JPH04199552A - Ic package - Google Patents

Ic package

Info

Publication number
JPH04199552A
JPH04199552A JP2335375A JP33537590A JPH04199552A JP H04199552 A JPH04199552 A JP H04199552A JP 2335375 A JP2335375 A JP 2335375A JP 33537590 A JP33537590 A JP 33537590A JP H04199552 A JPH04199552 A JP H04199552A
Authority
JP
Japan
Prior art keywords
package
lead terminal
dummy lead
heat radiation
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2335375A
Other languages
Japanese (ja)
Inventor
Junji Mori
順二 森
Takayuki Miyamoto
宮元　崇行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2335375A priority Critical patent/JPH04199552A/en
Publication of JPH04199552A publication Critical patent/JPH04199552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To improve heat radiation effect by providing a dummy lead terminal on the blank side surface of an IC package. CONSTITUTION:There are provided an IC package 1, lead terminals 2, a wiring pattern 3 on a substrate, the substrate 4, and a heat radiation dummy lead terminal 5. The dummy lead terminal 5 is provided on a blank side surface of the IC package 1 and is connected with the thick wiring pattern 3 on the substrate 4. Herein, although in the drawing the wider dummy lead terminal 5 is provided by way of example, a dummy lead terminal of the same configuration as a usual lead terminal may be provided, and the tip end of the dummy lead terminal 5 may be folded inwardly into an inverted U-shaped not a Z- shaped, Hereby, heat radiation effect can be increased to reduce thermal resistance.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はＴ　Ｓ　ＯＰ　（Ｔｈ１ｎ　Ｓｍａｌｌ　Ｏ
ｕｔｌｉｎｅＰａｃｋａｇｅ）　形Ｉ　Ｃパッケージの
リード端子構造に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention is applicable to T S OP (Th1n Small O
utlinePackage) This relates to the lead terminal structure of an IC package.

〔従来の技術〕[Conventional technology]

第５図〜第７図は従来のＴＳＯＰ形ＩＣパッケージの平
面図、正面図および側面図である。5 to 7 are a plan view, a front view, and a side view of a conventional TSOP type IC package.

図において、（１）はＩＣパッケージ、（２）はＩＣパ
ッケージ（１）のリードである。In the figure, (1) is an IC package, and (2) is a lead of the IC package (1).

ＴＳＯＰ形ＩＣパッケージ（１）はパッケージの２側面
に細いリート（２）が設けられ、リード（２）は２状に
形成されている。A TSOP type IC package (1) is provided with thin leads (2) on two sides of the package, and the leads (2) are formed in two shapes.

このように構成されたＩＣパッケージ（１）において、
リードを通じてＩＣパッケージ（１）内部のＬＳＩ回路
と外部回路の信号のやりとりが行なわれる。In the IC package (1) configured in this way,
Signals are exchanged between the LSI circuit inside the IC package (1) and the external circuit through the leads.

〔発明か解決しようとする課題〕[Invention or problem to be solved]

従来のＩＣパッケージは以上のように構成されていたの
で、熱抵抗か高く、また、ＴＳＯＰ形ＩＣパッケージは
高さの制限か有る基板に実装する場合、ＩＣパッケージ
上部に放熱板を取付ける事ができないという問題点かあ
った。Conventional IC packages have the above structure, so their thermal resistance is high, and when TSOP type IC packages are mounted on a board with height restrictions, it is not possible to attach a heat sink to the top of the IC package. There was a problem.

この発明は上記のような問題点を解決するためになされ
たもので、ＴＳＯＰ形ＩＣパッケージの放熱効果を向上
させる事を目的とする。This invention was made to solve the above-mentioned problems, and its purpose is to improve the heat dissipation effect of a TSOP type IC package.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るＩＣパッケージは、ＴＳＯＰ形ＩＣパッ
ケージの空いている側面にダミーリード端子を設けたも
のである。The IC package according to the present invention is a TSOP type IC package in which dummy lead terminals are provided on the vacant side surfaces.

〔作用〕[Effect]

この発明におけるＩＣパッケージは、ダミーリード端子
を設けたことにより放熱効果か向上して熱抵抗を低減す
る。The IC package of the present invention improves heat dissipation effect and reduces thermal resistance by providing dummy lead terminals.

〔実施例〕〔Example〕

以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図〜第３図はこの発明の一実施例であるＴＳＯＰ形
ＩＣパッケージの平面図、正面図および側面図、第４図
は第１図〜第３図のダミーリード端子（５）と基板（４
）との取付状態を示す部分拡大正面図である。1 to 3 are a plan view, a front view, and a side view of a TSOP type IC package that is an embodiment of the present invention, and FIG. 4 is a diagram showing the dummy lead terminal (5) and the board shown in FIGS. (4
) is a partially enlarged front view showing the attached state.

図において、（１）はＩＣパッケージ、（２）はリード
端子、（３）は基板上の配線パターン、（４）は基板、
（５）は放熱用のダミーリード端子である。In the figure, (1) is the IC package, (2) is the lead terminal, (3) is the wiring pattern on the board, (4) is the board,
(5) is a dummy lead terminal for heat radiation.

次に動作について説明する。Next, the operation will be explained.

本実施例におけるＩＣパッケージ（１）はＴＳＯＰ形Ｉ
Ｃパッケージの空いている側面にダミーリード端子（５
）を設け、基板（４）のＶｓｓ等の太い配線パターン（
３）と接続することにより、その放熱効果を向上させた
ものである。The IC package (1) in this example is TSOP type I.
Connect dummy lead terminals (5
), and thick wiring patterns such as Vss on the board (4) (
3), the heat dissipation effect is improved.

なお、上記実施例ては幅の広いダミーリード端子（５）
を設けた場合を示したか、通常のリート端子と同形のタ
ミーリード端子を設けてもよい。In addition, in the above embodiment, a wide dummy lead terminal (5) is used.
However, a tummy lead terminal having the same shape as a normal lead terminal may also be provided.

また、ダミーリード端子の先端は２状でなくコの字状に
内側にまげでもよい。Furthermore, the tips of the dummy lead terminals may be bent inward in a U-shape instead of being bi-shaped.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、放熱用のタミーリード
端子を設けたので、放熱効果が増大し、熱抵抗を下げら
れるという効果が有る。As described above, according to the present invention, since the tummy lead terminal for heat radiation is provided, the heat radiation effect is increased and the thermal resistance is reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第３図はこの発明の一実施例によるＩＣパッケ
ージの平面図、正面図および側面図、第４図は第１図の
ＩＣパッケージを実装した状態を示す部分拡大正面図、
第５図〜第７図は従来のＩＣパッケージの平面図、正面
図および側面図である。 図において、（１）はＴＣＣバラゲージ（２）はリード
、（３）は基板の配線パターン、（４）は基板、（５）
はダミーリード端子を示す。 なお、図中、同一符号は同一、または相当部分を示す。 第１図 第４図1 to 3 are a plan view, a front view, and a side view of an IC package according to an embodiment of the present invention, and FIG. 4 is a partially enlarged front view showing a state in which the IC package of FIG. 1 is mounted.
5 to 7 are a plan view, a front view, and a side view of a conventional IC package. In the figure, (1) is the TCC barrier gauge (2) is the lead, (3) is the wiring pattern of the board, (4) is the board, (5) is
indicates a dummy lead terminal. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Figure 1 Figure 4

Claims (1)

【特許請求の範囲】[Claims] ＴＳＯＰ形ＩＣパッケージにおいて、放熱用のダミーリ
ード端子を設けた事を特徴とするＩＣパッケージAn IC package characterized by having dummy lead terminals for heat dissipation in a TSOP type IC package.
JP2335375A 1990-11-28 1990-11-28 Ic package Pending JPH04199552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2335375A JPH04199552A (en) 1990-11-28 1990-11-28 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2335375A JPH04199552A (en) 1990-11-28 1990-11-28 Ic package

Publications (1)

Publication Number Publication Date
JPH04199552A true JPH04199552A (en) 1992-07-20

Family

ID=18287837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2335375A Pending JPH04199552A (en) 1990-11-28 1990-11-28 Ic package

Country Status (1)

Country Link
JP (1) JPH04199552A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629153U (en) * 1992-09-17 1994-04-15 アイワ株式会社 Electronic parts
US9472538B2 (en) 2013-07-04 2016-10-18 Mitsubishi Electric Corporation Semiconductor device manufacturing method and semiconductor device
NL2022346A (en) * 2018-01-17 2019-07-25 Shindengen Electric Mfg Electronic module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629153U (en) * 1992-09-17 1994-04-15 アイワ株式会社 Electronic parts
US9472538B2 (en) 2013-07-04 2016-10-18 Mitsubishi Electric Corporation Semiconductor device manufacturing method and semiconductor device
JP6065978B2 (en) * 2013-07-04 2017-01-25 三菱電機株式会社 Semiconductor device manufacturing method, semiconductor device
NL2022346A (en) * 2018-01-17 2019-07-25 Shindengen Electric Mfg Electronic module
US11309250B2 (en) 2018-01-17 2022-04-19 Shindengen Electric Manufacturing Co., Ltd. Electronic module

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