JP2657298B2 - Inspection method for semiconductor wafer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method for inspecting a semiconductor wafer.

(Prior Art) Conventionally, in a semiconductor wafer manufacturing process, an inspection process for evaluating the manufacturing process is provided.

As an inspection method for evaluating such a manufacturing process, as shown in FIG. 4, for example, a plurality of monitor chips 2 for inspection are formed on a semiconductor wafer 1 and the monitor chips 2 are inspected. An evaluation of the process has been performed.

 Hereinafter, such a conventional inspection method will be described.

The monitor chip 2 is composed of a basic element, for example, a pattern aggregate of transistors, resistors, capacitors, and the like. The manufacturing process can be evaluated by measuring the monitor chip 2 with, for example, a prober. is there.

By the way, since the inspection content differs depending on the type of the semiconductor wafer, the type of the IC chip, etc., various monitoring chips 2 corresponding to the inspection content are formed.

As described above, since the inspection procedure and the inspection content are different depending on the type of the monitor chip, the inspection device for the monitor chip uses the inspection content corresponding to the type of the monitor chip and the inspection condition ( In the following, test information such as applied voltage, probe needle measurement arrangement, and probe card type is stored in the device storage unit in advance, and the test information according to the type of monitor chip is stored at the time of test. It is configured to be able to call and perform a predetermined inspection.

By the way, with the recent increase in the degree of integration of semiconductor elements and the like, inspection contents are becoming more sophisticated and complicated. In many cases, monitor patterns having a plurality of test contents are formed on one monitor chip 2. Has become.
For example Figure 5 more e.g. three monitor patterns A ₁ as shown in _{(a), B 1, C} 1, by 1 monitor chip 2 varieties S ₁ is configured.

Here, A ₁ , B ₁ , and C ₁ indicate a combination of the monitor patterns A, B, and C and the test conditions 1, 2, and 3 corresponding to the monitor patterns, respectively.
A ₁ indicates that the inspection content for the monitor pattern A is to be performed under the inspection condition of the test condition 1, and B ₁ and C ₁
The same applies, varieties S ₁ indicates that it has a test contents comprising these combinations.

FIG. 6 is a flowchart showing a method of inspecting such a monitor chip of the type S ₁ (A ₁ + B ₁ + C ₁ ).

As the input operation 101, first, a test content for the monitor A is called from the monitor storage unit 3 in which many types of monitors are stored in advance (102).

Next, from the test condition storage unit 4 in which many types of test conditions are stored in advance, the test condition corresponding to the test content for the monitor A, for example, the applied voltage, the measurement procedure of the probe needle, the information of the probe card to be used, etc. , 1 is called (103).

In the same manner, monitor B, test the contents of the monitor C, and call the test condition from each storage unit 3 and 4, the test of the monitoring chip varieties S ₁ Program S
₁ (A ₁ + B ₁ + C ₁ ) is used (104).

(Problems to be Solved by the Invention) By the way, in the production of semiconductor wafers in recent years, the production of many kinds and in small quantities has been further advanced, and the inspection contents have also been diversified. Therefore, semiconductor wafers of the same production lot may be produced in different types or for different purposes. For example, in a production process, semiconductor wafers of the same production lot may not all be subjected to the same inspection. In the first half of the semiconductor wafer,
In the latter half of the production lot, the type S ₁ (A ₁ + B ₁ + C ₁ ) had a monitoring chip of the type S ₂ (A ₂ + B ₁ + C ₁ ), as shown in FIG. 5 (b). It may be changed to a semiconductor wafer having a monitor chip.

However, in the above-described conventional semiconductor wafer inspection method, when a change occurs during such inspection, the operator enters the lower layer of the test program for each change in order to respond to the change in the content. must be changed, for example when changing from a ₁ to a _2, it is necessary to perform the change procedure after returning one end to the test condition storage unit, it takes time to change procedure, and also to complication work There was a problem.

Furthermore, with the recent diversification of products, the types of monitor patterns constituting the monitor chip have been increasing, and it has been a problem from the viewpoint of work efficiency that the operator inputs one by one.

As described above, the conventional semiconductor wafer inspection method cannot flexibly cope with recent high-mix low-volume production.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. By simplifying the procedure for inputting inspection information, it is possible to flexibly cope with high-mix low-volume production and improve the working efficiency. The purpose of the present invention is to provide an inspection method.

[Constitution of the Invention] (Means for Solving the Problems) According to a semiconductor wafer inspection method of the present invention, a predetermined test content of a monitor chip composed of an aggregate of basic element monitor patterns formed on a semiconductor wafer is specified. In a semiconductor wafer inspection method of measuring under inspection conditions and evaluating the semiconductor wafer production process based on the measurement result, the inspection content information for the monitor pattern and the inspection condition information corresponding to the inspection content information are combined in advance. Inspection information of the monitor pattern is grouped for each type of the monitor pattern and stored as the inspection information for each type of the monitor pattern, and at least one of the inspection information for each type of the monitor pattern is combined for the monitor. Inspection information by type of chip is stored in a group for each type, and the inspection conditions of the monitor chip are different. Search the stored kind-based examination information prior to measurement, in which the selected and performing an inspection to determine the inspection work procedures based on various inspection conditions.

(Operation) In the present invention, the inspection information of the monitor pattern obtained by combining the inspection content information for the monitor pattern and the inspection condition information corresponding to the inspection content information is grouped in advance for each type of the monitor pattern. Inspection information for each type of the monitor chip, which is obtained by combining at least one type of inspection information for each type of the monitor pattern, is stored in a group for each type, and stored. Before the measurement of a product type with different inspection conditions, the stored product-specific inspection information is searched and selected, and the inspection work procedure is determined based on various test conditions, and the inspection is performed. Can be changed.

(Example) Hereinafter, an example of the method of the present invention will be described with reference to the drawings.

Each of the monitor patterns (A, B, C ...
...), a monitor registration file 11 in which test content information corresponding to each is registered, and test conditions (hereinafter, test conditions) such as an applied voltage and a probe needle measurement procedure corresponding to each monitor.
And a test condition registration file 12 in which the type of the monitor chip is registered.

Further, the monitor patterns (A, B, C,...) And the corresponding test conditions (1, 2, 3,.
..), And these are grouped and stored for each type of monitor pattern, and the monitors (A ₁ , B ₁ , C _1, ...) Stored in the monitor storage unit 14 are stored. And a product storage unit 15 for storing the products in a group for each product type of the monitor chip.

Here, the monitor (A ₁ , B ₁ , C _1, ...) Indicates a combination of monitor patterns A, B, C and test conditions (1, 2, 3,...) Respectively corresponding to the monitor patterns. and varieties S ₁ indicates that it has a test contents consisting of combinations.

Then, a test program 16 is output based on the information configured from the product type storage unit 15, and an inspection is performed by, for example, a prober according to the test program.

An inspection method using an inspection apparatus in which such various kinds of inspection information are stored in advance will be described with reference to the flowchart in FIG.

In the present example described a case where the monitoring chip varieties S ₁ is a monitor pattern _{(A 1 + B 1 + C} 1).

As the type input operation 201, first, the type of the monitor chip is stored in the type storage unit 15 in which many types of types are stored in advance.
Search for inspection information corresponding to S ₁ (202).

If the information S ₁ is called, by inputting this, S ₁
Test program S ₁ (A ₁ + B ₁ + C ₁ ) is executed (20
3).

Here, when the breed S ₁ is not registered, the monitor from the monitor storage unit 14 configured to store the group to which a combination of pre-monitor and test conditions for each monitor varieties
A _1, B _1, and inputs by calling C ₁ (204). At this time, the monitor (A, B, C ...) and the test condition (1,
2, 3...) Are stored in the monitor storage unit 14, so that the lower part of the information unit, that is, the test condition registration unit, as in the prior art, is entered. It becomes unnecessary.

In this way, input each monitor (A ₁ , B ₁ , C ₁ )
Test program _{S 1 S 1 (A 1 +} B 1 + C 1) is executed (203).

At this time, the input information of the type S ₁ (A ₁ + B ₁ + C ₁ ) is stored in the type storage unit 15 (205), so in the next inspection, the test program is executed only by inputting the type S ₁ it can.

By the way, in recent years, semiconductor wafers of the same production lot may produce slightly different kinds, for example, semiconductor wafers having the same monitor pattern but different test conditions, due to the production of many kinds and small quantities in recent years. In such a case, to cope with the changed examination content cultivars example varieties S _2, it is necessary to change a test program of the test apparatus.

Hereinafter, an inspection method in the case where such a type change has occurred will be described with reference to the flowchart of FIG.

In this example, the type S ₁ (A ₁ + B ₁ + C ₁ ) is replaced with the type S ₂ (A ₂ + B ₁ +
Description will be given of a case where change in C _1).

As the type input work (301), first, S ₂ (A ₂ + B ₁ +
C ₁₎ is checked whether or not it is registered (302), by entering this if it is registered, executes the test program S ₂ for該品species _{S 2 (A 2 + B 1} + C 1) (303 ).

If the type S ₂ is not registered, the type S ₁ (A ₁ + B ₁ +
The monitor to be changed in C ₁ ) is determined (304), and the corresponding monitor group is called from the monitor storage unit 14 (305). If for example to change the monitor A ₁ to the monitor A _2, the monitor memory section 14
Call the monitor A ₂ from.

Then, the monitor A ₂ , B ₁ , and C ₁ are inputted (306), and the test program is executed (303).

At this time, since the type S ₂ (A ₂ + B ₁ + C ₁ ) is registered in the type storage unit 15, only the input of the type S ₂ is required from the next inspection.

Thus, in the work of changing the type, even if the conventional method is slightly changed, for example, only the test condition is changed without changing the monitor type, it cannot be changed without entering the lower layer of the inspection information storage unit. On the other hand, in the method of the above-described embodiment, it is only necessary to select the change unit from the combination group of the monitor and the test condition stored in the monitor storage unit, and the type of the monitor chip can be easily changed.

Also, by sequentially storing the inspection information of the new type, the amount of inspection information stored in the type storage unit 15 becomes enormous as the number of inspection processes increases, and finally,
If the type is slightly changed, all the types are stored in the type storage unit, and thus the type changing operation described above is almost unnecessary.

In this way, a monitor group is formed by associating each monitor with a test condition, and a product type obtained by combining several monitors from the monitor group is formed as a product type group, and these are stored in the storage unit. By storing the information, it is possible to easily change the type of the monitor chip, and it is possible to flexibly cope with high-mix low-volume production.

[Effects of the Invention] As described above, according to the semiconductor wafer inspection method of the present invention, by simplifying the procedure for changing the inspection contents of the monitor chip, the semiconductor wafer can be flexibly manufactured in a wide variety and in small quantities. Can be handled.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an inspection information storage unit of an embodiment according to the method of the present invention, FIG. 2 is a flowchart for explaining the method of the embodiment, and FIG. FIGS. 4 and 5 show a monitor chip formed on a semiconductor wafer, and FIG. 6 is a flowchart for explaining a conventional inspection method. 1 ... Semiconductor wafer, 2 ... Monitor chip, 14 ... Monitor storage unit, 15 ... Product storage unit.

Claims (1)

(57) [Claims] 1. A method for measuring a predetermined inspection condition of a monitor chip comprising an aggregate of basic element monitor patterns formed on a semiconductor wafer under predetermined inspection conditions, and evaluating the semiconductor wafer production process from the measurement result. In the inspection method of a semiconductor wafer performing, in advance, the inspection information of the monitor pattern that combines the inspection content information for the monitor pattern and the inspection condition information corresponding to this inspection content information, is grouped for each type of the monitor pattern, In addition to storing the monitor pattern type inspection information, at least one monitor pattern type inspection information is stored.
Inspection information for each type of the monitor chip, which is a combination of two or more, is grouped and stored for each type, and the above-mentioned stored type-specific inspection information is searched before the measurement of a type having different inspection conditions for the monitor chip. A method for inspecting a semiconductor wafer, wherein the inspection is performed by selecting an inspection operation procedure based on various inspection conditions.