JPH0425715B2 - - Google Patents
Info
- Publication number
- JPH0425715B2 JPH0425715B2 JP57153896A JP15389682A JPH0425715B2 JP H0425715 B2 JPH0425715 B2 JP H0425715B2 JP 57153896 A JP57153896 A JP 57153896A JP 15389682 A JP15389682 A JP 15389682A JP H0425715 B2 JPH0425715 B2 JP H0425715B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- wiring
- chromium
- zirconium
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Conductive Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57153896A JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57153896A JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5943570A JPS5943570A (ja) | 1984-03-10 |
JPH0425715B2 true JPH0425715B2 (enrdf_load_stackoverflow) | 1992-05-01 |
Family
ID=15572474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57153896A Granted JPS5943570A (ja) | 1982-09-06 | 1982-09-06 | 薄膜配線 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5943570A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2511289B2 (ja) * | 1988-03-30 | 1996-06-26 | 株式会社日立製作所 | 半導体装置 |
JPH0262035A (ja) * | 1988-08-29 | 1990-03-01 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
US5243222A (en) * | 1991-04-05 | 1993-09-07 | International Business Machines Corporation | Copper alloy metallurgies for VLSI interconnection structures |
JP4423379B2 (ja) | 2008-03-25 | 2010-03-03 | 合同会社先端配線材料研究所 | 銅配線、半導体装置および銅配線の形成方法 |
-
1982
- 1982-09-06 JP JP57153896A patent/JPS5943570A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5943570A (ja) | 1984-03-10 |
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