JPH0427172Y2 - - Google Patents
Info
- Publication number
- JPH0427172Y2 JPH0427172Y2 JP14560086U JP14560086U JPH0427172Y2 JP H0427172 Y2 JPH0427172 Y2 JP H0427172Y2 JP 14560086 U JP14560086 U JP 14560086U JP 14560086 U JP14560086 U JP 14560086U JP H0427172 Y2 JPH0427172 Y2 JP H0427172Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- plug
- semiconductor device
- semiconductor element
- lead pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14560086U JPH0427172Y2 (US20080094685A1-20080424-C00004.png) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14560086U JPH0427172Y2 (US20080094685A1-20080424-C00004.png) | 1986-09-22 | 1986-09-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6351459U JPS6351459U (US20080094685A1-20080424-C00004.png) | 1988-04-07 |
| JPH0427172Y2 true JPH0427172Y2 (US20080094685A1-20080424-C00004.png) | 1992-06-30 |
Family
ID=31057291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14560086U Expired JPH0427172Y2 (US20080094685A1-20080424-C00004.png) | 1986-09-22 | 1986-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427172Y2 (US20080094685A1-20080424-C00004.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2892687B2 (ja) * | 1989-06-14 | 1999-05-17 | 株式会社日立製作所 | 半導体素子用パツケージ |
-
1986
- 1986-09-22 JP JP14560086U patent/JPH0427172Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6351459U (US20080094685A1-20080424-C00004.png) | 1988-04-07 |
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