JPH11185002A - Ic module and manufacture of the ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC module capable of stably bonding a bonding wire without generating edge touch by the bonding wire and a manufacture of the IC module. SOLUTION: This IC module 1 is provided with a substrate 2 for which plural contact patterns 4 are formed on one surface. On the other surface of the substrate 1, an LSI 10 is loaded. Oblong holes 6 corresponding to the contact patterns 4 are formed on the substrate 2 and the bonding wire 8 is bonded between the pad of the LSI 10 and the contact pattern 4 through the oblong hole 6. The oblong hole 6 is extended almost parallelly to the end side of the LSI 10, that is along a direction orthogonal to a bonding direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC module having an LSI mounted on a substrate having a pattern, and a method of manufacturing the IC module.

[0002]

2. Description of the Related Art Conventionally, an IC module incorporated in an IC card is known. Generally, an IC module is formed by mounting an LSI on a substrate on which a contact pattern that functions as a contact point with an external device is formed.

As shown in FIG. 5, a conventional IC module 20 includes a substrate 22 having a contact pattern 24 formed on one surface, and an LS mounted on the other surface of the substrate 22.
I21, and a mold 29 that covers the LSI 21.

A plurality of circular holes 27 communicating with the respective contact patterns 24 formed on one surface of the substrate 22 are formed through the substrate 22.
A bonding wire 28 extending from a corresponding pad (not shown) of I21 is bonded to contact pattern 24.

[0005]

In the conventional IC module 20 of this kind, when the size of the LSI chip 21 to be mounted changes or the position of the pad of the LSI 21 changes, as shown in FIG. Wire 28
May need to be drawn obliquely to the edge of the LSI 21, and an edge touch may occur in which the corner of the edge of the LSI 21 and the loop of the bonding wire 28 contact.

The present invention has been made in view of the above points, and has as its object to provide an IC module capable of stably bonding a bonding wire without causing edge touch by the bonding wire, and a method of manufacturing the IC module. To provide.

[0007]

To achieve the above object, an IC module according to claim 1 of the present invention comprises:
A substrate having a contact pattern formed on one surface, and an end mounted on the other surface of the substrate and having a predetermined thickness in a direction away from the other surface and extending along the other surface An integrated circuit having: a contact provided on a surface of the integrated circuit separated from the substrate and at a predetermined distance from the end; and a contact penetrating the substrate outside the end of the integrated circuit. And a hole formed in communication with the contact pattern and extending along the end portion, and from a contact point of the integrated circuit in a direction substantially perpendicular to the end portion beyond the end portion of the integrated circuit. A bonding wire that is drawn out, passes through a hole formed in the substrate, and is bonded to a contact pattern exposed in the hole.

An IC according to claim 2 of the present invention.
According to the module, the hole formed in the substrate is an oblong hole extending along an end of the integrated circuit.

An IC according to claim 3 of the present invention.
According to the module, the hole formed in the substrate is a rectangular hole extending along an end of the integrated circuit.

An IC according to claim 4 of the present invention.
A method for manufacturing a module includes a step of forming a hole in a substrate, a step of forming a contact pattern partially exposed in the hole on one surface of the holed substrate, and a step of forming a substrate in which the contact pattern is formed. Has a predetermined thickness in a direction away from the other surface, has an end extending along the other surface adjacent to the hole, and is separated from the other surface. Mounting an integrated circuit having a contact connected to the contact pattern at a position separated from the end by a predetermined distance on the surface that has been formed, and from the contact of the integrated circuit mounted on the substrate, Drawing out a bonding wire in a direction substantially perpendicular to the end beyond the end, and bonding the bonding wire to the contact pattern through a hole formed in the substrate. Degree, the and forming a hole extending along the edge of the integrated circuit mounted on said substrate.

An IC according to claim 5 of the present invention.
According to the module manufacturing method, in the step of forming the hole, an oval long hole extending along an end of the integrated circuit mounted on the substrate is formed.

Further, an IC according to claim 6 of the present invention.
According to the module manufacturing method, in the step of forming the hole, a rectangular hole extending along an end of the integrated circuit mounted on the substrate is formed.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG.
FIG. 2 shows a plan view of the IC module 1 of the present invention incorporated in a C card, and FIG. 2 shows the IC module 1 taken along line II-II in FIG.
FIG. 2 is an enlarged cross-sectional view in which a cross section obtained by cutting the module 1 is partially enlarged.

As shown in FIG. 1 and FIG. 2, an IC module 1 according to a first embodiment of the present invention has a plurality of contact patterns 4 (in contact with an external device (not shown)) arranged in parallel on one surface 2a. (Which functions as a contact point between them). On the other surface 2b of the substrate 2 and substantially at the center of the substrate 2, a pair of edges 10 having a predetermined thickness and extending in parallel to each other is provided.
a, 10b (edges extending along contact pattern 4)
Block-shaped LSI 10 having four edges including
Is installed. The LSI 10 is provided on the other surface 2 of the substrate 2.
b is die-bonded.

The substrate 2 has a long hole 6 (described later) and a round hole 7 provided along a pair of edges 10a and 10b of the LSI 10 corresponding to the respective contact patterns 4.
Are formed through the substrate 2. That is, each contact pattern 4 is exposed on the other surface side of the substrate 2 at the portion where the long hole 6 or the round hole 7 is formed. The term "elongated hole" described in the claims refers to the oblong hole shown in FIG. 1 in which both ends are formed in a semicircular arc shape. ".

A plurality of pads 11 formed along a pair of edges 10a and 10b on the upper surface of the LSI 10 remote from the substrate 2,
, A gold wire 8 (hereinafter, referred to as a bonding wire 8) is bonded to each pad 1 of the LSI 10.
1 and the contact pattern 4 are electrically connected. Further, a mold 9 is formed on the other surface of the substrate 2 so as to cover the LSI 10 and the bonding wires 8, and the IC module 1 is formed. In FIG. 2, the mold 9 is omitted for simplification of the drawing.

The long hole 6 formed through the substrate 2 is formed to be long in a direction crossing the bonding direction of the bonding wires 8. More specifically, the long hole 6 extends in parallel with the end sides 10 a and 10 b of the LSI 10 mounted on the substrate 2. Here, the bonding direction ideally refers to a direction orthogonal to the end sides 10a and 10b of the LSI 10.

As described above, the holes through which the bonding wires 8 pass are elongated holes extending in the direction crossing the bonding direction, so that the bonding wires 8 are not formed obliquely with respect to the bonding direction as in the related art. Unwanted edge touch in which the bonding wire 8 contacts a corner of the LSI 10 can be reduced. That is, by forming the long hole 6, the size of the LSI chip 10 changes,
Even when the position of the pad 11 is changed, the bonding wire 8 can be formed along the ideal bonding direction, and the bonding wire 8 can be stably bonded.

FIG. 3 shows an IC module 1 'according to a second embodiment of the present invention. The basic configuration of the IC module 1 'is the same as that of the IC module 1 of the first embodiment except that the long hole 6 is a rectangular hole 6'. Therefore, the same portions as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 3, the bonding wire 8
Even when the holes through which the holes pass are rectangular holes 6 ', the same effects as those of the first embodiment can be obtained.
Next, the IC according to the first and second embodiments described above.
The steps of manufacturing the modules 1 and 1 'will be described with reference to the flowchart of FIG.

First, the substrate 2 is prepared, and a long hole 6 (rectangular hole 6 ') and a round hole 7 are formed at predetermined positions of the substrate 2 (step 1). At this time, the long hole 6 is provided with the LS to be mounted.
It is formed so as to extend in a direction orthogonal to the bonding direction of the bonding wire 8 drawn from the pad 11 provided on the pair of end sides 10a and 10b of I10.

Next, a copper foil is adhered to one surface 2a of the substrate 2 with a predetermined thickness, and the copper foil is etched in accordance with the contact pattern 4. Then, gold plating is performed on the etched copper foil to form a contact pattern 4 on one surface 2a of the substrate 2 (step 2).

Further, as described above, the contact pattern 4
The LSI 10 is die-bonded on the other surface 2b of the substrate 2 on which is formed (step 3), and each pad 1 of the LSI 10
1 and the corresponding contact pattern 4 are bonded by bonding wires 8 (step 4).
At this time, the bonding wire 8 extends in an ideal bonding direction, that is, a direction orthogonal to the end sides 10a and 10b of the LSI 10, and is bonded.

Finally, a mold 9 is formed so as to cover the LSI 10 to which the bonding wires 8 are bonded (step 5), and the IC module 1 is formed.
Note that the present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, the bonding holes formed through the substrate 2 may be formed so as to extend substantially parallel to the edges 10a and 10b of the LSI 10, and may have any shape.

[0025]

As described above, since the IC module of the present invention has the above-described configuration and operation, the bonding wire can be stably bonded without causing edge touch by the bonding wire. .

[Brief description of the drawings]

FIG. 1 is a plan view showing an IC module according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the IC module taken along a line II-II in FIG.

FIG. 3 is a plan view showing an IC module according to a second embodiment of the present invention.

FIG. 4 is a flowchart for explaining a method of manufacturing the IC module shown in FIGS. 1 and 2;

FIG. 5 is a plan view showing a conventional IC module.

[Explanation of symbols]

 1, 1 ': IC module, 2: substrate, 4: contact pattern, 6: long hole, 6': rectangular hole, 7: round hole, 8: bonding wire, 9: mold, 10: LSI, 11: pad.

Claims (6)

[Claims] 1. A substrate having a contact pattern formed on one surface thereof, mounted on the other surface of the substrate, having a predetermined thickness in a direction away from the other surface, and extending along the other surface. An integrated circuit having an extended end; a contact provided on a surface of the integrated circuit separated from the substrate and at a predetermined distance from the end; A hole that penetrates the substrate and communicates with the contact pattern and extends along the end, and from the contact point of the integrated circuit, beyond the end of the integrated circuit, And a bonding wire drawn out in a direction substantially perpendicular to the contact pattern exposed through the hole formed in the substrate through the hole formed in the substrate. 2. The IC module according to claim 1, wherein the hole formed in the substrate is an oblong hole extending along an end of the integrated circuit. 3. The IC module according to claim 1, wherein the hole formed in the substrate is a rectangular hole extending along an end of the integrated circuit. 4. A step of forming a hole in the substrate; a step of forming a contact pattern partially exposed in the hole on one surface of the substrate having the hole formed therein; On the other surface, having an end having a predetermined thickness in a direction away from the other surface, extending along the other surface and adjacent to the hole, being separated from the other surface Mounting an integrated circuit having a contact connected to the contact pattern at a position on the surface and separated from the end by a predetermined distance; and determining the end of the integrated circuit from the contact of the integrated circuit mounted on the substrate. Drawing out a bonding wire in a direction substantially perpendicular to the end beyond the portion, and bonding the bonding wire to the contact pattern through a hole formed in the substrate. Method of manufacturing IC module and forming a hole extending along the edge of the integrated circuit mounted on said substrate. 5. The IC module according to claim 4, wherein, in the step of forming the hole, an elongated hole extending along an end of the integrated circuit mounted on the substrate is formed. Production method. 6. The method for manufacturing an IC module according to claim 4, wherein in the step of forming the hole, a rectangular hole extending along an end of the integrated circuit mounted on the substrate is formed. .