JPH0423808B2 - - Google Patents
Info
- Publication number
- JPH0423808B2 JPH0423808B2 JP57083475A JP8347582A JPH0423808B2 JP H0423808 B2 JPH0423808 B2 JP H0423808B2 JP 57083475 A JP57083475 A JP 57083475A JP 8347582 A JP8347582 A JP 8347582A JP H0423808 B2 JPH0423808 B2 JP H0423808B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- raw
- raw sheet
- green sheets
- punched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000002788 crimping Methods 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 239000005416 organic matter Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 12
- 238000007639 printing Methods 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 239000003985 ceramic capacitor Substances 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000012212 insulator Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000005266 casting Methods 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000007569 slipcasting Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 resistors Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57083475A JPS58200521A (ja) | 1982-05-18 | 1982-05-18 | 積層電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57083475A JPS58200521A (ja) | 1982-05-18 | 1982-05-18 | 積層電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58200521A JPS58200521A (ja) | 1983-11-22 |
| JPH0423808B2 true JPH0423808B2 (enrdf_load_stackoverflow) | 1992-04-23 |
Family
ID=13803486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57083475A Granted JPS58200521A (ja) | 1982-05-18 | 1982-05-18 | 積層電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58200521A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61294807A (ja) * | 1985-06-24 | 1986-12-25 | 東北金属工業株式会社 | 内部電極を有する電子部品の製造方法 |
| JP3166611B2 (ja) * | 1996-04-19 | 2001-05-14 | 富士ゼロックス株式会社 | プリント配線板及びその製造方法 |
-
1982
- 1982-05-18 JP JP57083475A patent/JPS58200521A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58200521A (ja) | 1983-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1061569B1 (en) | Method for manufacturing ceramic substrate and non-fired ceramic substrate | |
| JP2001185437A (ja) | 積層セラミックコンデンサ | |
| JP2002015939A (ja) | 積層型電子部品およびその製法 | |
| JPH0632378B2 (ja) | 電子部品内蔵多層セラミック基板 | |
| US20020026978A1 (en) | Multilayer ceramic substrate and manufacturing method therefor | |
| JPH07122455A (ja) | セラミック積層電子部品の製造方法 | |
| JPH0423808B2 (enrdf_load_stackoverflow) | ||
| JPS6235257B2 (enrdf_load_stackoverflow) | ||
| JPH10144504A (ja) | チップ型サーミスタ及びその製造方法 | |
| JPH03280412A (ja) | コンデンサネットワーク構造体及びその製造方法 | |
| JP4063549B2 (ja) | 巻線型電子部品の製造方法 | |
| KR100922943B1 (ko) | 적층 세라믹 전자 부품의 제조 방법 | |
| EP0132615B1 (en) | Method of making a matrix print head | |
| JP2993247B2 (ja) | 積層セラミックコンデンサの製造方法 | |
| JP4023133B2 (ja) | 積層セラミックコンデンサおよびその容量調整方法 | |
| JPS6028113Y2 (ja) | トリミングが可能な複合部品 | |
| JPS60134495A (ja) | 電気回路素子の製造方法 | |
| JP2889293B2 (ja) | 焼結板、その製造方法及び製造装置 | |
| JP2860720B2 (ja) | 多層配線基板の製造方法 | |
| JPS6089995A (ja) | 複合積層セラミツク部品 | |
| JPS63265413A (ja) | 積層セラミツクコンデンサの製造方法 | |
| JPS6050046B2 (ja) | 複合部品のトリミング方法 | |
| JPH03191596A (ja) | コンデンサ内蔵多層セラミック基板の製造方法 | |
| JP3067496B2 (ja) | セラミックグリーンシート積層体の圧着成形方法 | |
| JPH06168840A (ja) | セラミックスの製造方法 |