JPH04199568A - Method of trimming semiconductor device - Google Patents

Abstract

PURPOSE:To prevent screening errors by marking defective parts with a laser stamp after they are trimmed. CONSTITUTION:Semiconductor parts subjected to trimming errors are marked with a laser stamp 3 for easy screening. For example, a semiconductor part, repairable by re-trimming, is marked with a laser stamp 3 in an area on a thick substrate where the device characteristics are not affected. This can clearly judge parts properly trimmed or not and prevents good parts and defective parts from mixing.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for trimming functions of semiconductor devices.

[Prior Art] FIG. 3 shows an example of trimming of a conventional semiconductor hybrid IC element. In FIG. 3, (1) is the thick film substrate of the hybrid IC, and (2) is the thick film substrate (1).
A thick film resistor for trimming is formed on top, and (4) is a lead.

Next, a trimming method will be explained. First, the hybrid IC is put into operation, and while monitoring the adjustment points, trimming is performed by changing the resistance value by burning out the JIK resistor (2) with a racer. After functional trimming is completed, products are sorted according to the judgment displayed on a CRT or the like.

[Problems to be solved by the invention] In the conventional trimming method for semiconductor devices as described above, 1
After the functional trimming is completed, the judgment is displayed on the CRT, etc., and when it comes to sorting out good and bad products, the operator must be careful not to make mistakes.

This invention was made to solve the above problem, and after the functional trimming is completed, it is possible to distinguish between good and bad at a glance.
An object of the present invention is to obtain a method for rimming semiconductor devices that can eliminate selection errors.

[Means for Solving the Problems] In the method for trimming a semiconductor device according to the present invention, after functional trimming is completed, a product with a trimming error is marked with a laser.

[Function] After functional trimming is completed, a mark is placed on the product using a laser, so mistakes made during sorting are minimized.

Embodiment Next, one embodiment will be described. First, a semiconductor element is trimmed in the same manner as in the conventional method.

Products that have been trimmed normally remain the same as before, but products with abnormalities such as trimming errors are branded with a laser to make them easier to identify. For example, Figure 1 shows a product that can be modified by performing function l/rimming again.
).

FIG. 2 shows the case of a product that cannot be repaired even if functional trimming is performed again, and by placing a branding mark (3) on the entire thick film substrate, it can be determined at a glance that the product is defective.

1. Effects of the Invention] As described above, the present invention makes it possible to determine at a glance whether each product is a functionally trimmed good product or a functionally trimmed defective product, thereby preventing the mistake of mixing each product by mistake. It can be eliminated.

[Brief explanation of the drawing]

1 and 2 are plan views for explaining an embodiment of the present invention, and FIG. 3 is a plan view for explaining a conventional method for trimming a semiconductor element. (1) Thick film substrate, (2) Trimming resistor, (3
)··brand. In each figure, the same reference numerals indicate the same or corresponding parts. Agent: Teru 1: Thickness: 11 Pieces: 2: Trimming'mJL

Claims (1)

[Claims] When an abnormality such as a trimming error occurs when functionally trimming a semiconductor element, a laser is used to brand the semiconductor element at any position depending on the nature of the error, and after the functional trimming is completed, the branding iron is used for sorting. A method for trimming semiconductor elements as landmarks.