JP3708570B2 - Non-defective product identification method for semiconductor elements - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a method for determining the quality of individual semiconductor elements in a semiconductor element production process. More specifically, for each lot, a statistical value of a measured value for each inspection item is calculated, and a calculation result and a preset value are set. The present invention relates to a semiconductor device non-defective product discrimination method for determining pass / fail with a discrimination reference value that is optimal for each lot by calculating a pass / fail judgment reference value from the determined reference value.
[0002]
[Prior art]
In the semiconductor element production process, when determining the quality of the semiconductor elements 211 to 213,... Formed on the wafer 21 shown in FIG. Further, the same determination reference value is used for determining the quality of the semiconductor elements 211 to 213,.
[0003]
More specifically, the characteristic inspection apparatus includes a measurement controller 1, a measuring instrument 2, a handler controller 3, a loader unit 4, a test head unit 5, and an unloader unit 6. The determination is performed according to the procedure shown in FIG. That is, the wafer 21 is transferred by the loader unit 4 and placed at a predetermined position of the test head unit 5 (step S81). Next, in order to make the positional relationship between the probe pins and the semiconductor elements 211 to 213,... A predetermined positional relationship, the wafer 21 placed on the test head unit 5 is positioned (step S82).
[0004]
Thereafter, for example, a probe pin is connected to the electrode of the semiconductor element 211 (step S83), and a predetermined inspection item is measured by the measuring instrument 2 for the semiconductor element 211 (step S84). The measured value is sent to the measurement controller 1 and stored in the memory 11 (step S85). And the measured value memorize | stored in the memory 11 is a value common to all the lots, and is compared with the discrimination | determination reference value used as the quality criterion of the semiconductor elements 211-213, .... In addition, the quality determination result, which is the comparison result, is stored in the memory 11 (step S86).
[0005]
When the determination result stored in the memory 11 indicates a defective product, red ink is attached to the surface of the semiconductor device 211 in order to indicate that the semiconductor device 211 is defective (step S87). Thereafter, the probe pin is separated from the electrode of the semiconductor element 211 (step S88), and the probe pin is moved to the next semiconductor element, for example, the semiconductor element 212 (steps S89 and S90).
[0006]
Below, operation | movement of step S83-S90 is repeated about all the semiconductor elements 212,213, .... When the predetermined repetition is completed, the wafer 21 is removed from the test head unit 5 by the unloader unit 6 and transferred to the next process (step S91).
[0007]
In order to perform the above-described determination, measurement and determination for a plurality of inspection items are performed. Here, only one type of inspection item is noted and described. FIG. 8 shows the relationship between the frequency distribution of the measurement values, the average values AVaj, AVbj, AVcj, and the discrimination reference values for the inspection items j for each lot for the three types of lots a, b, c. Yes. The discrimination reference value used at this time is common to all the lots a, b, and c, the value LLoj indicates the minimum discrimination reference value, and the value ULoj indicates the maximum discrimination reference value.
[0008]
For this reason, all the lots a and b are determined as non-defective products. For lot c, it is determined that only the element whose measured value is equal to or smaller than the value LLoj (the element corresponding to the hatched line 93) is a defective product.
[0009]
[Problems to be solved by the invention]
However, as shown in FIG. 8, most of the measured values of the semiconductor elements of lot a are distributed in the vicinity of the average value AVaj with respect to the inspection item j, but some of them are separated from the average value AVaj. (See 91). That is, the semiconductor element corresponding to the distribution indicated by the measurement value 91 is the measurement value indicated by the most element group even though the lot a is an element formed under the same material and under the same conditions. Are element groups showing different measured values.
[0010]
In other words, the semiconductor element group corresponding to the distribution 91 is an element group that is considered highly likely to have an abnormality. The same applies to the element group corresponding to the distribution 92 of the lot b.
[0011]
For this reason, when determining the quality of a semiconductor element using a determination reference value common to all lots, that is, a determination reference value having a minimum value of LLoj and a maximum value of ULoj, the semiconductor elements corresponding to the distributions 91 and 92 are also included. It will be identified as a good product. As a result, even an element having a very high possibility of having an abnormality is determined to be a non-defective product, resulting in a problem that the determination accuracy is lowered.
[0012]
The present invention was devised to solve the above-mentioned problems, and the object of the present invention is to determine a reference value as a criterion for discrimination for each lot, and pass or fail according to the determined reference value. It is an object of the present invention to provide a non-defective product discrimination method for semiconductor elements that can improve the accuracy of the quality discrimination.
[0013]
According to another aspect of the present invention, the determination result is stored in the memory in advance, and control is performed to classify the semiconductor element into a non-defective product and a defective product based on the distribution of defective elements indicated by the stored determination result. Another object of the present invention is to provide a method for discriminating non-defective semiconductor elements that can shorten the time required for classification.
[0014]
[Means for Solving the Problems]
In order to solve the above problems, a semiconductor device non-defective product discriminating method according to the present invention is a method for discriminating the quality of individual semiconductor devices in a semiconductor device production process. j is measured, and the measurement value of the inspection item j is stored in a memory in one-to-one correspondence with each of the semiconductor elements to be measured, and for each of the inspection items j, the memory The average value AVj and the standard deviation σj are obtained based on the measured value stored in the table, and the obtained average value AVj and the standard deviation σj Base Lower limit value LLj of quasi-value And above Limit value ULj and Play A reference value for determination consisting of a preset minimum value LLoj and maximum value ULoj applied to all lots, , The lower limit value LLj and the upper limit value ULj From the above, two types of discrimination reference values LL [j] and UL [j] indicating the quality criteria of the semiconductor element are calculated, and the measured value and the two types of discrimination reference values stored in the memory are calculated. By collating, the quality of the semiconductor element associated with the measured value is determined.
[0015]
According to a second aspect of the present invention, there is provided a non-defective product determination method for a semiconductor element, which is applied to a method for determining individual pass / fail of a semiconductor element formed on a wafer, and the determination result of the pass / fail is an object of the determination. A method of obtaining a moving course of an apparatus for storing a mark on a defective product based on a distribution on the wafer of a defective product indicated by the determination result stored in the memory in association with the semiconductor element. It is said.
[0017]
[Action]
The operation of the invention of claim 1 will be described below.
[0018]
Inspection item j For each of the given statistics based on the measurements stored in memory ( Reference value lower limit value LLj and upper limit value ULj ), The obtained statistical value indicates a tendency of distribution of measured values of all semiconductor elements belonging to the unit lot. on the other hand, Applicable to all lots Pre-set discrimination reference value ( Minimum value LLoj and maximum value ULoj ) Indicates the maximum value of the allowable range of measurement values, and indicates a value applied to every unit lot. As a result, it was calculated based on the preset reference value and statistical value. Two kinds Discrimination standard value ( LL [j] and UL [j] ) Corresponds to the tendency of each measured value of the unit lot and satisfies the maximum value of the allowable range.
[0019]
For this reason, if the quality of the semiconductor element is determined based on the determination reference value, the quality is determined based on the tendency specific to the target unit lot, and whether the maximum value of the allowable range is satisfied. This is also determined. Therefore, even if the semiconductor element to be measured satisfies the maximum value of the allowable range, if it does not follow the tendency of the measured value of each lot, it is determined as a defective product.
[0020]
The operation of the invention according to claim 2 will be described below.
[0021]
In order to classify semiconductor elements into non-defective products and defective products, when marking a defective product on a wafer, the transfer course of the device that applies the mark to the defective product is best suited to the distribution of the position of the defective product. There is a moving course. For this reason, when the determination result is stored in the memory in advance, based on the distribution of the defective product indicated by the stored determination result, it is possible to calculate a movement course that minimizes the movement time of the device for marking the defective product. Become. For this reason, the required time is shortened by giving a mark to the corresponding semiconductor element while controlling the apparatus according to the calculated movement course.
[0025]
【Example】
An embodiment of the present invention will be described below with reference to the drawings.
[0026]
FIG. 5 is a block diagram showing an electrical configuration of a characteristic inspection apparatus to which an embodiment of the present invention is applied. The measurement controller 1, the measuring instrument 2, the handler controller 3, the loader unit 4, and the test head unit 5 are shown. , And an unloader unit 6. This configuration is the same as the device used in the discrimination of the prior art, but the measurement controller 1 is configured to perform an operation corresponding to the first and second aspects of the invention.
[0027]
That is, the measurement controller 1 is a block that executes main operations as a characteristic inspection device, and includes a memory 11 therein, and stores measurement values measured by the measuring instrument 2. Based on the stored measurement values, the average value and standard deviation of the measurement values are calculated as statistical values. Further, a discrimination reference value corresponding to each lot is calculated from the calculated statistical value and a preset reference value for pass / fail discrimination.
[0028]
The measuring instrument 2 is a measuring apparatus that measures a predetermined inspection item in a state where probe pins (not shown) are connected to electrodes of the plurality of semiconductor elements 211 to 213 formed on the wafer 21. Then, the measurement value obtained by the measurement is sent to the measurement controller 1.
[0029]
The loader unit 4 is a block for placing the wafer 21 on which the semiconductor elements 211 to 213,... Are formed at a predetermined position of the test head unit 5, and the unloader unit 6 is the test head unit 5. This is a block for moving the wafer 21 placed on the substrate to the next process.
[0030]
The handler controller 3 is a block for controlling operations of the loader unit 4, the test head unit 5, and the unloader unit 6, and controls the movement of the wafer 21 in accordance with an instruction from the measurement controller 1.
[0031]
FIG. 1 is a flowchart showing one embodiment of a non-defective product determination method for a semiconductor device according to the first and second aspects of the present invention. A unit lot is a single wafer 21. The embodiment will be described in detail with reference to FIG.
[0032]
First, the handler 21 controls the operation of the loader unit 4 to place the wafer 21 at a predetermined position on the test head unit 5 (step S1). Thereafter, in the test head unit 5, the wafer 21 is positioned so that probe pins can be connected to the electrodes of the semiconductor elements 211 to 213,... Of the wafer 21 (step S2). Thereafter, probe pins are connected to the electrodes of the semiconductor element 211 (step S3).
[0033]
The measuring instrument 2 performs measurement on M inspection items for the semiconductor element 211 in accordance with a program stored in advance. Then, the measurement value obtained by the measurement is sent to the measurement controller 1. The measurement controller 1 stores the measurement value output from the measuring instrument 2 in the memory 11 in a one-to-one correspondence with the semiconductor element 211 (step S4).
[0034]
The measurement values stored in the memory 11 are stored as the following data because the program of the measurement controller 1 is described in C language. That is, a structure corresponding to each of the semiconductor elements 211 to 213,... Is defined. Each structure has, as members, an array for storing M measurement values and a flag for indicating a discrimination result.
[0035]
In addition, the measurement value of each inspection item is given as a return value of a measurement function having a numerical value indicating the item as an argument. Therefore, for each of the inspection items of M items, each time a measurement function is called and a measurement value is obtained as a return value, the obtained measurement value is in the structure corresponding to the semiconductor element 211 that is the measurement target. Are stored in the corresponding area.
[0036]
When measurement of all inspection items of the semiconductor element 211 is completed, the probe pin is removed from the semiconductor element 211 (step S5), and the operation moves from step S6 to step S7. That is, the probe pin moves to the next semiconductor element 212. Thereafter, the operations of steps S3 to S7 are repeated for each of the semiconductor elements 212, 213,. As a result, for all the semiconductor elements 211 to 213,..., The respective measured values of the M items of inspection items are stored in a predetermined area of the corresponding structure array.
[0037]
When the measurement for all the semiconductor elements 211 to 213,... Is completed, the measurement values are read from the memory 11 for each of the inspection items. Based on the read measurement value, an average value and a standard deviation are calculated.
[0038]
If the item number of the inspection item is indicated by j,
[0039]
[Expression 1]
j = 1, 2, 3,..., M
It is. For this reason, in the lot a, the average value AVaj and the standard deviation σaj are calculated for each j (step S8). Thereafter, a reference value corresponding to lot a is calculated. If the lower limit value of the reference value is LLaj and the upper limit value is ULaj,
[0040]
[Expression 2]
LLaj = AVaj−k × σaj
ULaj = AVaj + k × σaj (k is a constant)
Each value is calculated as follows.
[0041]
Then, reference is made to LLoj, which is a minimum value set in advance as a reference value applied to all lots, and ULoj, which is a maximum value.
[0042]
[Equation 3]
LLa [j] = MAX (LLoj, LLaj)... 1 set
ULa [j] = MIN (ULoj, ULaj) (2 formulas)
By this calculation, two types of discrimination reference values corresponding to lot a are determined. That is, the discrimination reference value LLa [j] indicates the lower limit value in the item j of the lot a, and the discrimination reference value ULa [j] indicates the upper limit value in the item j of the lot a (step S9).
[0043]
When two types of determination reference values are obtained for all j of 1 to M by the above calculation, pass / fail determination is performed for all inspection items j. That is, among the values stored in the array of structures corresponding to each of the semiconductor elements 211 to 213,..., The measured values Fij corresponding to all the inspection items j (i is an identifier for distinguishing the semiconductor elements). But
[0044]
[Expression 4]
LLa [j] ≦ Fj ≦ ULa [j]
In this case, the semiconductor element identified by i is determined to be a good product. As a result, the value 1 is stored in the flag of the structure of the corresponding semiconductor element if it is a non-defective product. If the product is not determined to be non-defective, the value 0 is stored in the flag of the corresponding semiconductor element structure to indicate a defective product.
[0045]
That is, the pass / fail discrimination result is stored in the memory in association with the semiconductor element to be discriminated (step S10).
[0046]
Next, all the values of the flags in the structure are read, and the distribution on the wafer 21 relating to the defective semiconductor elements is obtained. Then, in order to attach red ink (mark) to all defective products, the shortest path for moving a device (not shown) for attaching red ink is calculated. Then, the apparatus moves along the calculated path, and red ink is attached to the corresponding semiconductor element (step S11).
[0047]
Thereafter, the wafer 21 is removed from the test head unit 5 by the unloader unit 6 and transferred to a predetermined position for the next process (step S12). In the die bonding process, the semiconductor element to which the red ink is attached is discarded as a defective product. Thereafter, the measurement of the inspection item j, the calculation of the discrimination reference value, and the discrimination are sequentially performed on each wafer. Also, red ink is attached to defective products.
[0048]
The determination of pass / fail in the above method will be described in detail with reference to FIG. A curve 31 indicates the frequency distribution of the minority part of the measurement value regarding the inspection item j for the lot a.
[0049]
Further, the discrimination reference value LLa [j] indicates a lower limit value obtained by the equation 1, and the discrimination reference value ULa [j] indicates an upper limit value obtained by the equation 2. For this reason, a semiconductor element belonging to a portion whose frequency distribution is indicated by the curve 41 is determined as a non-defective product. In addition, a semiconductor element belonging to a portion whose frequency distribution is indicated by the curve 31 is determined as a defective product.
[0050]
That is, in the frequency distribution in lot a, only semiconductor elements that belong to the main part of the frequency distribution and exhibit normal characteristics as lot a are determined as non-defective products. As for the semiconductor elements belonging to the minority part of the frequency distribution, the lot a element has some possibility of abnormality even though it satisfies the reference values (LLaj and ULoj) of the whole lot, It will be determined.
[0051]
The same applies to the semiconductor elements on the wafer produced as the lot b. The lower limit value LLb [j] and the upper limit value ULb [j] of the discrimination reference value obtained for the inspection item j of the lot b are the same. Only semiconductor elements belonging to a frequency distribution satisfying the above are determined as non-defective products.
[0052]
Since the portion 32 distributed in the portion far from the average value AVbj does not satisfy the lower limit value LLb [j], the lot b is satisfied despite satisfying the reference values (LLoj and ULoj) of the entire lot. Since this element has some possibility of abnormality, it is determined as a defective product.
[0053]
In the case of lot c, the lower limit value LLc [j] of the discrimination reference value matches the lower limit value LLoj which is one of the reference values of the entire lot. For this reason, the semiconductor element belonging to the hatched portion 33 that does not satisfy the lower limit value LLc [j], although not far from the average value AVcj, does not satisfy the design characteristics required for the element. It will be identified as a good product.
[0054]
FIG. Semiconductor device non-defective method other Characteristic inspection device used in the embodiment Shows the configuration of The measurement controller 1 This example It is comprised so that the operation | movement corresponding to may be performed.
[0055]
In other words, the measurement controller 1 randomly extracts a plurality of semiconductor elements from the semiconductor elements belonging to the unit lot. Then, for the extracted semiconductor element, control for measurement of a predetermined inspection item is performed. Based on the measured value obtained by measurement, the average value and standard deviation of the measured value are calculated as statistical values, and then the determination target is calculated from the calculated statistical value and a preset reference value for determining good or bad. The discrimination reference value corresponding to the lot that has become is calculated.
[0056]
2 and 3 Half How to identify non-defective conductor elements other It is a flowchart which shows an Example, and has shown the discrimination | determination method in case the several wafer is produced as a unit lot. Further, since the semiconductor element to be discriminated is an element having the same configuration as the semiconductor element on the wafer 21 which is the object of the invention of claim 1, the number of inspection items is M items.
[0057]
First, the handler controller 3 controls the operation of the loader unit 4 to place the wafer on a predetermined position of the test head unit 5 (step S21). After that, the test head unit 5 positions the wafer so that the probe pins can be connected to the electrodes of the semiconductor elements of the wafer (step S22). Thereafter, p semiconductor elements are extracted according to a program stored in advance in the measurement controller 1, and a probe pin is connected to the electrode of the first semiconductor element of the extracted semiconductor elements (step S23).
[0058]
With respect to the semiconductor element in which the probe pin is connected to the electrode, the measurement item 2 measures the inspection items of M items. The measured value is stored in the memory 11. Thereafter, by sequentially connecting electrodes to each of the extracted second and subsequent semiconductor elements, predetermined inspection items of p semiconductor elements are measured, and the measured values are stored in the memory 11 (steps S24 and S25). ).
[0059]
The unloader unit 6 is controlled to remove the wafer from the test head unit 5, and the loader unit 4 is controlled to place the next wafer on the test head unit 5 (step S28). Thereafter, the operations in steps S22 to S28 are repeated for a total of q wafers including the wafers already measured.
[0060]
As a result of the above operation, if the total of the extracted semiconductor elements is represented by N,
[0061]
[Equation 5]
N = p × q
It becomes. Also, if the inspection item number is indicated by j,
[0062]
[Formula 6]
j = 1, 2, 3,..., M
It becomes. For each j, the average value AVj and the standard deviation σj are calculated (step S29). Thereafter, a reference value corresponding to this unit lot is calculated. If the lower limit value of the reference value is LLj and the upper limit value is ULj,
[0063]
[Expression 7]
LLj = AVj−k × σj
ULj = AVj + k × σj (k is a constant)
Each value is calculated as follows.
[0064]
Then, reference is made to LLoj, which is a minimum value set in advance as a reference value applied to all lots, and ULoj, which is a maximum value.
[0065]
[Equation 8]
LL [j] = MAX (LLoj, LLj) (3 formulas)
UL [j] = MIN (ULoj, ULj) (4 formulas)
By this calculation, two types of discrimination reference values corresponding to the lot are determined. That is, the discrimination reference value LL [j] indicates the lower limit value in the item j of the corresponding unit lot. The discrimination reference value UL [j] indicates the upper limit value in the item j of the corresponding unit lot (step S30).
[0066]
When two types of determination reference values are obtained by the above calculation, the quality of the inspection item j is determined for all j. In other words, the quality of all the inspection items j is determined for all the semiconductor elements including the extracted semiconductor elements and included in the corresponding unit lot. Details thereof will be described below.
[0067]
The first wafer belonging to the corresponding unit lot is placed on the test head unit 5 by the loader unit 4 (step S31). Thereafter, the wafer is positioned in the test head unit 5 so that the probe pins can be connected to the electrodes of the semiconductor elements of the wafer (step S32). Thereafter, probe pins are connected to the electrodes of the first semiconductor element according to a predetermined order (step S33).
[0068]
With respect to the semiconductor element in which the probe pin is connected to the electrode, the measurement item 2 measures the inspection items of M items (step S34). Further, all the measurement values obtained by the measurement are stored in the memory 11 (step S35). Further, the discrimination reference value obtained by the formulas 3 and 4 is compared with the measured value, and the quality of the corresponding semiconductor element is discriminated. Further, the determination result is stored in the memory 11 (step S36). When the determination result indicates a defect, red ink is attached to the surface of the corresponding semiconductor element using a marker (step S37). Then, the probe pin is removed from the electrode of the semiconductor element (step S38).
[0069]
Thereafter, the probe pin is moved to the position of the next semiconductor element (step S40), and the same operation is repeated. When the determination of all the semiconductor elements of the corresponding wafer is completed, the operation proceeds from step S39 to step S41, and the wafer of the test head unit 5 is removed by the unloader unit 6 (step S41). Then, the second corresponding wafer is placed on the test head unit 5 by the loader unit 4. Thereafter, the same operation is repeated, and when the determination of the semiconductor elements of all the wafers is completed, the determination operation is completed.
[0070]
Note that the present invention is not limited to the above-described embodiments, and the description has been given of the case where the target semiconductor element is a semiconductor element formed on a wafer. However, as another semiconductor element, for example, a DIP housed in a sleeve The same applies to the type of semiconductor element.
[0071]
【The invention's effect】
The semiconductor device non-defective product discriminating method according to claim 1 is applied to a method of discriminating the quality of individual semiconductor devices in a semiconductor device production process. And predetermined inspection items for all of the semiconductor elements belonging to the unit lot j The above inspection items j The measured value of Measuring Test items are stored in memory in a one-to-one correspondence with each semiconductor element j For each of the above, based on measurements stored in memory The average value AVj and the standard deviation σj are obtained, and the lower limit value LLj and the upper limit value ULj of the reference value are obtained from the obtained average value AVj and standard deviation σj. And A reference value for discrimination consisting of a preset minimum value LLoj and maximum value ULoj applied to all lots, the lower limit value LLj and the upper limit value ULj And shows the standard of semiconductor device quality Two kinds Discrimination standard value LL [j] and UL [j] And the measured value stored in the memory The two types This is a method for determining pass / fail of a semiconductor element associated with a measured value by collating the determination reference value. For this reason, the pass / fail judgment is made based on the tendency specific to the target unit lot, and the judgment is made as to whether or not the maximum allowable range is satisfied. If the measured value of each lot does not follow the trend, it is determined as a defective product, so that it is possible to improve the accuracy of the quality determination.
[0072]
Further, the non-defective product discrimination method for a semiconductor device according to the second aspect of the invention is applied to a method for discriminating individual quality of a semiconductor device formed on a wafer. Then, the pass / fail judgment result is stored in the memory in association with the semiconductor element to be discriminated, and a mark is given to the defective product based on the distribution of the defective product on the wafer indicated by the discrimination result stored in the memory. This is a method for obtaining a moving course of the device to be operated. For this reason, since the apparatus for applying a mark to a defective product applies the mark to the corresponding semiconductor element through the shortest course, it is possible to reduce the time required for the classification of pass / fail.
[Brief description of the drawings]
[Figure 1] Book It is a flowchart which shows one Example of the non-defective item discrimination method of the semiconductor device based on invention.
[Figure 2] Half How to identify non-defective conductor elements other It is a flowchart which shows an Example.
[Fig. 3] Half How to identify non-defective conductor elements other It is a flowchart which shows an Example.
[Fig. 4] Book It is explanatory drawing which shows the relationship between the discrimination | determination reference value in invention, and the frequency distribution of a measured value.
FIG. 5 is a block diagram showing an electrical configuration of a characteristic inspection apparatus to which an embodiment of the present invention is applied.
FIG. 6 is an explanatory view showing a semiconductor element formed on a wafer.
FIG. 7 is a flowchart showing a discrimination operation of a conventional technique.
FIG. 8 is an explanatory diagram showing a relationship between a reference value for discrimination and a frequency distribution of measured values in the prior art.
[Explanation of symbols]
1 Measurement controller
2 measuring instruments
4 Loader section
5 Test head
6 Unloader section
21 Wafer
211-213 Semiconductor device
AVaj, AVbj, AVcj statistics
LLoj, ULoj Preliminary reference value for discrimination
LLa [j], ULa [j] discrimination reference value
LLb [j], ULb [j] Discrimination reference value
LLc [j], ULc [j] Discrimination reference value

Claims (2)

In a method for determining the quality of individual semiconductor elements in the production process of semiconductor elements,
Measurement of a predetermined inspection item j is performed for all of the semiconductor elements belonging to the unit lot,
The measurement value of the inspection item j is stored in a memory in a one-to-one correspondence with each of the semiconductor elements that are the objects of measurement,
For each of the inspection item j, determined and the average value AVj and the standard deviation σj, based on the measured value stored in the memory, the determined average AVj and the standard deviation σj Toka RaHajime standard value of the lower limit value and LLj and the upper limit value ULj and arithmetic,
Two types of discrimination criteria indicating the quality criteria of the semiconductor element based on a discrimination reference value consisting of a preset minimum value LLoj and maximum value ULoj applied to all lots, and the lower limit value LLj and upper limit value ULj Compute the values LL [j] and UL [j]
A non-defective product of the semiconductor element, wherein the quality of the semiconductor element associated with the measured value is determined by comparing the measured value stored in the memory with the two types of determination reference values How to determine. The individual semiconductor elements are formed on a wafer;
The determination result of pass / fail is stored in a memory in association with the semiconductor element to be determined,
The semiconductor device according to claim 1, wherein a movement course of a device for applying a mark to the defective product is obtained based on a distribution on the wafer of the defective product indicated by the determination result stored in the memory. Non-defective product identification method.

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