JPH01186388A - Solder-printing mask, production thereof, and solder-printing method - Google Patents
Solder-printing mask, production thereof, and solder-printing methodInfo
- Publication number
- JPH01186388A JPH01186388A JP1068688A JP1068688A JPH01186388A JP H01186388 A JPH01186388 A JP H01186388A JP 1068688 A JP1068688 A JP 1068688A JP 1068688 A JP1068688 A JP 1068688A JP H01186388 A JPH01186388 A JP H01186388A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pattern
- printed
- adjacent
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 78
- 238000004080 punching Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Printing Methods (AREA)
- Printing Plates And Materials Therefor (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント配線基板の配線パターン上にハンダ
を印刷する際に使用するハンダ印刷マスク、その製造方
法およびハンダ印刷方法に関するもの′である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder printing mask used when printing solder on a wiring pattern of a printed wiring board, a manufacturing method thereof, and a solder printing method.
プリント配線基板の配線パターン上にノ・ンダを印刷す
る場合には、「ソルダリング・イン・エレクトロニクス
ｊ（１９８６年）３７６〜３７５頁に記載されているよ
うに、ハンダを印刷すべきパターンを有するマスクが使
用されている。When printing solder on the wiring pattern of a printed wiring board, as described in "Soldering in Electronics J (1986) pp. 376-375," Masks are used.
第５図は従来のハンダ印刷マスクの一部を示す図、第７
図は第５図に示したハンダ印刷マスクによりプリント配
線基板にハンダを印刷した状態を示す図、第８図は第７
図のＡ−Ａ断面図である。Figure 5 is a diagram showing a part of a conventional solder printing mask;
The figure shows a state in which solder is printed on a printed wiring board using the solder printing mask shown in Fig. 5, and Fig.
It is an AA sectional view of the figure.
図において、１はプリント配線基板本体、２は基板本体
１の表面に隣接して形成された複数の接続パッド、３は
接続パッド２上に印刷されたノ＼ンダ、５はハンダ印刷
マスク本体、６はマスク本体５に設けられた印刷パター
ンで、印刷パターン６の形状は接続パッド２の形状と同
一である。In the figure, 1 is a printed wiring board main body, 2 is a plurality of connection pads formed adjacent to the surface of the board main body 1, 3 is a node printed on the connection pad 2, 5 is a solder printing mask main body, 6 is a printed pattern provided on the mask body 5, and the shape of the printed pattern 6 is the same as the shape of the connection pad 2.
第６図は従来の他のハンダ印刷マスクの一部を示す図１
、第９図は第６図に示したノ・ンダ印刷マスクによりプ
リント配線基板にハンダを印刷した状態を示す図である
。図において、４は接続パッド２上に印刷されたハンダ
、７はノーンダ印刷マスク−本体、８はマスク本体７に
設けられた印刷パターンで、印刷パターン８の寸法は接
続パッド２０寸法よりも大きい。Figure 6 is Figure 1 showing a part of another conventional solder printing mask.
9 is a diagram showing a state in which solder is printed on a printed wiring board using the solder printing mask shown in FIG. 6. In the figure, 4 is the solder printed on the connection pad 2, 7 is the solder printing mask body, and 8 is the print pattern provided on the mask body 7, and the size of the print pattern 8 is larger than the size of the connection pad 20.
しかし、このようなノ・ンダ印刷マスクによってハンダ
３．４を印刷したときには、隣接するノ・ンダ３間の距
離１１ｍが隣接する接続パッド２間の距離と同等となり
、また隣接するノ・ンダ４間の距離（２ａが隣接する接
続パッド２間の距離よりも短くなるから、接続パッド２
を高密度で設けたときには、距離１１ａ 、１２ａが小
さくなり、）・ンダ６．４をリフローしたときに、ブリ
ッジが発生するおそれがあるので、信頼性が低い。また
、接続パッド２を高密度で設けたときには、隣接する印
刷パターン６間の距離１．、 、隣接する印刷パターン
８間の距離１２．が小さくなるので、印刷パターン６．
８をエツチングにより設けなければならないから印刷パ
ターン６．８を形成する作業を行なうのが面倒であり、
しかも”印刷パター７′６．８の形状精・ ６ ・
度を向上させるためには、マスク本体５．７の厚さを小
さくシナげればならないので、ハンダ印刷作業を行なう
のが面倒である。However, when the solder 3.4 is printed using such a solder printing mask, the distance 11 m between adjacent solders 3 becomes the same as the distance between adjacent connection pads 2, and the distance between adjacent solders 4 Since the distance between (2a) is shorter than the distance between adjacent connection pads 2,
When they are provided at high density, the distances 11a and 12a become small, and there is a risk of bridging occurring when reflowing the conductor 6.4, resulting in low reliability. Further, when the connection pads 2 are provided at high density, the distance between adjacent printed patterns 6 is 1. , , Distance between adjacent printed patterns 8 12. is smaller, so print pattern 6.
8 must be provided by etching, so the work of forming the printed pattern 6.8 is troublesome;
Moreover, in order to improve the shape precision of the printed pattern 7'6.8, the thickness of the mask body 5.7 must be reduced, making the solder printing process troublesome. .
この発明は上述の問題点を解決するためになされたもの
で、ハンダのりフロー時にブリッジが発生するおそれが
なく、印刷パター゛ンを形成する作業が容易であり、し
かもマスク本体の厚さを太きくすること・が−できるハ
ンダ印刷マス−り、その製造方法およ−びハンダ印刷方
法を提供することを目的とする。This invention was made to solve the above-mentioned problems, and there is no risk of bridges occurring during solder paste flow, the work of forming a printed pattern is easy, and the thickness of the mask body can be increased. It is an object of the present invention to provide a solder printing mass that can be used in a variety of applications, a method for manufacturing the same, and a method for printing solder.
この目的を達成するため、こ・の発明においてはプリン
ト配線基板の隣接゛して設けら、れた複数の配線パター
ン上にハンダを印刷する際に、使用、するノ・ンダ印刷
マスクにおいて、印刷パターンに幅が上記配線パターン
の幅よりも小さい小９幅蔀と幅が上記配線パターンの幅
よりも大きい大幅部とを設は上記印刷、パターンの上記
小幅部と“その印刷パターンと相隣接した上記印刷パタ
ーンの上記大幅部とを隣接させる。また、プリント配線
基板の隣接し° ４ 。In order to achieve this object, in this invention, a solder printing mask used when printing solder on a plurality of adjacent wiring patterns of a printed wiring board, The pattern has a small 9-width shoulder whose width is smaller than the width of the wiring pattern and a wide part whose width is larger than the width of the wiring pattern. The wide portion of the printed pattern is adjacent to the printed wiring board.
て設けられた複数の配線パターン上にハンダを印刷する
際に使用され、印刷パターンに幅が上記配線パターンの
幅より電車ざい小幅部と幅が上記配線パターンの幅より
も大きい大幅部とが設けられ、上記印刷パターンの上記
小幅部とその印刷パターノーと相隣接した上記印刷パタ
ーンの上記大幅部とを隣接させたハンダ印刷マスクを製
造する方法において、上記印刷パターンを機械的な打抜
きにより一括して形成する。さらに、プリント配線基板
の隣接して設け、られた複数の配線パターン上にハン、
ダを印刷する方法において、印刷パターンに幅が上記配
線パターンの幅よりも小さい小幅部と幅が上記配線パタ
ーンの幅よりも大きい大幅部とが設けられ、上記印刷パ
ターンの上記小幅部とその印な刷パターンと相隣接した
上記印刷パターンの上記大幅部とを隣、接させたハンダ
印刷マスクを使用する・
〔作用〕 ・
このハンダ印刷マスク、その製造方法およびハンダ印刷
方法においては、隣接するハンダ間、印刷パターン間の
距離を隣接する配線パターン間の距離より長くすること
ができるから、配線パターンを高密度で設けたときにも
、隣接するハンダ間の距離を大きくすることができ、ま
た印刷パターン間の距離を大きくすることができる。It is used when printing solder on a plurality of wiring patterns provided in a printed pattern, and the printed pattern has a narrower width part than the width of the wiring pattern and a wide part whose width is larger than the width of the wiring pattern. In the method for manufacturing a solder printing mask in which the narrow portion of the printed pattern and the wide portion of the printed pattern adjacent to the printed pattern are adjacent to each other, the printed pattern is collectively punched by mechanical punching. Form. Furthermore, a hanger is placed on a plurality of wiring patterns arranged adjacent to each other on a printed wiring board.
In the method of printing the printed pattern, the printed pattern is provided with a narrow portion having a width smaller than the width of the wiring pattern and a wide portion having a width larger than the width of the wiring pattern, and the narrow portion of the printed pattern and the mark thereof are provided. A solder printing mask is used in which the printed pattern and the large part of the adjacent printed pattern are adjacent to each other. Since the distance between printed patterns can be made longer than the distance between adjacent wiring patterns, the distance between adjacent solder can be increased even when wiring patterns are provided at high density. The distance between patterns can be increased.
第１図はこの発明に係るハンダ印刷マスクの一部を示す
図、第３図は第１図に示したハンダ印刷マスクによりプ
リント配線基板にハンダを印刷した状態を示す図である
。図において、１３は接続パッド２上に印刷されたハン
ダ、９はハンダ印刷マスク本体、１０はマスク本体９に
設けられた印刷パターンで、印刷パターン１０は機械的
な打抜きにより一括して形成されている。１０αは印刷
パターン１０の幅が接続パッド２の幅よりも小さい小幅
部、１０ｂは印刷パターン１００幅が接続パッド２０幅
よりも大きい大幅部で、印刷パターン１０の小幅部１０
αとその印刷パターン１０と相隣接した印刷パターン１
０の大幅部１０Ａとが隣接しており、隣接するハンダ１
５間の距離／３ａ 、 １４ａ−隣接する印刷パターン
１０間の距離１３ｈ、 １４ｈは隣接する接続パッド２
間の距離より大きく、さらに印刷パターン１００面積は
接続バッド２０面積とほぼ等しい。FIG. 1 is a diagram showing a part of a solder printing mask according to the present invention, and FIG. 3 is a diagram showing a state in which solder is printed on a printed wiring board using the solder printing mask shown in FIG. 1. In the figure, 13 is the solder printed on the connection pad 2, 9 is the solder printing mask body, and 10 is the printed pattern provided on the mask body 9. The printed pattern 10 is formed all at once by mechanical punching. There is. 10α is a narrow part where the width of the printed pattern 10 is smaller than the width of the connection pad 2; 10b is a wide part where the width of the printed pattern 100 is larger than the width of the connection pad 20;
α and its printed pattern 10 and adjacent printed pattern 1
0 is adjacent to the large part 10A, and the adjacent solder 1
Distance between 5/3a, 14a - Distance 13h between adjacent printed patterns 10, 14h is the distance between adjacent connection pads 2
Furthermore, the area of the printed pattern 100 is approximately equal to the area of the connection pad 20.
第２図はこの発明に係る他のハンダ印刷マスクの一部を
示す図、第４図は第２図に示したハンダ印刷マスクによ
りプリント配線基板にハンダを印刷した状態を示す図で
ある。図において、１４は接続パッド２上に印刷された
ハンダ、１１はハンダ印刷マスク本体、１２はマスク本
体１１に設けられた印刷パターンで、印刷パターン１２
は機械的な打抜きにより一括して形成されている。１２
ｊは印刷パターン１２の幅が接続パッド２０幅よりも小
さい小幅部、１２Ａは印刷パターン１２０幅が接続パッ
ド２の幅よりも大きい大幅部で５印刷パターン１２の小
幅部１２αとその印刷パターン、１２と相隣接した印刷
パターン１２０大幅部１２ｂとが隣接しており、隣接す
るハンダ１４間の距離１５３．隣接する印刷パターン１
２間の距離４５．は隣接する接続パッド２間の距離より
太きく、さらに印刷パターン１２０面積は接続′ パッ
ド２の面積よりも太きい。FIG. 2 is a diagram showing a part of another solder printing mask according to the present invention, and FIG. 4 is a diagram showing a state in which solder is printed on a printed wiring board using the solder printing mask shown in FIG. 2. In the figure, 14 is the solder printed on the connection pad 2, 11 is the solder printing mask body, and 12 is the print pattern provided on the mask body 11.
are formed all at once by mechanical punching. 12
j is a narrow part where the width of the printed pattern 12 is smaller than the width of the connection pad 20; 12A is a wide part where the width of the printed pattern 120 is larger than the width of the connection pad 2; 5 the narrow part 12α of the printed pattern 12 and its printed pattern; The wide portions 12b of the adjacent printed patterns 120 are adjacent to each other, and the distance between the adjacent solders 14 is 153. Adjacent print pattern 1
Distance between 245. is larger than the distance between adjacent connection pads 2, and the area of the printed pattern 120 is larger than the area of the connection pads 2.
・ ７ ・
そして、基板本体１のハンダ濡れ性は接続パッド２のハ
ンダ濡れ性よりも劣るので、ハンダ１３゜１４をリフロ
ーしたときには、ハンダ１３．１４の基板本体１上に設
けられた部分は、接続パッド２上に移動する。・ 7 ・ Since the solder wettability of the board body 1 is inferior to that of the connection pad 2, when the solder 13 and 14 are reflowed, the portions of the solder 13 and 14 provided on the board body 1 are Move onto connection pad 2.
このように、隣接するハンダ１６間の距離１５ａ、ｊ４
３．隣接するハンダ１４間の距離１５ａが隣接する接続
パッド２間の距離より大きいから、接続パッド２を高密
度で設けたとしても、距離’Ｓｇ 、 ’４ｍ、ム、が
大きくなり、ハンダ１３．１４をリフローしたときにも
、ブリッジが発生するおそれがないので、信頼性が向上
する。また、隣接する印刷パターン１０間の距離！３６
．１４．、隣接する印刷パターン１２間の距離Ａｓｋは
隣接する接続パッド２間の距離より太きいから、接続パ
ッド２を高密度で設けたとしても、距離ｔｓｈ、ｊａｂ
、１５４が大きくなるから、印刷パターン１０．１２を
エツチングにより設ける必要がなく、印刷パターン１０
．１２を機械的な打抜きにより一括して形成することが
できるので、印刷パターン１０．１２を形成する作業を
容易に行なうこ・ ８ ・
２ができ、しかも印刷パターン１０．１２の形状精度を
向上させるために、マスク本体９，１１０厚さを小さく
する必要がなく、マスク本体９，１１０厚さを大きくす
ることができるので、ハンダ印刷作業を容易に行なうこ
とができる。In this way, the distance 15a, j4 between adjacent solders 16
3. Since the distance 15a between adjacent solder pads 14 is larger than the distance between adjacent connection pads 2, even if the connection pads 2 are provided at high density, the distance 'Sg, '4m, m, becomes large and the solder 13.14 Since there is no risk of bridging occurring even when reflowing, reliability is improved. Also, the distance between adjacent printed patterns 10! 36
．． 14. , since the distance Ask between adjacent printed patterns 12 is larger than the distance between adjacent connection pads 2, even if the connection pads 2 are provided at high density, the distances tsh, jab
, 154 are large, there is no need to provide the printed pattern 10.12 by etching, and the printed pattern 10.
．． 12 can be formed all at once by mechanical punching, so the work of forming the printed pattern 10.12 can be easily carried out, and the shape accuracy of the printed pattern 10.12 can be improved. Therefore, there is no need to reduce the thickness of the mask bodies 9, 110, and the thickness of the mask bodies 9, 110 can be increased, so that solder printing work can be easily performed.
なお、印刷パターンの形状は印刷パターン１０゜１２の
形状に限定されないことは当然である。Note that it goes without saying that the shape of the print pattern is not limited to the shape of the print pattern 10°12.
以上説明己だように、この発明に係るハンダ印刷マスク
、その製造方法およびハンダ印刷方法においては、配線
パターンを高密度で設けたときにも、隣接するハンダ間
の距離を太きくすることができ、また印刷パターン間の
距離を太きくすることができるから、ハンダのりフロー
時にブリッジが発生するおそれがないので、信頼性が向
上し、また印刷パターンを形成する作業が容易であり、
しかもマスク本体の厚さを大きくすることができるので
、ハンダ印刷作業を容易に行なうことができる。このよ
うに、この発明の効果は顕著である。As explained above, in the solder printing mask, its manufacturing method, and solder printing method according to the present invention, even when wiring patterns are provided at high density, the distance between adjacent solders can be increased. In addition, since the distance between printed patterns can be made thicker, there is no risk of bridges occurring during solder paste flow, improving reliability and making it easier to form printed patterns.
Furthermore, since the thickness of the mask body can be increased, solder printing work can be easily performed. As described above, the effects of this invention are remarkable.
第１図はこの発明に係るハンダ印刷マスクの一部を示す
図、第２図はこの発明に係る他のハンダ印刷マスクの一
部を示す図、第３図は第１図に示したハンダ印刷マスク
によりプリント配線基板にハンダを印刷した状態を示す
図、第４図は第２図に示したハンダ印刷マスクによりプ
リント配線基板にハンダを印刷した状態を示す図、第５
図は従来のハンダ印刷マスクの一部を示す図、第６図は
従来の他のハンダ印刷マスクの一部を示す図、第７図は
第５図に示したハンダ印刷マスクによりプリント配線基
板にハンダを印刷した状態を示す図、第８図は第７図の
Ａ−Ａ断面図、第９図は第６図に示したハンダ印刷マス
クによりプリント配線基板にハンダを印刷した状態を示
す図である。
１・・・・・・・・・・・プリント配線基板本体２・・
・・・・・・・・・接続パッド
９・・・・・・・・・・・・ハンダ印刷マスク本体１０
・・・・・・・・・印刷ハターン
１０α・・・・・・小幅部
１０ｂ・・・・・・太幅部
１１・・・・・・・・・ハンダ印刷マスク本体１２・・
・・・・・・・印刷パターン
１２α・・・・・・小幅部
１２６・・・・・・太幅部
１５．１４・・・ハンダ
代理人 弁理士 小 川 勝 男
７図FIG. 1 is a diagram showing a part of the solder printing mask according to the present invention, FIG. 2 is a diagram showing a part of another solder printing mask according to the invention, and FIG. 3 is a diagram showing the solder printing shown in FIG. 1. 4 is a diagram showing a state in which solder is printed on a printed wiring board using a mask; FIG. 4 is a diagram showing a state in which solder is printed on a printed wiring board using the solder printing mask shown in FIG. 2;
The figure shows a part of a conventional solder printing mask, Fig. 6 shows a part of another conventional solder printing mask, and Fig. 7 shows a printed wiring board using the solder printing mask shown in Fig. 5. Figure 8 is a cross-sectional view taken along the line A-A in Figure 7, and Figure 9 is a diagram showing solder printed on a printed wiring board using the solder printing mask shown in Figure 6. be. 1...Printed wiring board body 2...
...... Connection pad 9 ...... Solder printing mask body 10
......Print pattern 10α...Narrow width section 10b...Thick width section 11...Solder printing mask body 12...
...Print pattern 12α...Narrow width section 126...Wide width section 15.14...Solder agent Patent attorney Masaru Ogawa Male Figure 7
Claims (3)
パターン上にハンダを印刷する際に使用するハンダ印刷
マスクにおいて、印刷パターンに幅が上記配線パターン
の幅よりも小さい小幅部と幅が上記配線パターンの幅よ
りも大きい大幅部とを設け、上記印刷パターンの上記小
幅部とその印刷パターンと相隣接した上記印刷パターン
の上記大幅部とを隣接させたことを特徴とするハンダ印
刷マスク。1. In a solder printing mask used when printing solder on a plurality of adjacent wiring patterns of a printed wiring board, the printed pattern has a narrow portion whose width is smaller than the width of the wiring pattern and a width of the wiring pattern. A solder printing mask characterized in that the narrow width part of the printed pattern is adjacent to the wide part of the printed pattern that is adjacent to the narrow width part of the printed pattern.
パターン上にハンダを印刷する際に使用され、印刷パタ
ーンに幅が上記配線パターンの幅よりも小さい小幅部と
幅が上記配線パターンの幅よりも大きい大幅部とが設け
られ、上記印刷パターンの上記小幅部とその印刷パター
ンと相隣接した上記印刷パターンの上記大幅部とを隣接
させたハンダ印刷マスクを製造する方法において、上記
印刷パターンを機械的な打抜きにより一括して形成する
ことを特徴とするハンダ印刷マスクの製造方法。2. It is used when printing solder on a plurality of adjacent wiring patterns on a printed wiring board, and the printed pattern has a narrow part whose width is smaller than the width of the wiring pattern, and a narrow part whose width is wider than the width of the wiring pattern. A method for manufacturing a solder printing mask in which a large wide portion is provided, and the narrow portion of the printed pattern is adjacent to the wide portion of the printed pattern that is adjacent to the printed pattern, wherein the printed pattern is mechanically A method for manufacturing a solder printing mask, characterized in that it is formed all at once by punching.
パターン上にハンダを印刷する方法において、印刷パタ
ーンに幅が上記配線パターンの幅よりも小さい小幅部と
幅が上記配線パターンの幅よりも大きい大幅部とが設け
られ、上記印刷パターンの上記小幅部とその印刷パター
ンと相隣接した上記印刷パターンの上記大幅部とを隣接
させたハンダ印刷マスクを使用することを特徴とするハ
ンダ印刷方法。3. In a method of printing solder on a plurality of adjacent wiring patterns on a printed wiring board, the printed pattern has a small width part whose width is smaller than the width of the wiring pattern and a large part whose width is larger than the width of the wiring pattern. A solder printing method characterized by using a solder printing mask in which the narrow width part of the print pattern and the wide part of the print pattern adjacent to the print pattern are adjacent to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1068688A JPH01186388A (en) | 1988-01-22 | 1988-01-22 | Solder-printing mask, production thereof, and solder-printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1068688A JPH01186388A (en) | 1988-01-22 | 1988-01-22 | Solder-printing mask, production thereof, and solder-printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01186388A true JPH01186388A (en) | 1989-07-25 |
Family
ID=11757153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1068688A Pending JPH01186388A (en) | 1988-01-22 | 1988-01-22 | Solder-printing mask, production thereof, and solder-printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01186388A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001097580A1 (en) * | 2000-06-12 | 2001-12-20 | Hitachi, Ltd. | Electronic device and method of manufacturing the electronic device |
| WO2003092345A1 (en) * | 2002-04-24 | 2003-11-06 | Honeywell International Inc. | Modified aperture for surface mount technology (smt) screen printing |
-
1988
- 1988-01-22 JP JP1068688A patent/JPH01186388A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001097580A1 (en) * | 2000-06-12 | 2001-12-20 | Hitachi, Ltd. | Electronic device and method of manufacturing the electronic device |
| WO2003092345A1 (en) * | 2002-04-24 | 2003-11-06 | Honeywell International Inc. | Modified aperture for surface mount technology (smt) screen printing |
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