JP2565079B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a vertical surface mount semiconductor device in which external leads are led out from a package in which a semiconductor element is sealed.

[0002]

2. Description of the Related Art Conventional semiconductor devices, particularly semiconductor devices in which general-purpose memory chips are encapsulated, require a mounting density per unit volume on a printed circuit board when these semiconductor devices are used in large quantities in electronic equipment. In order to increase the height, it was mounted vertically. On the other hand, when the semiconductor device encapsulating a general-purpose memory chip is used in a small electronic device that does not require a large amount, horizontal mounting is desirable in order to lower the mounting height of peripheral electronic components. It is necessary to select these semiconductor devices according to the mounting form of the semiconductor devices while using the same chip.

Regarding the technology of this conventional semiconductor device, for example, JP-A-63-16650, JP-A-2-33958, or JP-A-62-104 is known.
No. 148, etc. FIG. 7 is a configuration diagram showing an example of a conventional vertical mounting semiconductor device. The external leads 8 protruding from the lower surface of the resin sealing portion 7 are L-shaped, and the external leads 8a and 8b are alternately arranged. Is turning to. This has achieved a narrow pitch.

FIG. 8 and FIG. 9 are configuration diagrams showing another example of a conventional vertical mounting semiconductor device, in which the external lead 9 protruding from the lower surface of the resin sealing portion 7 is bent twice to form a concave shape. ing. By alternately changing the directions of the external leads 9a and 9b, like the external leads 8a and 8b shown in FIG. 7, it is useful for narrowing the pitch of the semiconductor device.

The external leads 8a, 8b, 9a and 9b shown in FIGS. 7, 8 and 9 are all formed within the plane area of the resin sealing portion 7.

10 and 11 are configuration diagrams showing still another example of the conventional vertical mounting semiconductor device, in which the external lead 11 protruding from the side surface of the resin sealing portion 10 is bent three times to form a concave shape. The external lead 11 is formed so as to surround the resin sealing portion 10.

[0007]

However, in these prior arts, since the directions of the leads projecting from the lower surface of the resin encapsulation portion are alternated, there is a lead existing upward when mounted in a horizontal type, and There was a problem that they could not be mounted on the same plane. Further, when mounted in a horizontal type, since the external leads are configured within the plane area of the resin sealing portion, only the resin sealing portion contacts the printed circuit board, and the external leads cannot contact the printed circuit board. There was also a problem that soldering was not performed sufficiently.

[0008]

According to the present invention, there is provided a semiconductor device comprising:
Lower surface and upper surface facing the lower surface and the upper surface and front
Provided with four side surfaces perpendicular to each serial underside, a lower surface and perpendicular to the lower surface parallel to the bottom piece portion and the package its tip almost vertically projecting the package of the semiconductor device from the lower surface of the sealed package A vertical surface-mounting semiconductor device having a concave first external lead having a side piece portion formed by bending into a bottom piece, the bottom piece protruding substantially vertically from the upper surface facing the lower surface of the package and parallel to the upper surface. parts and opposite of one the substrate surface of the side possess a side piece portion of the tip is formed by bending the upper surface perpendicular to the direction
It was a structure comprising the second outer leads of the semiconductor device you support <br/> during horizontal surface mounting be implemented.

Further, another semiconductor device of the present invention has a bottom surface and
And an upper surface facing the lower surface, the upper surface and the lower surface
Longitudinally of each provided with four side surfaces perpendicular to, comprising a first external lead L-shaped having a lower surface parallel to the bottom piece portion of the substantially vertically projecting the package of the semiconductor device from the lower surface of the sealed package In a surface-mounting type semiconductor device, a bottom piece and a tip of the bottom piece, which project substantially vertically from the upper surface facing the lower surface of the package and are parallel to the upper surface , are provided.
Previous possess a side piece portion formed by bending the upper surface perpendicular to the direction
A horizontal surface mounting that mounts one of the side surfaces facing the board surface.
This is a configuration including a second external lead that supports the semiconductor device during mounting.

Further, the semiconductor device of the present invention may be configured to include a third external lead which has a bottom piece portion which projects substantially vertically from the lower surface of the package and is parallel to the lower surface of the package.

Furthermore, in the semiconductor device of the present invention, the side piece portion of the first external lead and the side piece portion of the second external lead are parallel to a surface perpendicular to the lower surface of the package and are in the same plane. It is also possible to adopt the configuration in.

[0012]

The present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention.

Referring to FIG. 1, in the semiconductor device of this embodiment, the signal leads 3 protruding from the lower surface of the resin encapsulation portion 1 are formed in a concave shape, and the resin encapsulation portion 1 from which the signal leads 3 protrude.
The support lead 5 is formed so as to project from the same surface as the above, and an L-shape is formed in the opposite direction to the signal lead 3.

Further, in this embodiment, the support lead 2 is formed in a concave shape by protruding from the surface of the resin sealing portion 1 facing the signal lead 3. The direction in which the support lead 2 is formed in the concave shape is the same as the direction in which the support lead 2 is formed in the concave shape.

The semiconductor device of this embodiment has two support leads 2, and the projecting positions of the support leads 2 are at three equally divided positions on the opposite surface of the projecting surface of the signal lead 3. It has a configuration that does not break the balance of the sealing portion 1.

The signal leads 3 and the support leads 5 can support the semiconductor device and mount it vertically.

FIG. 2 shows an example of the structure when the semiconductor device of the first embodiment is laterally mounted. The semiconductor device can be horizontally supported by the signal leads 3 and the support leads 2 and can be laterally mounted. At this time, the signal lead side surface portion 4 of the signal lead 3 and the tip end surface of the support lead 2 are on the same plane. When the semiconductor device of this embodiment is mounted in the lateral direction, the signal lead 3 has the side surface portion 4 so that solderability is sufficiently ensured.

That is, the semiconductor device of the present invention can be mounted vertically or horizontally depending on the intended use.

Next, a semiconductor device according to the second embodiment of the present invention will be described.

FIG. 3 is a perspective view of a semiconductor device according to the second embodiment of the present invention.

Referring to FIG. 3, the semiconductor device of this embodiment has one support lead 32.
The projecting position of 2 is in the center of the opposing surface of the projecting surface of the signal lead 3 and has the same configuration as the semiconductor device of the first embodiment except that the configuration is such that the balance of the resin sealing portion 1 is maintained. The same reference numerals are attached to the same components.

FIG. 4 shows an example of the structure when the semiconductor device of the second embodiment is laterally mounted. As described in the first embodiment, the semiconductor device of the second embodiment can be mounted horizontally by horizontally supporting the semiconductor device by the signal lead 3 and the support lead 32.

At this time, the signal side surface portion 4 on the signal lead 3
It goes without saying that the tip surfaces of the support lead 32 and the support lead 32 are in the same plane. When the semiconductor device of this embodiment is mounted in the lateral direction, the signal lead 3 has the side surface 4 so that sufficient solderability can be ensured as in the first embodiment.

Further, when the semiconductor devices of the first and second embodiments are mounted in the lateral direction, the support leads 2 and 32 protruding from the resin sealing portion 1 are fixed by soldering so that the signal leads are formed. 3 can also prevent the displacement,
Soldering is possible.

Next, a semiconductor device according to the third embodiment of the present invention will be described.

FIG. 5 is a perspective view of a semiconductor device according to the third embodiment of the present invention.

Referring to FIG. 5, in the semiconductor device of this embodiment, the signal lead 53 protruding from the lower surface of the resin sealing portion 1 is formed in an L shape, and the resin sealing portion 1 having the signal lead 53 protruding.
The support lead 55 is formed by protruding an L-shape in the direction opposite to the signal lead 53 from the same surface, and the two support leads 52 are formed in a concave shape by protruding from the surface facing the signal lead 53. The direction in which the support lead 52 is formed in the concave shape is the same as the direction in which the signal lead 53 is formed in the L shape, and the protruding position is at a position that is divided into three equal parts of the facing surface of the protruding surface of the signal lead 53. It has a structure for maintaining the balance of the resin sealing portion 1.

FIG. 6 shows an example of the structure when the semiconductor device of the third embodiment is laterally mounted.

This semiconductor device can be horizontally supported by the signal leads 53 and the support leads 52 and mounted laterally.
This is similar to the semiconductor devices of the first and second embodiments.

[0031]

As described above, according to the present invention, the signal lead projecting from the resin-sealed portion is bent in the concave or L-shape, and the supporting lead projecting in the L-direction in the opposite direction extends in the vertical direction. In addition, there is an effect that the concave-shaped support lead facing the above-mentioned signal lead enables lateral mounting. Furthermore, by soldering the support leads during lateral mounting, there is an effect that it is possible to have lead adhesion that is equal to or better than that during vertical mounting.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a lateral mounting example of the semiconductor device shown in FIG.

FIG. 3 is a perspective view of a semiconductor device according to a second embodiment of the present invention.

FIG. 4 is a configuration diagram showing a lateral mounting example of the semiconductor device shown in FIG. 3;

FIG. 5 is a perspective view of a semiconductor device according to a third embodiment of the present invention.

6 is a configuration diagram showing a lateral mounting example of the semiconductor device shown in FIG. 5;

FIG. 7 is a view showing a semiconductor device of a conventional example, (a) is a front view of this semiconductor device, (b) is a side view, and (c) is a perspective view.

FIG. 8 is a perspective view of another conventional semiconductor device.

9A and 9B are diagrams showing another conventional semiconductor device shown in FIG. 8, FIG. 9A being a front view and FIG. 9B being a side view.

FIG. 10 is a perspective view of still another conventional semiconductor device.

11 is a side view of the semiconductor device of still another conventional example shown in FIG. 10 when the semiconductor device is mounted.

[Sign Description] 1,7,10 resin sealing portion 2, 5, 52, 55 supporting leads 3,8,8a, 8b, 9,9a, 9b, 11,32, 5
3 Signal lead 4 Signal lead side surface 6,12 Printed circuit board 13 Component mounting land 14 Solder

Claims (4)

(57) [Claims] 1. A lower surface and an upper surface facing the lower surface and front.
Four side surfaces perpendicular to each of the upper surface and the lower surface
Comprising a has a substantially perpendicular to the bottom surface parallel to the bottom piece portion of projecting the package and the side piece portion of the tip is formed by bending the lower surface perpendicular direction of the package from the lower surface of the sealed package of a semiconductor device In a vertical surface-mounting semiconductor device having a concave-shaped first external lead, a bottom piece portion that protrudes substantially perpendicularly from the upper surface facing the lower surface of the package and is parallel to the upper surface, and a tip thereof is the upper surface. possess a side piece to form bent at a right angle direction of the side surface
For horizontal surface mounting, where one is mounted facing the board
A vertical surface-mount semiconductor device comprising a second external lead that supports the semiconductor device. 2. A lower surface and an upper surface facing the lower surface and front.
Four side surfaces perpendicular to each of the upper surface and the lower surface
Comprises a, in the semiconductor device of the vertical type surface mounting comprising a first external lead L-shaped having a lower surface parallel to the bottom piece portion of the substantially vertically projecting the package of the semiconductor device from the lower surface of the sealed package, the possess a side piece portion formed by bending substantially vertically projecting the surface parallel to the upper bottom piece portion and its distal end to said upper surface <br/> perpendicular direction from the upper surface to the lower surface facing the package of the side
For horizontal surface mounting, where one is mounted facing the board
A vertical surface-mount semiconductor device comprising a second external lead that supports the semiconductor device. 3. A third piece having a bottom piece protruding substantially vertically from the lower surface of the package and parallel to the lower surface of the package.
The vertical surface mount semiconductor device according to claim 1 or 2, further comprising: 4. The side piece portion of the first external lead and the side piece portion of the second external lead are in the same plane parallel to a surface perpendicular to the lower surface of the package. Item 5. The vertical surface mount semiconductor device according to item 1 or 3.