JPH04216661A - 集積回路パッケージアセンブリ - Google Patents

集積回路パッケージアセンブリ

Info

Publication number
JPH04216661A
JPH04216661A JP3032754A JP3275491A JPH04216661A JP H04216661 A JPH04216661 A JP H04216661A JP 3032754 A JP3032754 A JP 3032754A JP 3275491 A JP3275491 A JP 3275491A JP H04216661 A JPH04216661 A JP H04216661A
Authority
JP
Japan
Prior art keywords
integrated circuit
sheet
conductive material
package assembly
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3032754A
Other languages
English (en)
Japanese (ja)
Inventor
David Disko
デイビッド・ディスコ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JPH04216661A publication Critical patent/JPH04216661A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/40—
    • H10W72/00—
    • H10W72/5473—
    • H10W72/884—
    • H10W72/932—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP3032754A 1990-03-01 1991-02-27 集積回路パッケージアセンブリ Withdrawn JPH04216661A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/487,600 US5006919A (en) 1990-03-01 1990-03-01 Integrated circuit package
US487600 1990-03-01

Publications (1)

Publication Number Publication Date
JPH04216661A true JPH04216661A (ja) 1992-08-06

Family

ID=23936401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3032754A Withdrawn JPH04216661A (ja) 1990-03-01 1991-02-27 集積回路パッケージアセンブリ

Country Status (3)

Country Link
US (1) US5006919A (OSRAM)
EP (1) EP0444818A2 (OSRAM)
JP (1) JPH04216661A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001251861A (ja) * 2000-02-08 2001-09-14 Vlt Corp アクティブ整流器

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5455454A (en) * 1992-03-28 1995-10-03 Samsung Electronics Co., Ltd. Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture
US5485037A (en) * 1993-04-12 1996-01-16 Amkor Electronics, Inc. Semiconductor device having a thermal dissipator and electromagnetic shielding
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
KR0177744B1 (ko) * 1995-08-14 1999-03-20 김광호 전기적 특성이 향상된 반도체 장치
US10629519B2 (en) * 2016-11-29 2020-04-21 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
JPS61108160A (ja) * 1984-11-01 1986-05-26 Nec Corp コンデンサ内蔵型半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001251861A (ja) * 2000-02-08 2001-09-14 Vlt Corp アクティブ整流器
US7015561B2 (en) 2000-02-08 2006-03-21 Vlt, Inc. Active rectifier

Also Published As

Publication number Publication date
US5006919A (en) 1991-04-09
EP0444818A2 (en) 1991-09-04
EP0444818A3 (OSRAM) 1994-08-03

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19980514