JPH0424785Y2 - - Google Patents
Info
- Publication number
- JPH0424785Y2 JPH0424785Y2 JP17890584U JP17890584U JPH0424785Y2 JP H0424785 Y2 JPH0424785 Y2 JP H0424785Y2 JP 17890584 U JP17890584 U JP 17890584U JP 17890584 U JP17890584 U JP 17890584U JP H0424785 Y2 JPH0424785 Y2 JP H0424785Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- circuit board
- armature coil
- lead wire
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000011889 copper foil Substances 0.000 claims description 29
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Brushless Motors (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Motor Or Generator Frames (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17890584U JPH0424785Y2 (US06272168-20010807-M00014.png) | 1984-11-26 | 1984-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17890584U JPH0424785Y2 (US06272168-20010807-M00014.png) | 1984-11-26 | 1984-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6196776U JPS6196776U (US06272168-20010807-M00014.png) | 1986-06-21 |
| JPH0424785Y2 true JPH0424785Y2 (US06272168-20010807-M00014.png) | 1992-06-11 |
Family
ID=30736472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17890584U Expired JPH0424785Y2 (US06272168-20010807-M00014.png) | 1984-11-26 | 1984-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0424785Y2 (US06272168-20010807-M00014.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006083760A (ja) * | 2004-09-16 | 2006-03-30 | Aisan Ind Co Ltd | 電子制御装置と電動ポンプ |
| JP6988454B2 (ja) * | 2017-12-22 | 2022-01-05 | 株式会社デンソー | 電子装置、及び電子装置を備えたモータ装置 |
-
1984
- 1984-11-26 JP JP17890584U patent/JPH0424785Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6196776U (US06272168-20010807-M00014.png) | 1986-06-21 |
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