JPH0429567Y2 - - Google Patents

Info

Publication number

JPH0429567Y2

JPH0429567Y2 JP12015386U JP12015386U JPH0429567Y2 JP H0429567 Y2 JPH0429567 Y2 JP H0429567Y2 JP 12015386 U JP12015386 U JP 12015386U JP 12015386 U JP12015386 U JP 12015386U JP H0429567 Y2 JPH0429567 Y2 JP H0429567Y2

Authority

JP

Japan

Prior art keywords

heat sink

piece

circuit board

printed circuit

protruding piece

Prior art date

1986-08-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 229910052751 metal Inorganic materials 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 5
• 238000004080 punching Methods 0.000 claims 1
• 238000004519 manufacturing process Methods 0.000 description 7
• 229910052782 aluminium Inorganic materials 0.000 description 3
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 229910001369 Brass Inorganic materials 0.000 description 2
• 239000010951 brass Substances 0.000 description 2
• 230000000149 penetrating effect Effects 0.000 description 2
• 230000000630 rising effect Effects 0.000 description 2
• 229910000906 Bronze Inorganic materials 0.000 description 1
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
• 239000010974 bronze Substances 0.000 description 1
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
• 238000002788 crimping Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1