JPH04245484A - 圧力センサ - Google Patents

圧力センサ

Info

Publication number
JPH04245484A
JPH04245484A JP22559891A JP22559891A JPH04245484A JP H04245484 A JPH04245484 A JP H04245484A JP 22559891 A JP22559891 A JP 22559891A JP 22559891 A JP22559891 A JP 22559891A JP H04245484 A JPH04245484 A JP H04245484A
Authority
JP
Japan
Prior art keywords
cavity
sensor
silicon
pressure sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22559891A
Other languages
English (en)
Japanese (ja)
Inventor
Jiri Marek
イーリィ マレク
Dieter Seipler
ザイプラー ディーター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPH04245484A publication Critical patent/JPH04245484A/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007Fluidic connecting means
    • G01L19/0038Fluidic connecting means being part of the housing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
JP22559891A 1990-09-07 1991-09-05 圧力センサ Pending JPH04245484A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19904028402 DE4028402A1 (de) 1990-09-07 1990-09-07 Drucksensor
DE4028402.6 1990-09-07

Publications (1)

Publication Number Publication Date
JPH04245484A true JPH04245484A (ja) 1992-09-02

Family

ID=6413792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22559891A Pending JPH04245484A (ja) 1990-09-07 1991-09-05 圧力センサ

Country Status (3)

Country Link
JP (1) JPH04245484A (de)
DE (1) DE4028402A1 (de)
GB (1) GB2247953A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10043630A1 (de) * 2000-09-01 2002-03-14 Endress Hauser Gmbh Co Druckmeßzelle
EP1470405A1 (de) * 2002-01-30 2004-10-27 Honeywell International Inc. Mikromechanischer silizium-absolutdrucksensor mit rückseitiger hermetischer kappe und herstellungverfahren hierfür
DE102004058877A1 (de) * 2004-12-06 2006-04-13 Infineon Technologies Ag Halbleiterchip und Verfahren zum Herstellen eines doppelseitig funktionellen Halbleiterchips
CN101715600B (zh) 2007-05-29 2013-02-06 诺格伦有限责任公司 具有集成隔膜和开关的压力开关
CN102967394A (zh) * 2012-09-15 2013-03-13 华东光电集成器件研究所 对称电容式压力传感器及其制备方法
WO2021112269A1 (ko) * 2019-12-02 2021-06-10 (주)에어박스 에어 센서

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI74350C (fi) * 1984-02-21 1988-01-11 Vaisala Oy Kapacitiv absoluttryckgivare.
FI84401C (fi) * 1987-05-08 1991-11-25 Vaisala Oy Kapacitiv tryckgivarkonstruktion.
EP0339981A3 (de) * 1988-04-29 1991-10-09 Schlumberger Industries, Inc. Geschichteter Halbleitersensor mit Überdruckschutz

Also Published As

Publication number Publication date
GB9117531D0 (en) 1991-10-02
GB2247953A (en) 1992-03-18
DE4028402A1 (de) 1992-03-12

Similar Documents

Publication Publication Date Title
US5433110A (en) Detector having selectable multiple axes of sensitivity
US5284057A (en) Microaccelerometer having low stress bonds and means for preventing excessive Z-axis deflection
CA2116382C (en) Micromechanical accelerometer and method for the production thereof
US4614119A (en) Resonant hollow beam and method
US20020157473A1 (en) Resonant sensor and method of making a pressure sensor comprising a resonant beam structure
US20030138986A1 (en) Microelectronic mechanical system and methods
JPH11502614A (ja) 単結晶材料における角速度を測定するための装置
JPH09503344A (ja) マイクロメカニカルデバイス及びその製造方法
KR100574575B1 (ko) 마이크로메카니컬 컴포넌트 및 컴포넌트 제조 방법
CA2081306A1 (en) Semiconductor film bolometer thermal infrared detector
Allen et al. Integrated micro-electro-mechanical sensor development for inertial applications
JPH04245484A (ja) 圧力センサ
US6541833B2 (en) Micromechanical component with sealed membrane openings and method of fabricating a micromechanical component
JP2006177823A (ja) 加速度センサ
JPH04269628A (ja) 流動媒体の速度及び流量を測定するためのセンサー、及びその製造方法
US6207470B1 (en) Method for manufacturing a pressure-measuring device equipped with a resonating element
Mirza Wafer-level packaging technology for MEMS
JPS5839069A (ja) 半導体ダイヤフラム
JP3690056B2 (ja) 半導体圧力センサのセンサチップの製造方法
JPH0797643B2 (ja) 圧力変換装置の製造方法
Goericke et al. Experimentally validated aluminum nitride based pressure, temperature and 3-axis acceleration sensors integrated on a single chip
JP3420847B2 (ja) 熱依存性検出装置及びその製造方法
JP2859831B2 (ja) フローセンサ、その製造方法および駆動方法
JP3552963B2 (ja) 圧力センサ
JPH07318445A (ja) 静電容量型圧力センサとその製造方法