JPH0419834Y2 - - Google Patents

Info

Publication number
JPH0419834Y2
JPH0419834Y2 JP1983162455U JP16245583U JPH0419834Y2 JP H0419834 Y2 JPH0419834 Y2 JP H0419834Y2 JP 1983162455 U JP1983162455 U JP 1983162455U JP 16245583 U JP16245583 U JP 16245583U JP H0419834 Y2 JPH0419834 Y2 JP H0419834Y2
Authority
JP
Japan
Prior art keywords
side frame
hole
resin side
attached
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983162455U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6071143U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16245583U priority Critical patent/JPS6071143U/ja
Publication of JPS6071143U publication Critical patent/JPS6071143U/ja
Application granted granted Critical
Publication of JPH0419834Y2 publication Critical patent/JPH0419834Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP16245583U 1983-10-20 1983-10-20 混成集積回路 Granted JPS6071143U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16245583U JPS6071143U (ja) 1983-10-20 1983-10-20 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16245583U JPS6071143U (ja) 1983-10-20 1983-10-20 混成集積回路

Publications (2)

Publication Number Publication Date
JPS6071143U JPS6071143U (ja) 1985-05-20
JPH0419834Y2 true JPH0419834Y2 (forum.php) 1992-05-06

Family

ID=30356740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16245583U Granted JPS6071143U (ja) 1983-10-20 1983-10-20 混成集積回路

Country Status (1)

Country Link
JP (1) JPS6071143U (forum.php)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5169362A (en) * 1974-12-13 1976-06-15 Hitachi Ltd Toranjisutano purintobantoritsukehoho

Also Published As

Publication number Publication date
JPS6071143U (ja) 1985-05-20

Similar Documents

Publication Publication Date Title
JPH08236667A (ja) 半導体装置
JP2001127238A (ja) 半導体モジュール及び半導体モジュール用絶縁基板
JPH047591B2 (forum.php)
JPH0419834Y2 (forum.php)
JP2636602B2 (ja) 半導体装置
JP2745786B2 (ja) Tab半導体装置
JP2996507B2 (ja) 金属板ベース回路基板
JP3117688B2 (ja) 表面実装用の半導体パッケージ
JPS60180147A (ja) 半導体装置
JPS5831424Y2 (ja) ハイブリッド・イグナイタ−
JP2904154B2 (ja) 半導体素子を含む電子回路装置
JPH0653681A (ja) 電子部品実装済み基板の樹脂被覆方法及び被覆生成物
JPH09321467A (ja) 発熱電子部品の放熱構造
JPH0129828Y2 (forum.php)
JPH0519984B2 (forum.php)
JP2018113311A (ja) 回路構成体
JP2804765B2 (ja) 電子部品塔載用基板
JP3039485B2 (ja) 表面実装用の半導体パッケージ及びその製造方法
JPS5972753A (ja) 樹脂封止形半導体装置
JPH0610717Y2 (ja) 混成集積回路
JPS5910796Y2 (ja) 電気機器の冷却構造
JP2000031340A (ja) 電子部品
JPH039341Y2 (forum.php)
JPH0870071A (ja) 放熱装置
JPH04207060A (ja) 半導体装置