JPH0423146U - - Google Patents
Info
- Publication number
- JPH0423146U JPH0423146U JP1990064360U JP6436090U JPH0423146U JP H0423146 U JPH0423146 U JP H0423146U JP 1990064360 U JP1990064360 U JP 1990064360U JP 6436090 U JP6436090 U JP 6436090U JP H0423146 U JPH0423146 U JP H0423146U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting part
- base
- package
- tantalum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007743 anodising Methods 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910001936 tantalum oxide Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Packaging Frangible Articles (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第1図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第2図は従来の
半導体素子収納用パツケージの断面図である。 1……基体、1a……半導体素子載置部、2…
…絶縁枠体、4……容量素子。
ケージの一実施例を示す断面図、第2図は従来の
半導体素子収納用パツケージの断面図である。 1……基体、1a……半導体素子載置部、2…
…絶縁枠体、4……容量素子。
Claims (1)
- 上面中央部に半導体素子が載置される載置部を
有する基体上に、該載置部を囲繞するようにして
絶縁枠体を取着して成る半導体素子収納用パツケ
ージにおいて、前記基体を金属タンタルで形成し
、且つ基体の半導体素子載置部表面に陽極酸化処
理によつて得られる酸化タンタルを誘電体とした
容量素子を形成したことを特徴とする半導体素子
収納用パツケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064360U JPH0810952Y2 (ja) | 1990-06-18 | 1990-06-18 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990064360U JPH0810952Y2 (ja) | 1990-06-18 | 1990-06-18 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0423146U true JPH0423146U (ja) | 1992-02-26 |
JPH0810952Y2 JPH0810952Y2 (ja) | 1996-03-29 |
Family
ID=31595235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990064360U Expired - Lifetime JPH0810952Y2 (ja) | 1990-06-18 | 1990-06-18 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0810952Y2 (ja) |
-
1990
- 1990-06-18 JP JP1990064360U patent/JPH0810952Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0810952Y2 (ja) | 1996-03-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |