JPH0419806Y2 - - Google Patents
Info
- Publication number
- JPH0419806Y2 JPH0419806Y2 JP1990125696U JP12569690U JPH0419806Y2 JP H0419806 Y2 JPH0419806 Y2 JP H0419806Y2 JP 1990125696 U JP1990125696 U JP 1990125696U JP 12569690 U JP12569690 U JP 12569690U JP H0419806 Y2 JPH0419806 Y2 JP H0419806Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- conductor pin
- printed wiring
- wiring board
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 42
- 239000004065 semiconductor Substances 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990125696U JPH0419806Y2 (de) | 1990-11-27 | 1990-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990125696U JPH0419806Y2 (de) | 1990-11-27 | 1990-11-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377459U JPH0377459U (de) | 1991-08-05 |
| JPH0419806Y2 true JPH0419806Y2 (de) | 1992-05-06 |
Family
ID=31673560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990125696U Expired JPH0419806Y2 (de) | 1990-11-27 | 1990-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0419806Y2 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5117282B2 (ja) * | 2008-05-27 | 2013-01-16 | 日立オートモティブシステムズ株式会社 | 配線基板及びこれを備えた電子装置 |
| JP2019169279A (ja) * | 2018-03-22 | 2019-10-03 | 株式会社アドヴィックス | プレスフィット端子接続装置 |
-
1990
- 1990-11-27 JP JP1990125696U patent/JPH0419806Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0377459U (de) | 1991-08-05 |
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