder plate 111 for attaching a feeder provided on the base 11 of the mounting machine 1 by an attaching / detaching mechanism 24. That is, the clamp plate 242 is provided on the lower surface of the casing 21 via the support plate 241. A movable clamp claw 243 and a clamp lever 244 are swingably attached to the clamp plate 242. The movable clamp claw 243 is urged in the closing direction by the urging means. By operating the clamp lever 244, the movable clamp claw 243 moves in the opening direction against the urging force of the urging means. It has become. When the clamp claw 243 is opened by lever operation and the clamp plate 242 is installed on the feeder plate 111 on the mounting machine side and the lever operation is released, the clamp claw 243 is closed, and the clamp plate 242 and the clamp claw 243 The feeder plate 111 is clamped, and the cleaning unit 2 is fixed to the feeder plate 111. When the clamp pawl 243 is opened by lever operation in this fixed state, the fixing to the feeder plate 111 is released, and the entire cleaning unit 2 can be removed from the component supply unit 13 (mounting machine main body) of the mounting machine 1. It has become.

  In this embodiment, as shown in FIG. 1, the cleaning unit 2 is fixed to the component supply unit 13 so that the component cleaning unit 213 of the casing 21 is disposed between the component supply unit 13 and the component photographing camera 17. ing.

  FIG. 5 is a block diagram showing a control system of the mounting machine 1. As shown in the figure, the mounting machine 1 includes a control device 6 composed of a personal computer or the like, and various operations of the mounting machine 1 are controlled by the control device 6, and operations detailed later are automatically performed. Is to be executed.

  The control device 6 includes an arithmetic processing unit 60, a mounting program storage unit 63, a conveyance system data storage unit 64, a motor control unit 65, an external input / output unit 66 and an image processing unit 67.

  The arithmetic processing unit 60 comprehensively manages various operations of the mounting machine 1.

  The mounting program storage unit 63 stores a production program (mounting program) for mounting each electronic component on the substrate W. This production program includes a mark indicating the mounting position (coordinates) and orientation of each electronic component based on the circuit pattern of the substrate W, shape data for recognizing each electronic component, a feeder to which each electronic component is supplied, etc. The position (coordinates) is included. The mounting program storage unit 63 also includes a program for executing a component cleaning process described later, for example, an operation execution program for the air blow unit and the air suction unit.

  The transfer system data storage means 64 stores various data related to the transfer of the substrate W on the production line.

  The motor control unit 65 controls the operation of the drive motors and the like of the XYZR axes of the head unit 14, the head 41, and the suction nozzle 42. Further, the motor control unit 65 controls the tray (pallet) drawing operation (exchange operation) in the tray feeder 16.

  The external input / output unit 66 inputs / outputs various information to / from various sensors and stoppers provided in the mounting machine 1. Further, the external input / output unit 66 inputs / outputs various information to / from the drive unit of the ionizer and the suction pump in the cleaning unit 2.

  The image processing unit 67 processes image data captured by the component photographing camera 17 and the board photographing camera 18.

  The control device 6 is connected to a display unit 62 such as a CRT display or a liquid crystal display for displaying various information. Furthermore, an input unit (not shown) such as a keyboard and a mouse for inputting various information is connected to the control device 6.

  In the mounting machine 1 configured as described above, the control device 6 operates in response to the operation start command input to the control device 6, and the control device 6 controls the driving of each drive unit, so that the following operations are automatically performed. To be done.

  First, as shown in FIG. 6, an unmounted board P is carried into the mounting machine 1 and is transported to a predetermined mounting position by the conveyor 12 and fixed (step S1).

  Thereafter, electronic components are mounted on the substrate W. That is, the head unit 14 moves to the position of the component supply unit 13, for example, the pallet drawing position of the tray feeder 16, and a predetermined electronic component is sucked by the predetermined suction nozzle 42 (step S2).

  Next, the head unit 14 moves to a position corresponding to the component cleaning unit 213 of the cleaning unit 2 (step S3), and then the head 41 is lowered (step S4). As a result, as shown in FIGS. 2 and 3, the component C sucked by the suction nozzle 42 of each head 41 is disposed in the vicinity of the upper part of the air blow nozzle 222 in the component cleaning unit 213 of the cleaning unit 2.

  Thereafter, a component cleaning process is performed (step S5). That is, the ionizer 221 of the air blow means 22 and the suction pump of the suction means 23 in the cleaning unit 2 are driven for a predetermined time. As a result, the ion air discharged from the ionizer 221 is discharged upward from the air blow nozzle 222 through the air blow tube 223, and the ion air is blown onto the component C to remove the static electricity charged on the component C. The Further, the dust D adhering to the part C is separated from the part C by the blowing of ion air. At this time, since the part C has been neutralized, the dust D that strongly adheres due to the action of static electricity can also be reliably separated from the part C.

  In the present embodiment, since ion air is also blown to the suction nozzle 42, the static electricity is removed from the suction nozzle 42 and the dust D is separated at the same time.

  While the ion air is blown, the air suction means 23 sucks the inside of the casing 21 through the air suction tube 231, and the air in the entire area of the casing 21 is sucked into the air suction tube 231 together with the dust D from the periphery of the part C. The Further, only the dust D is separated and removed from the air by the dust collector 232, and the air is discharged from the dust collector 232. In this way, the dust D is removed from the component C and the suction nozzle 42 and collected in the dust collector 232.

  When the cleaning of the part C is completed, the head 41 is raised (step S6), and the part C sucked by the suction nozzle 42 is arranged at a predetermined height position.

  Thereafter, the head unit 14 passes over the component photographing camera 17, and during that time, the state of each component C attracted to the head unit 14 is captured and recognized by the component photographing camera 17 (step S 7), and the position of the component The degree of deviation is detected.

  Next, the head unit 14 moves to the position of the substrate W, and the sucked component is mounted at a predetermined position on the substrate W (step S8).

  Thereafter, until all the components are mounted on the substrate W (NO in step S9), the component suction processing (step S2), the component cleaning processing (steps S3 to S6), the component recognition processing (step S7), and the component The mounting process (step S8) is repeated.

  When all the components are mounted on the substrate W (YES in step S9), the substrate W is unloaded and the mounting process for one substrate W is completed.

  As described above, according to the mounting machine 1 of the present embodiment, the ion air is blown in the cleaning unit 2 before the component sucked by the suction nozzle 42 in the component supply unit 13 is mounted on the substrate W. Static electricity can be removed. For this reason, when the component is mounted on the substrate W, it is possible to reliably prevent the component from being displaced with respect to the substrate W.

  That is, when a component is sucked by the suction nozzle 42 in the component supply unit 13, the nozzle 42 and the component may rub against each other and the component and the nozzle 42 may be charged with static electricity. When the component 42 is moved to the substrate W, the suction by the suction nozzle 42 is released and the component is to be mounted on the substrate W, the component is not smoothly detached from the nozzle 42 by the electrostatic adsorption action, and the component is moved to the desired position. May not be mounted, and there is a risk of displacement.

  On the other hand, in the present embodiment, after the static electricity of the component is surely removed, the suction of the suction nozzle 42 is released and the component is mounted on the substrate W. Therefore, the component can be mounted at a desired position with high accuracy, and the displacement of the component can be reliably prevented.

  Further, in the present embodiment, since the cleaning unit 2 blows ion air to the suction nozzle 42, the static electricity charged to the suction nozzle 42 can be reliably removed. Adverse effects can be prevented, and components can be mounted on the substrate W with high positional accuracy.

  In the present embodiment, air around the part to be blown by air is sucked by the air suction means 23, so that dust separated from the part by air blow can be sucked and collected by the dust collector 232. Accordingly, it is possible to reliably prevent problems such as dust floating and to keep the surrounding environment highly purified. For this reason, for example, it is possible to reliably prevent problems such as floating dust adhering to the substrate W or mounting components with dust adhering to the substrate W to deteriorate the quality of the production substrate W. Quality can be improved.

  Furthermore, in the present embodiment, since the component cleaning unit 213 of the cleaning unit 2 is disposed between the component supply unit 13 where the tray feeder 16 is disposed and the component photographing camera 17, the cleaning is performed from the component supply unit 13. The moving distance of the head unit 14 that moves to the camera position through the unit 2 can be shortened, and the moving time between them can be shortened. Therefore, the mounting time of each component can be shortened and the production efficiency can be improved.

  In the present embodiment, the cleaning unit 2 is arranged between the tray feeder 16 and the component photographing camera 17, but the present invention is not limited to this, and a component feeder such as a tape feeder and a component photographing camera are used. A cleaning unit may be arranged between them. Also in this case, since the moving distance of the head unit 14 that moves from the component supply device such as a tape feeder to the camera position through the cleaning unit 2 can be shortened, similar effects can be obtained as described above. .

  Moreover, in this embodiment, since the component feeder 13 is equipped with the tray feeder 16, dust can be removed more effectively. That is, since the tray feeder 16 arranges the components on the tray, unlike the tape feeder 15 where the components are covered with the cover tape, the time during which the components are exposed to the outside air becomes longer. For this reason, the parts supplied from the tray feeder 16 are more likely to be attached with dust than the parts supplied from the tape feeder 15, and the mounting machine equipped with the tray feeder 16 has an adverse effect due to dust. Is likely to occur.

  In this embodiment, even with the mounting machine 1 equipped with the tray feeder 16 having a large adverse effect due to dust, dust can be reliably removed from the component by the cleaning process described above. That is, by mounting the above-described cleaning unit 2 on the mounting machine 1 with a tray feeder as in this embodiment, dust can be more effectively removed, and for example, the quality of the production substrate can be further improved.

  In the mounting machine of the present invention, it is not always necessary to equip the tray feeder, and only the tape feeder may be equipped.

  In this embodiment, since the cleaning unit 2 is detachably attached to the component supply unit 13 (mounting machine body), the cleaning unit 2 is removed and removed when the cleaning unit 2 is unnecessary. Other devices such as a tray feeder can be arranged at the position, and versatility can be improved.

  7 and 8 are views showing a cleaning unit 3 of a modified example applicable to the present invention. As shown in both drawings, the cleaning unit 3 includes a casing 31, an air blow means 32, and an air suction means 33.

  The casing 31 is provided with a component cleaning part 313 at its upper end. The parts cleaning unit 313 is opened at the top, and both sides in the X-axis direction are opened to provide side openings 314 and 314, respectively. The component C sucked by the suction nozzle 42 can enter the component cleaning unit 313 through the one side opening 314, and the component C in the component cleaning unit 313 passes through the other side opening 314. It is possible to leave outside.

  The air blow means 32 is provided on the air blow type ionizer 321 provided outside the casing 31 and the upper front wall portion of the casing 31, and the discharge port faces rearward (horizontal direction) toward the component cleaning section 313. A plurality of arranged air blow nozzles 322 and an air blow tube 323 for connecting the ionizer 321 and the air blow nozzles 322 to each other are provided. And the ion air discharge | released from the ionizer 321 is each discharged ahead from each air blow nozzle 322 through the air blow tube 323, respectively.

  In addition, the several blow nozzle 322 is arrange | positioned along with the X-axis direction similarly to the above.

  The air suction means 33 includes an air suction tube 331 connected to the lower end of the casing 31, a dust collector 332 interposed in the middle of the air suction tube 331, and a suction that supplies negative pressure into the air suction tube 331. A pump (not shown). When a negative pressure is supplied into the air inducing tube 331 by driving the suction pump, air in the entire area of the casing 31 is sucked into the air suction tube 331 from the periphery of the component cleaning unit 313 in the casing 31, and the dust collector 332. It is supposed to be discharged through.

  In the cleaning unit 3, the component cleaning unit 313 is disposed between the component supply unit 13 and the component photographing camera 17 in the mounting machine, as in the above embodiment.

  In the mounting machine equipped with the cleaning unit 3, after the head unit 14 sucks the component C in the component supply unit 13, the head unit 14 moves to the side of the component cleaning unit 313 in the cleaning unit 3 (one in the X-axis direction). To the side).

  Subsequently, the head unit 14 moves toward the component cleaning unit 313 along the X-axis direction, and the component C sucked by the suction nozzle 42 enters the component cleaning unit 313 through one side opening 314. After that, it passes through the component cleaning part 313 along the X-axis direction, and exits to the outside of the casing through the other side opening 314. Then, the component cleaning process is performed while the component C is moving in the X-axis direction within the component cleaning unit 313. That is, during the movement of the part C, the air blow means 32 and the air suction means 33 in the cleaning unit 3 are driven for a predetermined time. Thereby, ion air is discharged from the air blow nozzle 322 and blown to each component C and each suction nozzle 42 to remove static electricity charged in the component C and suction nozzle 42, and to the component C and suction nozzle 42. The attached dust D is separated. On the other hand, dust D is sucked into the air suction tube 331 together with air from the periphery of the component C, and the dust D is separated and removed by the dust collector 332.

  After the component C is thus cleaned, the head unit 14 moves to the substrate position and the component C is mounted on the substrate, as in the above embodiment.

  Also in the mounting machine of this modification, the same operational effects can be obtained as described above. Furthermore, in this modified example, since the component C and the suction nozzle 42 are cleaned by blowing ion air while the component C passes through the component cleaning unit 313, the head unit 14 is not stopped. The cleaning process can be performed while being moved. Accordingly, the movement of the head unit 14 during the cleaning process can be performed smoothly and stably, and the production efficiency can be further improved.

  However, in the cleaning unit 3 of the type that discharges ion air in the horizontal direction as in this modification, the component (head) is inserted into the component cleaning unit 313 from above and stopped as in the above embodiment. You may make it clean with.

  In the above embodiment, the case where one cleaning unit is provided has been described as an example. However, the present invention is not limited to this, and a plurality of cleaning units may be provided in the present invention. In this case, the air blowing means and the air suction means may be shared, and a plurality of casing cleaning parts may be provided.

  Needless to say, the number of heads and nozzles provided in the head unit in the present invention is not limited, and may be one or plural.

It is a top view which shows the mounting machine concerning one Embodiment of this invention. It is a schematic sectional side view which shows the cleaning unit with which the mounting machine of embodiment was equipped. It is a schematic front sectional drawing which shows the cleaning unit with which the mounting machine of embodiment was equipped. It is a side view which shows the cleaning unit with which the mounting machine of embodiment was equipped. It is a block diagram which shows the control system of the mounting machine of embodiment. It is a flowchart for demonstrating operation | movement in the mounting machine of embodiment. It is a schematic sectional side view which shows the cleaning unit of the modification applicable to the mounting machine of this invention. It is a schematic front sectional drawing which shows the cleaning unit of a modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting machine 2, 3 Cleaning unit 13 Component supply part 16 Tray feeder 17 Component imaging | photography camera 22, 32 Air blow means 23, 33 Air suction means 42 Adsorption nozzle C Component W Board | substrate

Claims (6)

A mounting machine comprising a nozzle that picks up a component to be supplied to a component supply unit and mounts it on a substrate, and a cleaning unit that cleans the component,
The cleaning unit is
Air blowing means for blowing air containing ions to the parts picked up by the nozzle;
An air suction means for sucking air around the component. A component photographing camera that images the state of the component picked up by the nozzle,
The mounting machine according to claim 1, wherein the cleaning unit is disposed between the component supply unit and the component photographing camera.   The mounting machine according to claim 1, wherein the component feeder is provided with a tray feeder having a tray in which a plurality of components are arranged.   The mounting device according to claim 1, wherein the cleaning unit is detachably attached to the mounting device main body. A component cleaning method for a mounting machine that picks up a component supplied to a component supply unit with a nozzle and mounts it on a substrate,
A component cleaning method for a mounting machine, wherein air containing ions is blown to a component picked up by the nozzle while air around the component is sucked.   The component cleaning method for a mounting machine according to claim 5, wherein air including ions is simultaneously blown to the nozzle together with the component.

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