TWI771400B - Assembly hole structure - Google Patents

Abstract

An assembly hole structure includes a first pad, a first through hole, two first solders and two second solders. The first through hole is located in the first pad and penetrates the first pad and a circuit board. The first solders respectively extend from two first striped edges of the first pad to the circuit board. The second solders respectively extend from two first arc edges of the first pad to the circuit board. An orthographic projection area of each of the first solders extending from a corresponding first striped edge on the circuit board is 20% of an orthographic projection area of each of the first solders on the first pad. An orthographic projection area of each of the second solders extending from a corresponding first arc edge on the circuit board is 10% of an orthographic projection area of each of the second solders on the first pad.

Description

Assembly hole structure

The present invention relates to an assembly hole structure, and more particularly, to an assembly hole structure disposed on a circuit board.

At present, in the printed circuit board with organic solderability preservatives (OSP) as the solder resist layer, the solder hole structure is formed by spot welding on the solder pad through Surface Mounting Technology (SMT). However, in the subsequent reflow bonding process, if the proportion of the reflowed solder covering the solder pads is too low, the solder pads will be oxidized, thereby affecting the soldering quality. On the contrary, if there is too much solder after reflow, it will fill in the through holes and cause the holes to be blocked, so that the subsequent assembly process with the battery module cannot be performed.

The present invention provides an assembly hole structure with better structural reliability.

The assembly hole structure of the present invention is suitable for disposing on a circuit board. The assembly hole structure includes a first solder pad, a first through hole, two first solders and two second solders. The first pad is disposed on the circuit board and has a first surface. The first surface has two first strip-shaped edges opposite to each other and two first arc-shaped edges that are symmetrical to each other and connect the first strip-shaped edges. The first through hole is located in the first bonding pad and penetrates through the first bonding pad and the circuit board. The first through hole has two second strip-shaped edges opposite to each other and two second arc-shaped edges symmetrical to each other and connected to the second strip-shaped edges. The second strip edge is parallel to the first strip edge, and the second arc edge is parallel to the first arc edge. The first solders are symmetrically arranged on the first surface of the first pads and respectively extend from the first strip-shaped edges to the circuit board. Viewed from a top view, the first solders and the first through holes are arranged at intervals, and the orthographic projection area of each first solder extending from the corresponding first strip edge to the circuit board is equal to the size of each first solder on the first 20% of the orthographic projected area on the pad. The second solder is symmetrically arranged on the first surface of the first pad, and respectively extends from the first arc edge to the circuit board. The first solder and the second solder are separated from each other and expose a portion of the first arc edge. Viewed from a top view, the second solders and the first through holes are arranged at intervals, and the orthographic projection area of each second solder extending from the corresponding first arc-shaped edge to the circuit board is equal to the size of each second solder on the first 10% of the orthographic projected area on the pad.

In an embodiment of the present invention, a shortest distance between the second strip-shaped edges of the first through hole is 0.5 mm.

In an embodiment of the present invention, a first shortest distance between each second strip edge of the first through hole and an adjacent strip edge of the first solder is 0.1 mm. A second shortest distance between each second arc-shaped edge of the first through hole and an adjacent arc-shaped edge of the second solder is 0.15 mm.

In an embodiment of the present invention, a minimum width of each of the above-mentioned first solders in a direction perpendicular to the second strip edge of the first through hole is 0.5 mm.

In an embodiment of the present invention, a minimum width of each of the second solders in a direction parallel to the second strip edge of the first through hole is 0.45 mm.

In an embodiment of the present invention, a shortest distance between each of the above-mentioned second solders and the adjacent first solders is 0.35 mm.

In an embodiment of the present invention, the orthographic projection of an arc-shaped edge of each of the first solders relatively far away from the first through hole on the circuit board is the difference between the orthographic projection of the corresponding first strip-shaped edge on the circuit board. The shortest distance between them is 0.1 mm.

In an embodiment of the present invention, the above-mentioned assembly hole structure further includes a second solder pad, two third solders and two fourth solders. The second pad is disposed on the circuit board and has a second surface. The second surface has two third strip-shaped edges opposite to each other and two third arc-shaped edges symmetrical to each other and connecting the third strip-shaped edges. The second bonding pad and the first bonding pad are respectively located on two opposite surfaces of the circuit board and are arranged corresponding to each other. The first through hole further penetrates the second pad and is located in the second pad. The third strip-shaped edge is parallel to the second strip-shaped edge of the first through hole, and the third arc-shaped edge is parallel to the second arc-shaped edge of the first through hole. The third solder is disposed on the second surface of the second pad, and respectively extends from the third strip-shaped edge to the circuit board. Viewed from a top view, the third solders and the first through holes are arranged at intervals, and the orthographic projection area of each third solder extending from the corresponding third strip-shaped edge to the circuit board is equal to that of each third solder on the second 20% of the orthographic projected area on the pad. The fourth solder is disposed on the second surface of the second pad and extends from the third arc edge to the circuit board respectively. The third solder and the fourth solder are separated from each other and expose a portion of the third arc edge of the second pad. Viewed from a top view, the fourth solders and the first through holes are arranged at intervals, and the orthographic projection area of each fourth solder extending from the corresponding third arc-shaped edge to the circuit board is equal to that of each fourth solder on the second 10% of the orthographic projected area on the pad.

In an embodiment of the present invention, a first shortest distance between each second strip edge of the first through hole and an adjacent strip edge of the third solder is 0.1 mm. A second shortest distance between each second arc-shaped edge of the first through hole and an adjacent arc-shaped edge of the fourth solder is 0.15 mm.

In an embodiment of the present invention, a minimum width of each of the above-mentioned third solders in a direction perpendicular to the second strip-shaped edge of the first through hole is 0.32 mm.

In an embodiment of the present invention, a minimum width of each of the above-mentioned fourth solders in a direction parallel to the second strip edge of the first through hole is 0.285 mm.

In an embodiment of the present invention, a shortest distance between each of the above-mentioned fourth solders and an adjacent third solder is 0.35 mm.

In an embodiment of the present invention, the orthographic projection of an arc-shaped edge of each of the third solders relatively far away from the first through hole on the circuit board and the orthographic projection of the corresponding third strip-shaped edge on the circuit board are between The shortest distance between them is 0.05 mm.

In an embodiment of the present invention, the above-mentioned assembly hole structure further includes a second solder pad, a second through hole, two third solders, a fourth solder, a fifth solder, and a sixth solder. The second pad is disposed on the circuit board and includes a first part and a second part. The first portion has a second surface. The second surface has two and third strip-shaped edges opposite to each other, and a third arc-shaped edge and a first sawtooth-shaped edge connecting the third strip-shaped edges. The second portion has a third surface. The third surface has two fourth strip-shaped edges opposite to each other, and a fourth arc-shaped edge and a second serrated edge connecting the fourth strip-shaped edges. The first serrated edge is adjacent to the second serrated edge and is arranged at intervals, so that there is a serrated gap between the first part and the second part. The jagged gap exposes part of the circuit board. The second solder pad is located on the same surface of the circuit board as the first solder pad. The second through hole is located in the second bonding pad and penetrates the first part of the second bonding pad and the circuit board. The second through hole has two fifth strip-shaped edges opposite to each other and two fifth arc-shaped edges that are symmetrical to each other and connect the fifth strip-shaped edges. The fifth strip edge is parallel to the third strip edge, and the fifth arc edge is parallel to the third arc edge and the fourth arc edge. The third solder is disposed on the second surface of the first portion of the second pad and extends from the third strip edges to the circuit board respectively. Viewed from a top view, the third solders and the second through holes are arranged at intervals, and the orthographic projection area of each third solder extending from the corresponding third strip edge to the circuit board is equal to the size of each third solder on the second 20% of the orthographic projected area on the pad. The fourth solder is disposed on the second surface of the first portion of the second pad and extends from the third arc-shaped edge to the circuit board. The third solder and the fourth solder are separated from each other and expose a portion of the third arc edge. Viewed from a top view, the orthographic projection area of the fourth solder extending from the third arc-shaped edge to the circuit board is 10% of the orthographic projection area of the fourth solder on the second pad. The fifth solder is disposed on the second surface of the first portion of the second pad. Viewed from a top view, the fifth solder, the fourth solder and the second through holes are arranged at intervals. The sixth solder is disposed on the third surface of the second portion of the second pad, wherein the orthographic projection of the sixth solder on the circuit board completely overlaps the orthographic projection of the second portion of the second pad on the circuit board.

In an embodiment of the present invention, a shortest distance between the fifth strip-shaped edges of the second through hole is 0.5 mm.

In an embodiment of the present invention, a first shortest distance between each fifth strip-shaped edge of the second through hole and an adjacent strip-shaped edge of the third solder is 0.1 mm. A second shortest distance between the fifth arc-shaped edge of the fourth solder adjacent to the second through hole and an arc-shaped edge of the fourth solder is 0.15 mm.

In an embodiment of the present invention, a minimum width of each of the above-mentioned third solders in a direction perpendicular to the fifth strip-shaped edge of the second through hole is 0.5 mm.

In an embodiment of the present invention, a minimum width of the fourth solder in a direction parallel to the fifth strip-shaped edge of the second through hole is 0.45 mm.

In an embodiment of the present invention, a shortest distance between the above-mentioned fourth solder and the adjacent third solder is 0.35 mm.

In an embodiment of the present invention, the orthographic projection of an arc-shaped edge of each of the third solders relatively far away from the second through hole on the circuit board and the orthographic projection of the corresponding third strip-shaped edge on the circuit board are between The shortest distance between them is 0.1 mm.

In an embodiment of the present invention, the top-view profile of the fifth solder is circular, and the diameter of the fifth solder is 0.32 mm.

In an embodiment of the present invention, the above-mentioned sixth solder has two sixth strip-shaped edges opposite to each other, and a sixth arc-shaped edge and a third serrated edge connecting the sixth strip-shaped edges. The orthographic projection of the sixth strip-shaped edge on the circuit board overlaps the orthographic projection of the fourth strip-shaped edge on the circuit board. The orthographic projection of the sixth arc-shaped edge on the circuit board overlaps the orthographic projection of the fourth arc-shaped edge on the circuit board. A shortest distance between the orthographic projection of the third serrated edge on the circuit board and the orthographic projection of the second serrated edge on the circuit board is 0.2 mm.

Based on the above, in the design of the assembly hole structure of the present invention, when viewed from a top view, the solders and the through holes are arranged at intervals, and the solders are separated from each other and part of the arc-shaped edges of the pads are exposed. In particular, the orthographic projection area of the solder extending from the corresponding strip edge to the circuit board is 20% of the orthographic projection area of the solder on the pad, and the solder extending from the corresponding arc edge to the orthographic projection area of the circuit board This is 10% of the orthographic projection area of the solder on the pad. With the above design, in the subsequent reflow bonding process, the reflowed solder will not block the through hole, and the reflowed solder can cover at least 90% of the surface of the pad. In this way, the design of the assembly hole structure of the present invention can reduce the oxidation phenomenon of the solder pad, and can avoid the phenomenon of hole clogging of the through hole, and has better structural reliability.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

FIG. 1 is a schematic top perspective view of an assembly hole structure according to an embodiment of the present invention. Referring to FIG. 1 , in this embodiment, the assembly hole structure 100 a is suitable for disposing on a circuit board 10 , wherein the circuit board 10 is, for example, a printed circuit board with an organic solder resist (OSP) as a solder mask. The assembly hole structure 100 includes a first solder pad 110 , a first through hole 120 , two first solders 130 and two second solders 140 . The first pad 110 is disposed on the circuit board 10 and has a first surface 112 . The first surface 112 has two first strip-shaped edges 112a opposite to each other and two first arc-shaped edges 112b symmetrical to each other and connected to the first strip-shaped edges 112a. The first through hole 120 is located in the first bonding pad 110 and penetrates through the first bonding pad 110 and the circuit board 10 . The first through hole 120 has two second strip-shaped edges 122a opposite to each other and two second arc-shaped edges 122b symmetrical to each other and connected to the second strip-shaped edges 122a. The second strip edge 122a is parallel to the first strip edge 112a, and the second arc edge 122b is parallel to the first arc edge 112b. Here, the first pad 110 and the first through hole 120 have the same top-view profile, and the top-view area of the first through-hole 120 is smaller than the top-view area of the first pad 110 .

Furthermore, the first solders 130 of the present embodiment are symmetrically disposed on the first surface 112 of the first pad 110 and respectively extend from the first strip-shaped edges 112 a to the circuit board 10 . When viewed from a top view, the first solders 130 and the first through holes 120 are arranged at intervals, and the orthographic projection area of each first solder 130 extending from the corresponding first strip edge 112a to the circuit board 10 is equal to that of each first solder 130 . 20% of the orthographic projection area of a solder 130 on the first pad 110 . The second solders 140 are symmetrically disposed on the first surface 112 of the first pad 110 and respectively extend from the first arc-shaped edges 112b to the circuit board 10 . The first solder 130 and the second solder 140 are separated from each other and expose a portion of the first arc edge 112b. Viewed from a top view, the second solders 140 and the first through holes 120 are arranged at intervals, and the orthographic projection area of each second solder 140 extending from the corresponding first arc-shaped edge 112b to the circuit board 10 is equal to that of each second solder 140 . 10% of the orthographic projection area of the two solders 140 on the first pad 110 . Here, the first solder 130 has substantially the same size and top view profile, and the second solder 140 has substantially the same size and top view profile, wherein the top view area of the first solder 130 is larger than the top view area of the second solder 140, and the first solder 130 has substantially the same size and top view profile. The solder 130 and the second solder 140 are made of the same material, such as solder paste.

In detail, the assembly hole structure 100 a of the present embodiment is substantially a single-sided design, wherein the first solder pad 110 is located on the surface S1 of the circuit board 10 . More specifically, a shortest distance D1 between the second strip-shaped edges 122 a of the first through hole 120 is 0.5 mm, which is the width of the first through hole 120 . A shortest distance D2 between each second strip edge 122a of the first through hole 120 and the adjacent strip edge 132a of the first solder 130 is 0.1 mm, which is the first through hole 120 and the first solder 130 gap between. A shortest distance D3 between each second arc edge 122b of the first through hole 120 and an arc edge 142b of the adjacent second solder 140 is 0.15 mm, which is the first through hole 120 and the second arc edge 142b. gaps between the solders 140 . A shortest distance D4 between each second solder 140 and the adjacent first solder 130 is 0.35 mm, which is the gap between the first solder 130 and the second solder 140 . A shortest distance D5 between an orthographic projection of an arc-shaped edge 132 b of each first solder 130 relatively far away from the first through hole 120 on the circuit board 10 and an orthographic projection of the corresponding first strip-shaped edge 112 a on the circuit board 10 is 0.1 mm, which is the dimension by which the first solder 130 extends beyond the circumference of the first pad 110 .

Preferably, a minimum width W1 of each first solder 130 in a direction L1 perpendicular to the second strip edge 122 a of the first through hole 120 is 0.5 mm. Here, the minimum width W1 is obtained by multiplying the wire diameter (eg, 0.5 mm) of the first pad 110 by 20% plus 0.4 mm. A minimum width W2 of each second solder 140 in a direction L2 parallel to the second strip edge 122 a of the first through hole 120 is 0.45 mm. Here, the minimum width W2 is obtained by multiplying the wire diameter (eg, 0.5 mm) of the first pad 110 by 10% plus 0.4 mm. It should be noted that the wire diameter of the first pad 110 described here is the width from the second strip edge 122 a of the first through hole 120 to the first strip edge 112 a of the adjacent first pad 110 ; Or, the width from the second arc-shaped edge 122 b of the first through hole 120 to the first arc-shaped edge 112 b of the adjacent first pad 110 .

In the design of the assembly hole structure 100a in this embodiment, when viewed from a top view, the first solder 130 and the first through holes 120 are arranged at intervals, and the second solder 140 and the first through holes 120 are also arranged at intervals, and The first solder 130 and the second solder 140 are separated from each other and expose a portion of the first arc edge 112 b of the first pad 110 . With the above-mentioned design, in the subsequent reflow bonding process, the reflowed first solder 130 and the second solder 140 will not block the first through hole 120 , thereby avoiding the conventional hole blockage problem. In addition, the orthographic projection area of each first solder 130 extending from the corresponding first strip edge 112 a to the circuit board 10 in this embodiment is equal to the orthographic projection area of each first solder 130 on the first pad 110 . 20%, and the orthographic projection area of each second solder 140 extending from the corresponding first arc edge 112 b to the circuit board 10 is 10% of the orthographic projection area of each second solder 140 on the first pad 110 . With the above-mentioned design, during the subsequent reflow bonding process, the reflowed first solder 130 and the second solder 140 can cover at least 90% of the area of the first surface 112 of the first pad 110 , thereby reducing the number of first solders 130 and 140 . Oxidation of the pads 110 . In other words, the assembly hole structure 100a of this embodiment can have better structural reliability. Therefore, when a battery module (not shown) is subsequently assembled through a nickel sheet (not shown), the assembly hole structure 100a of this embodiment can have a better assembly yield.

It must be noted here that the following embodiments use the element numbers and part of the contents of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and repeated descriptions in the following embodiments will not be repeated.

FIG. 2 is a schematic top perspective view of an assembly hole structure according to another embodiment of the present invention. Please refer to FIG. 2 and FIG. 1 at the same time. The assembly hole structure 100b of the present embodiment is similar to the assembly hole 100a of FIG. The third solder 160 and the two fourth solders 170 . The second pad 150 is disposed on the circuit board 10 and has a second surface 152 . The second surface 152 has two third strip-shaped edges 152a opposite to each other and two third arc-shaped edges 152b symmetrical to each other and connecting the third strip-shaped edges 152a. The second bonding pad 150 and the first bonding pad 110 are respectively located on two opposite surfaces S1 and S2 of the circuit board 10 and are disposed corresponding to each other. The first through hole 120 further penetrates the second pad 150 and is located in the second pad 150 . The third strip-shaped edge 152 a is parallel to the second strip-shaped edge 122 a of the first through hole 120 , and the third arc-shaped edge 152 b is parallel to the second arc-shaped edge 122 b of the first through hole 120 . Here, the second pad 150 and the first through hole 120 have the same top-view profile, and the top-view area of the first through-hole 120 is smaller than the top-view area of the second pad 150 .

Furthermore, the third solder 160 is disposed on the second surface 152 of the second pad 150 and extends from the third strip-shaped edge 152a to the circuit board 10 respectively. Viewed from a top view, the third solders 160 and the first through holes 120 are arranged at intervals, and the orthographic projection area of each third solder 160 extending from the corresponding third strip-shaped edge 152a to the circuit board 10 is equal to that of each third solder 160 . 20% of the orthographic projection area of the third solder 160 on the second pad 150 . The fourth solder 170 is disposed on the second surface 152 of the second pad 150 and extends from the third arc-shaped edges 152b to the circuit board 10 respectively. The third solder 160 and the fourth solder 170 are separated from each other and expose a portion of the third arc edge 152 b of the second pad 150 . Viewed from a top view, the fourth solders 170 and the first through holes 120 are arranged at intervals, and the orthographic projection area of each fourth solder 170 extending from the corresponding third arc-shaped edge 152b to the circuit board 10 is equal to that of each fourth solder 170 . 10% of the orthographic projection area of the four solders 170 on the second pad 150 .

Here, the top-view profile of the second pad 150 is the same as the top-view profile of the first pad 110 , wherein the top-view area of the first pad 110 is larger than the top-view area of the second pad 150 . The third solder 160 has substantially the same size and top view profile, wherein the top view profile of the third solder 160 and the top view profile of the first solder 130 are, for example, the same, and the top view area of the third solder 160 is smaller than that of the first solder 130 . The fourth solder 170 has substantially the same size and top view profile, wherein the top view profile of the fourth solder 170 and the top view profile of the second solder 140 are, for example, the same, and the top view area of the fourth solder 170 is smaller than that of the second solder 140 . The top view area of the third solder 160 is larger than the top view area of the fourth solder 170 , wherein the third solder 160 and the fourth solder 170 are made of the same material, such as solder paste.

In detail, the assembly hole structure 100 b of the present embodiment is substantially a double-sided design, wherein the first bonding pad 110 and the second bonding pad 150 are respectively located on the surfaces S1 and S2 of the circuit board 10 . More specifically, a shortest distance D6 between each second strip edge 122a of the first through hole 120 and the adjacent strip edge 162a of the third solder 160 is 0.1 mm, which is the first through hole A gap between 120 and the third solder 160 . A shortest distance D7 between each second arc edge 122b of the first through hole 120 and an arc edge 172b of the adjacent fourth solder 170 is 0.15 mm, which is the first through hole 120 and the fourth gaps between solders 170 . A shortest distance D8 between each fourth solder 170 and the adjacent third solder 160 is 0.35 mm, which is the gap between the third solder 160 and the fourth solder 170 . A shortest distance D9 between an orthographic projection of an arc-shaped edge 162 b of each third solder 160 relatively far away from the first through hole 120 on the circuit board 10 and an orthographic projection of the corresponding third strip-shaped edge 152 a on the circuit board 10 is 0.05 mm, which is the dimension by which the third solder 160 extends beyond the circumference of the second pad 150 .

Preferably, a minimum width W3 of each third solder 160 in the direction L1 perpendicular to the second strip edge 122 a of the first through hole 120 is 0.32 mm. Here, the minimum width W3 is obtained by multiplying the wire diameter (eg, 0.35 mm) of the second pad 150 by 20% plus 0.25 mm. A minimum width W4 of each fourth solder 170 in the direction L2 parallel to the second strip edge 122 a of the first through hole 120 is 0.285 mm. Here, the minimum width W4 is obtained by multiplying the wire diameter (eg, 0.35 mm) of the second pad 150 by 10% plus 0.25 mm. It should be noted that the wire diameter of the second pad 150 described here is the width from the second strip edge 122 a of the first through hole 120 to the third strip edge 152 a of the adjacent second pad 150 ; or, the width from the second arc-shaped edge 122 b of the first through hole 120 to the third arc-shaped edge 152 b of the adjacent second pad 150 .

In the design of the assembly hole structure 100b in this embodiment, when viewed from a top view, the first solder 130 and the first through holes 120 are arranged at intervals, and the second solder 140 and the first through holes 120 are also arranged at intervals, and The first solder 130 and the second solder 140 are separated from each other and expose a portion of the first arc edge 112 b of the first pad 110 . The third solder 160 and the first through holes 120 are arranged at intervals, and the fourth solder 170 and the first through holes 120 are also arranged at intervals, and the third solder 160 and the fourth solder 170 are separated from each other and expose the second pad 150 part of the third arc-shaped edge 152b. With the above-mentioned design, in the subsequent reflow bonding process, the reflowed first solder 130 , the second solder 140 , the third solder 160 and the fourth solder 170 will not block the first through hole 120 , which can avoid conventional The problem of hole blockage.

In addition, the orthographic projection area of each first solder 130 extending from the corresponding first strip edge 112 a to the circuit board 10 in this embodiment is equal to the orthographic projection area of each first solder 130 on the first pad 110 . 20%; the orthographic projection area of each second solder 140 extending from the corresponding first arc-shaped edge 112b to the circuit board 10 is 10% of the orthographic projection area of each second solder 140 on the first pad 110; The orthographic projection area of each third solder 160 extending from the corresponding third strip edge 152a onto the circuit board 10 is 20% of the orthographic area of each third solder 160 on the second pad 150; and each The orthographic projection area of the fourth solder 170 extending from the corresponding third arc-shaped edge 152 b onto the circuit board 10 is 10% of the orthographic projection area of each fourth solder 170 on the second pad 150 . With the above design, in the subsequent reflow bonding process, the reflowed first solder 130 and the second solder 140 can cover at least 90% of the area of the first surface 112 of the first pad 110 , and the reflowed first solder 130 and the second solder 140 The third solder 160 and the fourth solder 170 can cover at least 90% of the area of the second surface 152 of the second pad 150 , which can reduce the oxidation of the first pad 110 and the second pad 150 . In other words, the assembly hole structure 100b of this embodiment can have better structural reliability. Therefore, when a battery module (not shown) is subsequently assembled through a nickel sheet (not shown), the assembly hole structure 100b of this embodiment can have a better assembly yield.

3 is a schematic top perspective view of an assembly hole structure according to another embodiment of the present invention. Please refer to FIG. 3 and FIG. 1 at the same time. The assembly hole structure 100c of the present embodiment is similar to the assembly hole 100a of FIG. The second through holes 125 , two third solders 165 , a fourth solder 175 , a fifth solder 185 and a sixth solder 195 . The second pad 155 is disposed on the circuit board 10 and includes a first portion 155a and a second portion 155b. The first portion 155a has a second surface 157, wherein the second surface 157 has two third strip-shaped edges 157a opposite to each other and a third arc-shaped edge 157b and a first serrated edge 157c connecting the third strip-shaped edges 157a . The second portion 155b has a third surface 159, wherein the third surface 159 has two fourth strip edges 159a opposite to each other, a fourth arc edge 159b and a second serrated edge connecting the fourth strip edges 159a 159c. The first serrated edge 157c is adjacent to the second serrated edge 159c and is spaced apart, so that there is a serrated gap G between the first portion 155a and the second portion 155b. The serrated gap G exposes part of the circuit board 10 . The second pads 155 and the first pads 110 are located on the same surface S1 of the circuit board 10 .

Furthermore, the second through hole 125 is located in the second pad 155 and penetrates through the first portion 155 a of the second pad 155 and the circuit board 10 . The second through hole 125 has two fifth strip-shaped edges 127a opposite to each other and two fifth arc-shaped edges 127b symmetrical to each other and connected to the fifth strip-shaped edges 127a. The fifth strip edge 127a is parallel to the third strip edge 157a, and the fifth arc edge 127b is parallel to the third arc edge 157b and the fourth arc edge 159b. The third solder 165 is disposed on the second surface 157 of the first portion 155a of the second pad 155, and extends from the third strip-shaped edge 157a to the circuit board 10, respectively. When viewed from a top view, the third solders 165 and the second through holes 125 are arranged at intervals, and the orthographic projection area of each third solder 165 extending from the corresponding third strip-shaped edge 157a to the circuit board 10 is equal to that of each third solder 165 . 20% of the orthographic projection area of the third solder 165 on the second pad 155 . The fourth solder 175 is disposed on the second surface 157 of the first portion 155a of the second pad 155 and extends from the third arc edge 157b to the circuit board 10 . The third solder 165 and the fourth solder 175 are separated from each other and expose a portion of the third arc edge 157b. Viewed from a top view, the orthographic projection area of the fourth solder 175 extending from the third arc-shaped edge 157 b to the circuit board 10 is 10% of the orthographic projection area of the fourth solder 175 on the second pad 155 . The fifth solder 185 is disposed on the second surface 157 of the first portion 155 a of the second pad 155 . When viewed from a top view, the fifth solder 185 , the fourth solder 175 and the second through holes 125 are arranged at intervals. The sixth solder 195 is disposed on the third surface 159 of the second portion 155b of the second solder pad 155 , wherein the orthographic projection of the sixth solder 195 on the circuit board 10 completely overlaps the second portion 155b of the second solder pad 155 on the circuit board 10 . Orthographic projection on circuit board 10 .

In detail, the assembly hole structure 100 c of the present embodiment is substantially a single-sided design, wherein the first solder pads 110 and the second solder pads 155 are both located on the surface S1 of the circuit board 10 . Specifically, a shortest distance T1 between the fifth strip-shaped edges 127 a of the second through holes 125 is 0.5 mm, which is the width of the second through holes 125 . A shortest distance T2 between each fifth strip edge 127a of the second through hole 125 and the adjacent strip edge 167a of the third solder 165 is 0.1 mm, which is the second through hole 125 and the third solder 165 gaps between. A shortest distance T3 between the fifth arc edge 127b of the fourth solder 175 adjacent to the second through hole 125 and an arc edge 177b of the fourth solder 175 is 0.15 mm, which is the distance between the second through hole 125 and the arc edge 177b of the fourth solder 175 . The gap between the fourth solders 175 . A shortest distance T4 between the fourth solder 175 and the adjacent third solder 165 is 0.35 mm, which is the gap between the third solder 165 and the fourth solder 175 . A shortest distance T5 between the orthographic projection of an arc-shaped edge 167b of each third solder 165 relatively far away from the second through hole 125 on the circuit board 10 and the orthographic projection of the corresponding third strip-shaped edge 157a on the circuit board 10 is 0.1 mm, which is the dimension by which the third solder 165 extends beyond the periphery of the second pad 155 . The top-view profile of the fifth solder 185 is circular, and the diameter D of the fifth solder 185 is 0.32 mm. The sixth solder 195 has two sixth strip edges 197a opposite to each other, a sixth arc edge 197b and a third serrated edge 197c connecting the sixth strip edges 197a. The orthographic projection of the sixth strip edge 197a on the circuit board 10 overlaps the orthographic projection of the fourth strip edge 159a on the circuit board. The orthographic projection of the sixth arc-shaped edge 197 b on the circuit board 10 overlaps the orthographic projection of the fourth arc-shaped edge 159 b on the circuit board 10 . A shortest distance T6 between the orthographic projection of the third serrated edge 197c on the circuit board 10 and the orthographic projection of the second serrated edge 159c on the circuit board 10 is 0.2 mm, which is the sixth solder 195 and the second gaps between pads 155 .

Preferably, a minimum width W5 of each third solder 165 in the direction L1 perpendicular to the fifth strip edge 127 a of the second through hole 125 is 0.5 mm. Here, the minimum width W5 is obtained by multiplying the wire diameter (eg, 0.5 mm) of the second pad 155 by 20% plus 0.4 mm. A minimum width W6 of the fourth solder 175 in the direction L2 parallel to the fifth strip edge 127 a of the second through hole 125 is 0.45 mm. Here, the minimum width W6 is obtained by multiplying the wire diameter (eg, 0.5 mm) of the second pad 155 by 10% plus 0.4 mm. It should be noted that the wire diameter of the second pad 155 described here is the width from the fifth strip edge 127 a of the second through hole 125 to the third strip edge 157 a of the adjacent second pad 155 Or, the width from the fifth arc-shaped edge 127b of the second through hole 125 to the third arc-shaped edge 157b of the adjacent second pad 155 . Here, the third solder 165 , the fourth solder 175 , the fifth solder 185 and the sixth solder 195 are made of the same material, for example, solder paste.

In the design of the assembly hole structure 100c in this embodiment, when viewed from a top view, the first solder 130 and the first through holes 120 are arranged at intervals, and the second solder 140 and the first through holes 120 are also arranged at intervals, and The first solder 130 and the second solder 140 are separated from each other and expose a portion of the first arc edge 112 b of the first pad 110 . The third solder 165 and the second through-holes 125 are arranged at intervals, and the third solder 165 and the fourth solder 175 are separated from each other and expose a part of the third arc edge 157 b of the second pad 155 . The fifth solder 185 , the fourth solder 175 and the second through holes 125 are also arranged at intervals. With the above design, in the subsequent reflow bonding process, the reflowed first solder 130 and the second solder 140 will not block the first through hole 120 , while the third solder 165 , the fourth solder 175 and the fifth solder The solder 185 will not block the second through hole 125, which can avoid the conventional problem of hole blockage.

Furthermore, the orthographic projection area of each first solder 130 extending from the corresponding first strip edge 112 a to the circuit board 10 in this embodiment is the orthographic projection area of each first solder 130 on the first pad 110 20%; the orthographic projection area of each second solder 140 extending from the corresponding first arc-shaped edge 112 b to the circuit board 10 is 10% of the orthographic projection area of each second solder 140 on the first pad 110 ; the orthographic area of each third solder 165 extending from the corresponding third strip edge 157a to the circuit board 10 is 20% of the orthographic area of each third solder 165 on the second pad 155; and The orthographic projection area of the fourth solder 175 extending from the third arc-shaped edge 157 b to the circuit board 10 is 10% of the orthographic projection area of the fourth solder 175 on the second pad 155 . With the above design, in the subsequent reflow bonding process, the reflowed first solder 130 and the second solder 140 can cover at least 90% of the area of the first surface 112 of the first pad 110 , and the reflowed first solder 130 and the second solder 140 The third solder 165 , the fourth solder 175 and the fifth solder 185 can cover at least 90% of the area of the second surface 157 of the first portion 155 a of the second solder pad 155 , which can reduce the number of the first solder pad 110 and the second solder pad 155 oxidation phenomenon. In short, the assembly hole structure 100c of this embodiment can have better structural reliability. Therefore, when a battery module (not shown) is subsequently assembled through a nickel sheet (not shown), the assembly hole structure 100c of this embodiment can have a better assembly yield.

In addition, the second solder pad 155 of this embodiment is composed of a first part 155a and a second part 155b, which is matched with the structural design of the sixth solder 195, and passes through a nickel sheet (not shown) and a nickel sheet (not shown) in the subsequent assembly hole structure 100c. After a battery module (not shown) is assembled, it can avoid the instability of the battery module caused by the circuit conduction at the highest potential. If a short circuit occurs due to reflow, the integrated circuit (IC) on the circuit board 10 will be unstable, which will relatively affect the production yield of the back-end battery module. That is to say, the above-mentioned design can avoid the problem that the circuit board 10 is short-circuited and cannot be used.

It should be noted that the assembly hole structure 100c of this embodiment is embodied as a single-sided structure. However, in other non-illustrated embodiments, the assembly hole structure may also be a double-sided structure as shown in FIG. 2 , which still falls within the scope of the present invention. It is worth mentioning that, according to the simulation experiments, through the design of the above-mentioned assembly hole structures 100a, 100b, and 100c, the first solder 130 and the second solder 140 after reflow in this embodiment will not block the first solder. The area of the through hole 120 that can cover the first surface 112 of the first solder pad 110 is 98.3%, and the first surface 112 of the first solder pad 110 is not covered by the reflowed first solder 130 and the second solder 140 Area is less than 5%. In short, the assembly hole structures 100a, 100b, 100c of this embodiment can have better structural reliability.

To sum up, in the design of the assembly hole structure of the present invention, when viewed from a top view, the solders and the through holes are arranged at intervals, and the solders are separated from each other and expose part of the arc-shaped edges of the pads. In particular, the orthographic projection area of the solder extending from the corresponding strip edge to the circuit board is 20% of the orthographic projection area of the solder on the pad, and the solder extending from the corresponding arc edge to the orthographic projection area of the circuit board This is 10% of the orthographic projection area of the solder on the pad. With the above design, in the subsequent reflow bonding process, the reflowed solder will not block the through hole, and the reflowed solder can cover at least 90% of the surface of the pad. In this way, the design of the assembly hole structure of the present invention can reduce the oxidation phenomenon of the solder pad, and can avoid the hole blockage of the through hole, and has better structural reliability.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10‧‧‧Circuit board 100a, 100b, 100c‧‧‧Assembly hole structure 110‧‧‧First pad 112‧‧‧First surface 112a‧‧‧First strip edge 112b‧‧‧First arc edge 120‧‧‧First through hole 122a‧‧‧Second strip edge 122b‧‧‧Second arc edge 125‧‧‧Second through hole 127a‧‧‧Fifth strip edge 127b‧‧‧Fifth arc 130‧‧‧First solder 132a‧‧‧Strip edge 132b‧‧‧Arc edge 140‧‧‧Second solder 142b‧‧‧Arc edge 150, 155‧‧‧Second pad 152, 157 ‧‧‧Second surface 152a, 157a‧‧‧Third strip-shaped edge 152b, 157b‧‧‧Third arc-shaped edge 155a‧‧‧First part 155b‧‧‧Second part 157c‧‧‧First serrated edge 159‧‧‧The third surface 159a‧‧‧The fourth strip edge 159b‧‧‧The fourth arc edge 159c‧‧‧The fourth serrated edge 160, 165‧‧‧The third solder 162a, 167a‧‧‧ 162b, 167b‧‧‧Arc edge 170, 175‧‧‧Fourth solder 172b, 177b‧‧‧Arc edge 185‧‧‧Fifth solder 195‧‧‧Sixth solder 197a‧‧‧Sixth 197b‧‧‧Sixth arc edge 197c‧‧‧Third serrated edge D‧‧‧Diameter D1, D2, D3, D4, D5, D6, D7, D8, D9, T1, T2, T3, T4 , T5, T6‧‧‧Minimum distance G‧‧‧Sawtooth gap L1, L2‧‧‧Direction S1, S2‧‧‧Surface W1, W2, W3, W4, W5, W6‧‧‧Minimum width

FIG. 1 is a schematic top perspective view of an assembly hole structure according to an embodiment of the present invention. FIG. 2 is a schematic top perspective view of an assembly hole structure according to another embodiment of the present invention. 3 is a schematic top perspective view of an assembly hole structure according to another embodiment of the present invention.

10‧‧‧Circuit board

100a‧‧‧Assembly hole structure

110‧‧‧First pad

112‧‧‧First surface

112a‧‧‧First strip edge

112b‧‧‧First arc edge

120‧‧‧First through hole

122a‧‧‧Second strip edge

122b‧‧‧Second arc edge

130‧‧‧First Solder

132a‧‧‧Striped edge

132b‧‧‧Arc edge

140‧‧‧Second Solder

142b‧‧‧Arc edge

L1, L2‧‧‧ directions

D1, D2, D3, D4, D5‧‧‧Minimum distance

W1, W2‧‧‧Minimum width

S1‧‧‧Surface

Claims (22)

An assembly hole structure, suitable for disposing on a circuit board, the assembly hole structure comprising: a first soldering pad disposed on the circuit board and having a first surface, the first surface having two second pads opposite to each other a strip-shaped edge and two first arc-shaped edges that are symmetrical to each other and connect the first strip-shaped edges; a first through hole located in the first pad and passing through the first pad and the circuit board, The first through hole has two second strip-shaped edges opposite to each other and two second arc-shaped edges symmetrical to each other and connecting the second strip-shaped edges, wherein the second strip-shaped edges are parallel to the first strip-shaped edges edge, and the second arc-shaped edges are parallel to the first arc-shaped edges; two first solders, symmetrically disposed on the first surface of the first pad, and respectively extending from the first strip-shaped edges Extending to the circuit board, when viewed from a top view, the first solders and the first through holes are arranged at intervals, and each of the first solders extends from the corresponding first strip edge to the circuit board The orthographic projection area on the first solder pad is 20% of the orthographic projection area of each of the first solder pads; and two second solders are symmetrically arranged on the first surface of the first solder pad, and respectively extend from the first arc-shaped edges to the circuit board, the first solders and the second solders are separated from each other and a part of the first arc-shaped edges are exposed. Two solders and the first through holes are arranged at intervals, and the orthographic projection area of each of the second solders extending from the corresponding first arc-shaped edge to the circuit board is the size of each of the second solders on the first 10% of the orthographic projected area on a pad. The assembly hole structure according to claim 1, wherein a shortest distance between the second strip-shaped edges of the first through hole is 0.5 mm. The assembly hole structure of claim 1, wherein a first shortest distance between each of the second strip edges of the first through hole and the adjacent strip edges of the first solder is 0.1 mm, and a second shortest distance between each of the second arc-shaped edges of the first through hole and an adjacent arc-shaped edge of the second solder is 0.15 mm. The assembly hole structure of claim 1, wherein a minimum width of each of the first solders in a direction perpendicular to the second strip-shaped edges of the first through hole is 0.5 mm. The assembly hole structure of claim 1, wherein a minimum width of each of the second solders in a direction parallel to the second strip edges of the first through hole is 0.45 mm. The assembly hole structure of claim 1, wherein a shortest distance between each of the second solders and the adjacent first solder is 0.35 mm. The assembly hole structure according to claim 1, wherein an orthographic projection of an arc-shaped edge of each of the first solders relatively far away from the first through hole on the circuit board and the corresponding first strip A shortest distance between the orthographic projections of the edge on the circuit board is 0.1 mm. The assembly hole structure of claim 1, further comprising: a second solder pad disposed on the circuit board and having a second surface, the second surface having two and third strip-shaped opposite to each other an edge and two third arc-shaped edges symmetrical to each other and connected to the third strip-shaped edges, wherein the second pad and the first pad are respectively located on two opposite surfaces of the circuit board and are arranged corresponding to each other, the first pad The through hole further penetrates the second pad and is located in the second pad, and the third strip-shaped edges are parallel to the second strip-shaped edges of the first through-hole, and the third arc-shaped edges the second arc-shaped edges parallel to the first through hole; two third solders disposed on the second surface of the second pad and extending from the third strip-shaped edges to the circuit board respectively , when viewed from a top view, the third solders and the first through holes are arranged at intervals, and the orthographic projection area of each of the third solders extending from the corresponding third strip edge to the circuit board is 20% of the orthographic projection area of each of the third solders on the second solder pad; and two fourth solders, disposed on the second surface of the second solder pad, and arc-shaped from the third solder pads respectively The edges extend to the circuit board, the third solders and the fourth solders are separated from each other and expose a portion of the second pads. The third arc-shaped edges are viewed from a top view, the fourth solders The first through holes are arranged at intervals, and the orthographic projection area of each of the fourth solders extending from the corresponding third arc-shaped edge to the circuit board is the second solder of each of the fourth solders. 10% of the orthographic projected area on the pad. The assembly hole structure of claim 8, wherein a first shortest distance between each of the second strip edges of the first through hole and the adjacent strip edges of the third solder is 0.1 mm, and a second shortest distance between each of the second arc-shaped edges of the first through hole and an adjacent arc-shaped edge of the fourth solder is 0.15 mm. The assembly hole structure of claim 8, wherein a minimum width of each of the third solders in a direction perpendicular to the second strip-shaped edges of the first through hole is 0.32 mm. The assembly hole structure of claim 8, wherein a minimum width of each of the fourth solders in a direction parallel to the second strip edges of the first through hole is 0.285 mm. The assembly hole structure of claim 8, wherein a shortest distance between each of the fourth solders and the adjacent third solder is 0.35 mm. The assembly hole structure of claim 8, wherein the orthographic projection of an arc-shaped edge of each of the third solders relatively far away from the first through hole on the circuit board and the corresponding third strip A shortest distance between the orthographic projections of the edge on the circuit board is 0.05 mm. The assembly hole structure according to the claim 1, further comprising: a second solder pad disposed on the circuit board and comprising a first part and a second part, the first part has a second surface, The second surface has two third strip-shaped edges opposite to each other and a third arc-shaped edge and a first serrated edge connecting the third strip-shaped edges, the second part has a third surface, the first The three surfaces have two and fourth strip edges opposite to each other and a fourth arc edge and a second zigzag edge connecting the fourth strip edges, the first zigzag edge is adjacent to the second zigzag edge and arranged at intervals, so that there is a zigzag gap between the first part and the second part, and the zigzag gap exposes part of the circuit board, and the second pad and the first pad are located in the circuit On the same surface of the board; a second through hole located in the second pad and passing through the first part of the second pad and the circuit board, the second through hole has two fifth strips opposite to each other Edges and two fifth arc-shaped edges symmetrical to each other and connecting the fifth strip-shaped edges, wherein the fifth strip-shaped edges are parallel to the third strip-shaped edges, and the fifth arc-shaped edges are parallel to the third strip-shaped edges an arc-shaped edge and the fourth arc-shaped edge; two third solders disposed on the second surface of the first portion of the second pad and extending from the third strip-shaped edges to the circuit board respectively , when viewed from a top view, the third solders and the second through holes are arranged at intervals, and the orthographic projection area of each of the third solders extending from the corresponding third strip edge to the circuit board is 20% of the orthographic projection area of each of the third solders on the second pad; a fourth solder disposed on the second surface of the first portion of the second pad and extending from the third arc The arc-shaped edge extends to the circuit board, the third solder and the fourth solder are separated from each other and expose a part of the third arc-shaped edge, when viewed from a top view, the fourth solder extends from the third arc-shaped edge The orthographic projection area on the circuit board is 10% of the orthographic projection area of the fourth solder on the second pad; a fifth solder, disposed on the second surface of the first portion of the second pad , when viewed from a top view, the fifth solder, the fourth solder and the second through hole are arranged at intervals; and a sixth solder is disposed on the third surface of the second portion of the second pad , wherein the orthographic projection of the sixth solder on the circuit board completely overlaps the orthographic projection of the second portion of the second pad on the circuit board. The assembly hole structure of claim 14, wherein a shortest distance between the fifth strip-shaped edges of the second through hole is 0.5 mm. The assembly hole structure of claim 14, wherein a first shortest distance between each of the fifth strip-shaped edges of the second through hole and the adjacent strip-shaped edge of the third solder is 0.1 mm, and a second shortest distance between the fifth arc-shaped edge of the fourth solder adjacent to the second through hole and an arc-shaped edge of the fourth solder is 0.15 mm. The assembly hole structure of claim 14, wherein a minimum width of each of the third solders in a direction perpendicular to the fifth strip-shaped edges of the second through hole is 0.5 mm. The assembly hole structure of claim 14, wherein a minimum width of the fourth solder in a direction parallel to the fifth strip-shaped edges of the second through hole is 0.45 mm. The assembly hole structure of claim 14, wherein a shortest distance between the fourth solder and the adjacent third solder is 0.35 mm. The assembly hole structure of claim 14, wherein an orthographic projection of an arc-shaped edge of each of the third solders relatively far from the second through hole on the circuit board and the corresponding third strip A shortest distance between the orthographic projections of the edge on the circuit board is 0.1 mm. The assembly hole structure according to claim 14, wherein the top-view outline of the fifth solder is circular, and the diameter of the fifth solder is 0.32 mm. The assembly hole structure of claim 14, wherein the sixth solder has two sixth strip-shaped edges opposite to each other, a sixth arc-shaped edge and a third sawtooth connecting the sixth strip-shaped edges edge, the orthographic projection of the sixth strip-shaped edges on the circuit board overlaps the orthographic projection of the fourth strip-shaped edges on the circuit board, and the sixth arc-shaped edge is on the circuit board The projection overlaps the orthographic projection of the fourth arc-shaped edge on the circuit board, and between the orthographic projection of the third serrated edge on the circuit board and the orthographic projection of the second serrated edge on the circuit board A shortest distance is 0.2 mm.

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