JPH0418717B2 - - Google Patents
Info
- Publication number
- JPH0418717B2 JPH0418717B2 JP58141557A JP14155783A JPH0418717B2 JP H0418717 B2 JPH0418717 B2 JP H0418717B2 JP 58141557 A JP58141557 A JP 58141557A JP 14155783 A JP14155783 A JP 14155783A JP H0418717 B2 JPH0418717 B2 JP H0418717B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- recess
- etching mask
- film
- periodic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 66
- 230000000737 periodic effect Effects 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000001312 dry etching Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 238000005253 cladding Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Semiconductor Lasers (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58141557A JPS6032383A (ja) | 1983-08-02 | 1983-08-02 | 周期構造体の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58141557A JPS6032383A (ja) | 1983-08-02 | 1983-08-02 | 周期構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6032383A JPS6032383A (ja) | 1985-02-19 |
JPH0418717B2 true JPH0418717B2 (enrdf_load_stackoverflow) | 1992-03-27 |
Family
ID=15294736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58141557A Granted JPS6032383A (ja) | 1983-08-02 | 1983-08-02 | 周期構造体の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6032383A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014164281A (ja) * | 2013-02-28 | 2014-09-08 | Fujifilm Corp | 微細凹凸構造体の製造方法およびその方法により製造される微細凹凸構造体 |
-
1983
- 1983-08-02 JP JP58141557A patent/JPS6032383A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6032383A (ja) | 1985-02-19 |
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