JPH04181747A - Shape of outer lead of tab - Google Patents

Shape of outer lead of tab

Info

Publication number
JPH04181747A
JPH04181747A JP2310485A JP31048590A JPH04181747A JP H04181747 A JPH04181747 A JP H04181747A JP 2310485 A JP2310485 A JP 2310485A JP 31048590 A JP31048590 A JP 31048590A JP H04181747 A JPH04181747 A JP H04181747A
Authority
JP
Japan
Prior art keywords
leads
rows
tab
pitch
outer lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2310485A
Other languages
Japanese (ja)
Inventor
Takashi Ito
隆 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2310485A priority Critical patent/JPH04181747A/en
Publication of JPH04181747A publication Critical patent/JPH04181747A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE:To reduce a solder bridge and to enhance the yield of a soldering operation by a method wherein connecting parts of outer leads are formed in a plurality of rows so that the leads can be connected easily even when the pitch between the leads is made fine. CONSTITUTION:Connecting parts of outer leads 1, 2 are arranged in two or more rows. Consequently, the distance between bonding parts can be separated. For example, when they are formed in two rows, the connecting parts of the outer leads are arranged alternately, the pitch of their bonding parts can be made doubly coarse, and the distance between the bonding parts can be made twice or higher. That is to say, when the width of the outer leads is designated as (a) and the interval between the leads is designated as (b), the pitch of the bonding parts is doubled as 2a+2b, and the interval between the leads 1, 2 becomes twice or higher as a+2b. Thereby, even when the pitch between the leads is made fine, the leads can be connected easily to the outside, a solder bridge is reduced and the yield of a soldering operation can be enhanced.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明はＴＡＢをはんだ付は等の方法により接合するの
に用いるアウターリードの形状に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the shape of an outer lead used for joining TABs by a method such as soldering.

［従来の技術］ 従来、ＴＡＢのアウターリードの外部との接続部は一列
となっていた。アウターリード巾はその強度から制約さ
枳　アウターワード間隔ははんだ技術より制約されるこ
とから、リードピン数が増すにつれてＴＡＢサイズを大
きくする必要があっ［発明が解決しようとする課題］ しかし、ＴＡＢサイズが大きくなると基板等へ実装する
のに要する面積も同様に大きくなり実装上のデメリット
が問題となってくる。ＴＡＢサイズを抑えた場合、多ビ
ンＴＡＢになるとり一ドピッチが細かくなり、外部との
接続が困難となる。[Prior Art] Conventionally, the connection portions of the outer leads of the TAB with the outside have been arranged in a row. The outer lead width is limited by its strength. Since the outer word spacing is limited by soldering technology, it is necessary to increase the TAB size as the number of lead pins increases [Problem to be solved by the invention] However, the TAB size As the size increases, the area required for mounting it on a board etc. also increases, resulting in disadvantages in mounting. If the TAB size is suppressed, the pitch of the multi-bin TAB becomes fine, making it difficult to connect to the outside.

はんだ付けを例にすると、はんだブリッジあるいは未は
んだの発生頻度が高くなり、はんだ付は歩留りの低下を
招いていた。Taking soldering as an example, solder bridges or unsoldered surfaces occur more frequently, leading to lower yields in soldering.

そこで、本発明は従来のこのような問題点を解決するた
め、ＴＡＢアウターリードの接続部の配列を一列ではな
くしてリードピッチが細かくなっても外部との接続が容
易に実現できることを目的とする。Therefore, in order to solve these conventional problems, it is an object of the present invention to arrange the connecting portions of the TAB outer leads in a row rather than in a single row, so that even if the lead pitch becomes fine, connection with the outside can be easily realized. .

［課題を解決するための手段］ 本発明のＴＡＢのアウターリード形状は、アウターリー
ドの接続部の配列を２列以上としたことを特徴とする。[Means for Solving the Problems] The outer lead shape of the TAB of the present invention is characterized in that the connection portions of the outer leads are arranged in two or more rows.

［作用］ 本発明によれば、アウターリードの接続部の配列を複数
列とすることにより、接合部間の距離を離すことができ
る。２列とした場合には、アウターリードの接続部は互
い違いに配置されることになり、接合部ピッチは２倍に
粗くすることができる。これにより、接合部間の距離は
２倍以上となる。[Function] According to the present invention, by arranging the connecting portions of the outer leads in multiple rows, the distance between the connecting portions can be increased. In the case of two rows, the connecting portions of the outer leads are arranged alternately, and the pitch of the connecting portions can be made twice as coarse. As a result, the distance between the joints is more than doubled.

はんだ付けを例にすると、はんだブリッジの減少に大き
な効果を発揮し、はんだ付は歩留りの向上が図れる。Taking soldering as an example, it has a great effect on reducing solder bridges and can improve yields.

［実施例］ 第１図は本発明において、アウターリードの接続部の配
列を２列とした場合の図である。ここで接続部は互い違
いの配置となっている。[Example] FIG. 1 is a diagram in which the connection portions of the outer leads are arranged in two rows in the present invention. Here, the connections are arranged in a staggered manner.

第２図は従来どうりの】列のアウターリード配列の図で
ある。アウターリード巾をａ、リード間をｂとすると、
リードピッチはａ十すとなる。ハンダブリッジはリード
間に発生することからｂ（：よって決定される。FIG. 2 is a diagram of a conventional row outer lead arrangement. If the outer lead width is a and the distance between the leads is b,
The lead pitch will be a. Since solder bridges occur between leads, b(: is determined accordingly.

一方、第１図においては接合部ピッチは２ａ＋２ｂと第
２図の２倍となり、さらにリード間はａ＋２ｂと２倍以
上となることから、はんだブリッジの発生が抑えられる
。On the other hand, in FIG. 1, the joint pitch is 2a+2b, twice that in FIG. 2, and the distance between the leads is a+2b, which is more than double, so that the occurrence of solder bridges can be suppressed.

従来、ハンダ付けの技術によってリード間隔すが決定さ
れ、リードの強度によりａが決定されていたことにより
リード本数が増すにつれて接合に要する面積が拡大する
ことになっていた。しかし、アウターワードの接続部の
配列を２列とした場合、接合に要する面積を広げずにア
ウターリードピッチを細かくすることができる。Conventionally, the lead spacing was determined by the soldering technique, and a was determined by the strength of the leads, so that as the number of leads increased, the area required for joining increased. However, when the connecting portions of the outer words are arranged in two rows, the outer lead pitch can be made finer without increasing the area required for bonding.

第３図はアウターワードの接合部の配列を３列とした場
合の図である。３列以上の場合の効果はさらに大きくな
る。FIG. 3 is a diagram in which the outer word joints are arranged in three rows. The effect becomes even greater when there are three or more rows.

［発明の効果］ 以上述べたように本発明によれば、アウターリードの接
合部の配列を複数列とすることにより、ＴＡＢを基板等
へ実装するのに要する面積を拡大せずに、多ビンＴＡＢ
の実装を実現できるという効果を有する。[Effects of the Invention] As described above, according to the present invention, by arranging the joint portions of the outer leads in multiple rows, multiple bins can be mounted without increasing the area required for mounting the TAB on the board etc. TAB
This has the effect of realizing the implementation of

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示し、第１図（Ａ）は平面
図、第１図（Ｂ）は断面図である。 第２図は従来のＴＡＢのアウターリード形状を示し、第
２図（Ａ）は平面図、第２図（Ｂ）は断面図である。 第３図は本発明の一実施例であり、ＴＡＢアウターリー
ド接合部の配列を３列とじ力場台であり、第３図（Ａ）
は平面図、第３図（Ｂ）は断面図である。 １、　２．　３−−−−　アウターリード斜線部は接合
部を示す ４−−−ＴＡＢのＩＣ内蔵部 以上 出願人　セイコーエプソン株式会社 代理人　弁理士　鈴木喜三部（他１名）第１図（Ａ） １乙 卜（２）（肋 ２２願Δジ 名２図（Ｂ） ど〉ノ 晃３０小）FIG. 1 shows an embodiment of the present invention, with FIG. 1(A) being a plan view and FIG. 1(B) being a sectional view. FIG. 2 shows the outer lead shape of a conventional TAB, with FIG. 2(A) being a plan view and FIG. 2(B) being a sectional view. FIG. 3 shows an embodiment of the present invention, which is a force field table in which the TAB outer lead joints are arranged in three rows.
is a plan view, and FIG. 3(B) is a sectional view. 1, 2. 3 ---- The shaded part of the outer lead indicates the joint part 4 - - IC built-in part of TAB and above Applicant Seiko Epson Co., Ltd. Agent Patent attorney Kizobe Suzuki (and 1 other person) Figure 1 (A) 1 Otoboku (2) (22 ribs, 2 names, 2 figures (B), Do〉noaki 30th grade)

Claims (1)

【特許請求の範囲】[Claims] ＴＡＢアウターリードの接続部の配列を２列以上とした
ことを特徴とするＴＡＢのアウターリード形状。A TAB outer lead shape characterized by having connection parts of the TAB outer leads arranged in two or more rows.
JP2310485A 1990-11-16 1990-11-16 Shape of outer lead of tab Pending JPH04181747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2310485A JPH04181747A (en) 1990-11-16 1990-11-16 Shape of outer lead of tab

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2310485A JPH04181747A (en) 1990-11-16 1990-11-16 Shape of outer lead of tab

Publications (1)

Publication Number Publication Date
JPH04181747A true JPH04181747A (en) 1992-06-29

Family

ID=18005804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2310485A Pending JPH04181747A (en) 1990-11-16 1990-11-16 Shape of outer lead of tab

Country Status (1)

Country Link
JP (1) JPH04181747A (en)

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