JPH0426560B2 - - Google Patents

Info

Publication number
JPH0426560B2
JPH0426560B2 JP60102632A JP10263285A JPH0426560B2 JP H0426560 B2 JPH0426560 B2 JP H0426560B2 JP 60102632 A JP60102632 A JP 60102632A JP 10263285 A JP10263285 A JP 10263285A JP H0426560 B2 JPH0426560 B2 JP H0426560B2
Authority
JP
Japan
Prior art keywords
adhesive layer
ceramic
fine particles
ceramic substrate
inorganic fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60102632A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61263189A (ja
Inventor
Akira Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP10263285A priority Critical patent/JPS61263189A/ja
Priority to US06/860,886 priority patent/US4752499A/en
Publication of JPS61263189A publication Critical patent/JPS61263189A/ja
Priority to US07/357,693 priority patent/US5021472A/en
Publication of JPH0426560B2 publication Critical patent/JPH0426560B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10263285A 1985-05-16 1985-05-16 セラミツク配線基板の製造方法 Granted JPS61263189A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP10263285A JPS61263189A (ja) 1985-05-16 1985-05-16 セラミツク配線基板の製造方法
US06/860,886 US4752499A (en) 1985-05-16 1986-05-08 Adhesive for electroless plating and method of preparation of circuit board using this adhesive
US07/357,693 US5021472A (en) 1985-05-16 1989-05-25 Adhesive for electroless plating and method of preparation of circuit board using this adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10263285A JPS61263189A (ja) 1985-05-16 1985-05-16 セラミツク配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS61263189A JPS61263189A (ja) 1986-11-21
JPH0426560B2 true JPH0426560B2 (enrdf_load_html_response) 1992-05-07

Family

ID=14332612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10263285A Granted JPS61263189A (ja) 1985-05-16 1985-05-16 セラミツク配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61263189A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1056785A (ja) * 1996-08-08 1998-02-24 Seiko Epson Corp 発電装置および携帯電子機器

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136071A (en) * 1991-12-16 1992-08-04 Dow Corning Corporation Sodium borohydride as activator for phenylborane catalyzed disproportionation of arylsilanes
JP4749144B2 (ja) * 2005-12-22 2011-08-17 富士通株式会社 めっき膜下地樹脂層の形成方法、めっき方法及び半導体装置の製造方法
JP5354873B2 (ja) * 2007-05-30 2013-11-27 富士フイルム株式会社 導電性膜及び導電性膜の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60167492A (ja) * 1984-02-10 1985-08-30 三菱電機株式会社 樹脂への導体層形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1056785A (ja) * 1996-08-08 1998-02-24 Seiko Epson Corp 発電装置および携帯電子機器

Also Published As

Publication number Publication date
JPS61263189A (ja) 1986-11-21

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