JPH0419789B2 - - Google Patents

Info

Publication number
JPH0419789B2
JPH0419789B2 JP60020057A JP2005785A JPH0419789B2 JP H0419789 B2 JPH0419789 B2 JP H0419789B2 JP 60020057 A JP60020057 A JP 60020057A JP 2005785 A JP2005785 A JP 2005785A JP H0419789 B2 JPH0419789 B2 JP H0419789B2
Authority
JP
Japan
Prior art keywords
rectifying
cooling fins
elements
pair
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60020057A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61180556A (ja
Inventor
Akihiro Saito
Masayoshi Tashiro
Keigo Naoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60020057A priority Critical patent/JPS61180556A/ja
Publication of JPS61180556A publication Critical patent/JPS61180556A/ja
Publication of JPH0419789B2 publication Critical patent/JPH0419789B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Synchronous Machinery (AREA)
JP60020057A 1985-02-06 1985-02-06 車両用交流発電機の整流装置 Granted JPS61180556A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60020057A JPS61180556A (ja) 1985-02-06 1985-02-06 車両用交流発電機の整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60020057A JPS61180556A (ja) 1985-02-06 1985-02-06 車両用交流発電機の整流装置

Publications (2)

Publication Number Publication Date
JPS61180556A JPS61180556A (ja) 1986-08-13
JPH0419789B2 true JPH0419789B2 (enExample) 1992-03-31

Family

ID=12016448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60020057A Granted JPS61180556A (ja) 1985-02-06 1985-02-06 車両用交流発電機の整流装置

Country Status (1)

Country Link
JP (1) JPS61180556A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3342978B2 (ja) * 1994-12-27 2002-11-11 三菱電機株式会社 車両用交流発電機
JP5439430B2 (ja) 2011-05-17 2014-03-12 日立オートモティブシステムズ株式会社 車両用交流発電機

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318514Y2 (enExample) * 1971-11-09 1978-05-17

Also Published As

Publication number Publication date
JPS61180556A (ja) 1986-08-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term