JPH0419702B2 - - Google Patents
Info
- Publication number
- JPH0419702B2 JPH0419702B2 JP58003264A JP326483A JPH0419702B2 JP H0419702 B2 JPH0419702 B2 JP H0419702B2 JP 58003264 A JP58003264 A JP 58003264A JP 326483 A JP326483 A JP 326483A JP H0419702 B2 JPH0419702 B2 JP H0419702B2
- Authority
- JP
- Japan
- Prior art keywords
- mercury
- thin film
- reaction tank
- vapor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
- 
        - H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
 
- 
        - C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
 
- 
        - H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
 
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Toxicology (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP326483A JPS59127833A (ja) | 1983-01-12 | 1983-01-12 | 励起気相析出法による薄膜の製造装置 | 
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP326483A JPS59127833A (ja) | 1983-01-12 | 1983-01-12 | 励起気相析出法による薄膜の製造装置 | 
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP15487989A Division JPH0637705B2 (ja) | 1989-06-16 | 1989-06-16 | 直接励起気相析出法による薄膜の製造装置 | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS59127833A JPS59127833A (ja) | 1984-07-23 | 
| JPH0419702B2 true JPH0419702B2 (cs) | 1992-03-31 | 
Family
ID=11552601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP326483A Granted JPS59127833A (ja) | 1983-01-12 | 1983-01-12 | 励起気相析出法による薄膜の製造装置 | 
Country Status (1)
| Country | Link | 
|---|---|
| JP (1) | JPS59127833A (cs) | 
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS59218721A (ja) * | 1983-05-27 | 1984-12-10 | Ushio Inc | 被膜形成方法 | 
| JPH01239919A (ja) * | 1988-03-22 | 1989-09-25 | Semiconductor Energy Lab Co Ltd | プラズマ処理方法およびプラズマ処理装置 | 
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS50130369A (cs) * | 1974-04-01 | 1975-10-15 | ||
| JPS56124229A (en) * | 1980-03-05 | 1981-09-29 | Matsushita Electric Ind Co Ltd | Manufacture of thin film | 
| JPS57202740A (en) * | 1981-06-05 | 1982-12-11 | Mitsubishi Electric Corp | Manufacture of semiconductor device | 
- 
        1983
        - 1983-01-12 JP JP326483A patent/JPS59127833A/ja active Granted
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS59127833A (ja) | 1984-07-23 | 
Similar Documents
| Publication | Publication Date | Title | 
|---|---|---|
| US6984595B1 (en) | Layer member forming method | |
| US4509451A (en) | Electron beam induced chemical vapor deposition | |
| US5427824A (en) | CVD apparatus | |
| US6013338A (en) | CVD apparatus | |
| US6786997B1 (en) | Plasma processing apparatus | |
| JP3415207B2 (ja) | 化学気相成長による金属薄膜形成方法 | |
| US5185179A (en) | Plasma processing method and products thereof | |
| JPH0620956A (ja) | 光cvd装置及び光cvd法 | |
| JPH08279498A (ja) | ラインプラズマ気相堆積装置及び方法 | |
| JPH0419702B2 (cs) | ||
| JPS60245217A (ja) | 薄膜形成装置 | |
| JP2626339B2 (ja) | 薄膜形成装置 | |
| JPH0637705B2 (ja) | 直接励起気相析出法による薄膜の製造装置 | |
| JPH0543393A (ja) | 炭素材料作製方法 | |
| JP2003281991A (ja) | 熱陰極及びこれを用いた放電装置 | |
| JP3522738B2 (ja) | 化学気相成長による金属薄膜形成方法 | |
| JP2562662B2 (ja) | アモルフアスシリコン膜の形成方法 | |
| JP4034841B2 (ja) | 窒化炭素及びその製造方法 | |
| JPS63241185A (ja) | 金属薄膜の堆積方法 | |
| JPS6138268B2 (cs) | ||
| JPS61143585A (ja) | 薄膜形成方法 | |
| JPH04105314A (ja) | 非晶質シリコンの製造方法 | |
| JPH0573046B2 (cs) | ||
| JPH0941147A (ja) | プラズマcvd方法 | |
| JPS61196528A (ja) | 薄膜形成方法 |