JPH03147343A - Identification of type of ic wafer - Google Patents

Abstract

PURPOSE:To enable only a type identification mark to be detected using an optic filter of the same color as that of a non-conforming article identification mark and the type to be identified by coating the type identification mark to be detected with a color which is in complimentary relationship with the non-conforming article identification mark to an unneeded peripheral region of an IC wafer. CONSTITUTION:In an IC wafer test process, a type identification mark 6 and a probe card identification mark 7 are read. This reading is performed by detecting contract of a chip using a CCD line sensor. Then, the IC wafer test where a test program and a probe card are automatically selected is performed according to various kinds of type identification mark 6 and the probe card identification mark 7. After the IC wafer is tested, the wafer is sent to a chip assembly process. Then, only the type mark 6 and the package identification mark 7 which are in complimentary relationship in color with a non-conforming chip identification mark 5 are detected through a red optic filter on chip assembly.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a method for identifying types of IC wafers suitable for wafer testing and chip assembly automation in IC manufacturing processes.

[Conventional technology] Conventionally, on an IC wafer production line, multiple types of ICs were processed.
Wafers are flowing on one line.

Therefore, each IC wafer is attached with a process check sheet in which the product name is written in order to identify the product. In such an IC wafer production line, I
In the C wafer test process, after the operator confirms the process check sheet, the test program is switched for each wafer type. Further, in the chip assembly process, switching is similarly performed by the operator.

[Problem to be solved by the invention] By the way, in the conventional IC wafer manufacturing process mentioned above,
In particular, when installing different types of software (only the internal ROM code is different) on the same hardware such as a mask ROM or a 1-chip microcontroller, work must be done to prevent the mixing of different types of wafers during the IC wafer testing process and chip assembly process. The process check list will be checked by a person, but this requires careful checking. Furthermore, in the wafer test process and the chip assembly process, switching of programs and the like is also performed by the operator, which poses a problem that it is difficult to automate the IC wafer test process and the chip assembly process.

This invention was made in view of the above problems, and
The object of the present invention is to provide an IC wafer type identification method that can automate the wafer test process and the chip assembly process, and can also support the production of chips of different types of hardware with different chip sizes.

"Means for Solving the Problem" In order to solve such problems, this invention uses an IC
A product identification mark is applied to an unnecessary peripheral area of the wafer in a color complementary to that of the defective product identification mark, and only the product identification mark is detected by passing it through an optical filter of the same color as the defective product identification mark. , characterized by identifying varieties.

"Operation J" First, a product identification mark is applied in advance to the unnecessary peripheral area of the IC wafer in a color complementary to that of the defective product identification mark.Then, in a process that requires product identification, the defective product identification mark By passing the product through an optical filter of the same color, only the product identification mark is detected and the product type is identified.

Embodiment U Next, an embodiment of the present invention will be described with reference to the drawings.

The figure is a conceptual diagram of an embodiment of the present invention. In this figure, 1 is a wafer, and IC chips 2゜2,...
・is formed. 3.3. . . . is a scribe line, and IC chips 2.2. This is a cutout line to avoid cutting out... 4 is a facet,
This is a notch that indicates the crystal direction of the wafer 1.

5 is a defective chip identification mark, and red paint is applied to defective chips during IC wafer testing. In this example, the defective depth identification mark 5 is represented by "o". Next, 6 is a product identification mark, 7 is a probe card identification mark, and 8 is a package identification mark. In this example, the product identification mark 6, the probe card identification mark 7, and the package identification mark 8 are represented by [.J and are coated with green paint. In this example, the product identification mark 6, the probe card identification mark 7, and the package identification mark 8 are displayed using a maximum of four marks. Also,
The product identification mark 6, the probe card identification mark 7, the package identification mark 8, and the defective depth identification mark 6 use complementary colors. Next, arrow A is the reading direction of various marks.

Next, the correspondence between marks and products will be explained using the above-mentioned product identification mark 6 as an example. As described above, four marks are used as the product identification mark 6, and if the presence or absence of these marks is correlated to the binary number 1.0, 2'=16 combinations are possible.

These 16 combinations are shown in the following table.

In this way, if there is no mark, type rYM7
400J, and if there is one type identification mark 6 in the front as shown in the figure, it corresponds to the type rYM7401.
Also, based on the position of the facet on the IC wafer,
Similarly, the probe card identification mark 7 and the package identification mark 8 are made to correspond to the probe card and package, respectively.

Next, a product type identification method using the various marks described above will be explained.

Also, mark reading is performed in the IC wafer test process. In this IC wafer test process, the product identification mark 6 and the probe card identification mark 7 are read. This reading is done by detecting the contrast of the chip using a C0D (charge coupled device) line sensor.

Then, according to each product identification mark 6 and probe card identification mark 7, a test program and a probe card are automatically selected, and an IC wafer test is performed. After the IC wafer test is completed, the wafer is sent to a chip assembly process. And during depth assembly,
By passing through the red optical filter, only the product type mark 6 and package identification mark 7, which have a complementary color relationship with the defective chip identification mark 5, are detected. Then, according to the detected first product identification mark 6 and package identification mark 7, the package frame and the product number to be printed on the package are automatically selected and assembled.

[Effect of the invention-1 As explained above, according to this invention, the IC wafer
-A product identification mark is applied to the unnecessary area in a color complementary to that of the defective chip identification mark, and in each process,
Since this identification mark can be read as needed, it is possible to automate the labor-intensive EC wafer testing process and chip assembly process in multi-product production, and also support the production of dissimilar hardware chips with different chip sizes. You can get the benefits that you can.

[Brief explanation of the drawing]

The figure is a conceptual diagram of a C wafer according to an embodiment of the present invention. ! ...IC wafer, 5 ... Defective chip identification mark (defective product identification mark), 6 ... Product identification mark.

Claims (1)

[Claims] A product identification mark is coated on the unnecessary peripheral area of the IC wafer in a color complementary to that of the defective product identification mark, and only the product identification mark is detected by passing it through an optical filter of the same color as the defective product identification mark. A method for identifying types of IC wafers, characterized in that the types of IC wafers are identified.