JPH036840A - Recording medium - Google Patents

Abstract

PURPOSE:To realize compactness of a recording medium through reduction or circuit module and to enable reduction in manufacture time through simplification of a manufacture process by making a wire bonding direction of an integrated circuit chip in one specified direction. CONSTITUTION:In an IC card 1, a wire bonding direction of a wire 7 to connect a circuit module 3 and a printed substrate 6 is only in a longitudinal direction of a module substrate 4, and also led out from only one side 5a; therefore, it is possible to eliminate the necessity of arranging the printed substrate 6 to the other side 5b, an upper side 5c, or a lower side 5d of the module substrate 4, and to reduce both sizes W1, W2 of length and width of the module substrate 4 smaller than a conventional device, thereby realizing compactness of the IC card 1 itself. Furthermore, a moving amount of a bonding head during manufacture of the circuit module 3 is small as compared with a conventional one, thereby enabling reduction in manufacturing time of the IC card 1.

Description

Detailed Description of the Invention [Objective of the Invention (Industrial Application Field) The present invention relates to a recording medium, and more particularly, to a recording medium having a circuit module mounted with an integrated circuit chip such as an IC chip or an LSI chip. .

(Prior Art) Conventionally, the IC cards shown in FIGS. 4 and 5 are known as a type of this type of recording medium.

The IC card 20 shown in the figure is constructed by mounting a circuit module 22 inside a thin, rectangular card body 21.

As shown in FIGS. 5 and 6, the circuit module 22 includes a square IC chip 24 adhesively fixed to the center of a square module board 23, and a circuit pattern formed on all four sides of the module board 23. A printed circuit board 25 is disposed, and each connection terminal on the four sides of the IC chip 24 is connected to each circuit pattern of the printed circuit board 25 using wires 26 by a wire bonding method.

This circuit module 22 is arranged between two oversheets 28a and 28b made of vinyl chloride, for example, which are arranged in parallel at a constant interval with a spacer 27, and between both oversheets 28a and 28b with a module spacer 29.
Built-in and fixed between 28b. In addition, in FIG. 5, 30 is a tactile part exposed on the surface side of one oversheet 28a.

However, in the IC card 20 with the above configuration,
The wire bonding direction of the wire 26 connecting the IC chip 24 and the printed circuit board 25 is
Since the IC module 24 is oriented in four directions outward from each of the four sides, the IC module 24 becomes larger and the IC
There is a problem in that the card 20 itself becomes larger.

Further, in the manufacturing stage of the IC card 20, the amount of movement of the bonding head for performing wire bonding increases as wire bonding is performed in four directions, resulting in a problem that manufacturing time becomes longer.

(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a recording medium that can reduce the overall structure and contribute to shortening manufacturing time. That is.

[Structure of the Invention (Means for Solving the Problem) The present invention provides a recording medium having a circuit module configured by mounting an integrated circuit chip by wire bonding, in which the wire bonding direction of the integrated circuit chip is in a specific direction. It is a direction.

(for production) The operation of the recording medium having the above configuration will be explained below.

Since this recording medium has a circuit module in which the wire bonding direction of the integrated circuit chip is one specific direction, the wire bonding area of the circuit module is formed only in the area corresponding to one specific direction of the integrated circuit chip. If possible, this circuit module can be miniaturized, and the recording medium itself can be miniaturized.

Furthermore, the amount of movement of the bonding head during the manufacturing stage is reduced.

(Example) The present invention will be explained in detail below.

FIG. 1 shows an IC card 1 as an example of the recording medium of this embodiment.

The configuration of this IC card 1 is substantially the same as that of a conventional IC card 20. That is, the IC card 1 is constructed by mounting a circuit module 3 within a thin, rectangular card body 2.

As shown in FIGS. 2 and 3, the circuit module 3 has a square I in the approximate center of a rectangular module board 4.
In addition to fixing the C chip 5 with adhesive, a printed circuit board 6 with a circuit pattern formed thereon is arranged along one side 4a of the module board 4, and each connection terminal provided on the one side 5a of the IC chip 5 is connected to each of the printed circuit boards 6. The circuit patterns are connected in one direction, that is, in the longitudinal direction of the rectangular module board 4, using wires 7 by wire bonding.

This circuit module 3 includes two oversheets 8a made of vinyl chloride, for example, which are arranged in parallel by a spacer 10 forming the card body 2.

8b, and a module spacer 9a,
It is internally fixed between both oversheets 8a and gb by 9b. In FIG. 2, reference numeral 11 indicates a contact portion exposed on the surface side of one oversheet 8a.

According to the IC card 1 having the above configuration, the wire bonding direction of the wire 7 connecting the circuit module 3 and the printed circuit board 6 is only in the longitudinal direction of the module board 4, and is derived only from the − side 5a. Therefore, there is no need to arrange the printed circuit board 6 on the other side 5b side, the upper side 5c, and the lower side 5d side of the module board 4, that is, there is no need to form a wire bonding area. Both horizontal dimensions W, , W2 can be made smaller than in the case of the conventional example, that is, the bonding area can be made narrower than in the case of the conventional example, and the size of the circuit module 3 can be reduced. IC by reduction
The card 1 itself can be made smaller.

In addition, since the wire bonding direction of the wire 7 is only one specific direction as described above, the amount of movement of the bonding head during the manufacturing stage of the circuit module 3 is smaller than that of the conventional example. Module 3. Furthermore, the manufacturing time of the IC card 1 can be shortened.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.

[Effects of the Invention] According to the present invention described in detail above, with the above configuration, it is possible to reduce the size of the recording medium by shortening the length of the circuit module, and to shorten the manufacturing time by simplifying the manufacturing process. A recording medium that can contribute to this can be provided.

4. Detailed Description of the Invention Fig. 1 is a plan view showing an IC card which is an embodiment of the recording medium of the present invention, Fig. 2 is a cross-sectional view taken along the line II in Fig. 1, and Fig. 3 is a diagram showing a circuit module FIG. 4 is a plan view of a conventional IC card, FIG. 5 is a sectional view taken along the line ■--■ in FIG. 4, and FIG. 6 is a plan view of a conventional circuit module.

1...IC card, 3...circuit module 5...
IC chip, 7...wire.

No.

Claims (1)

[Claims] In a recording medium having a circuit module configured by mounting an integrated circuit chip by wire bonding,
A recording medium characterized in that the wire bonding direction of the integrated circuit chip is one specific direction.