JPH08125323A - Hybrid integrated circuit board module - Google Patents
Hybrid integrated circuit board moduleInfo
- Publication number
- JPH08125323A JPH08125323A JP6263393A JP26339394A JPH08125323A JP H08125323 A JPH08125323 A JP H08125323A JP 6263393 A JP6263393 A JP 6263393A JP 26339394 A JP26339394 A JP 26339394A JP H08125323 A JPH08125323 A JP H08125323A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- integrated circuit
- pins
- pin
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板１にピン
３を介して集積回路基板２を接続した混成集積回路基板
モジュールに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit board module in which an integrated circuit board 2 is connected to a printed board 1 via pins 3.
【０００２】[0002]
【従来の技術】図４、図５に従来の混成集積回路基板モ
ジュールを示す。集積回路基板２は、接続端子となる複
数本のピン３を一側縁部より垂下しており、このピン３
をプリント基板１の接続ターミナル４に挿通すると共に
半田付けすることにより、プリント基板１に立接してい
る。図に於いて、５は、上記のようにして 接続ターミ
ナル４に盛り上げられた半田を示している。2. Description of the Related Art FIGS. 4 and 5 show a conventional hybrid integrated circuit board module. The integrated circuit board 2 has a plurality of pins 3 serving as connection terminals depending from one side edge.
Is pierced to the printed circuit board 1 by being inserted into the connection terminal 4 of the printed circuit board 1 and soldered. In the figure, reference numeral 5 indicates the solder that is raised on the connection terminal 4 as described above.
【０００３】[0003]
【発明が解決しようとする課題】上記従来例では、各接
続ターミナル４での半田５の盛り上げ量が同じであり、
かつ、ピン３の配置は、単に集積回路基板２の回路パタ
ーンに基づいた構造になっていた。In the above-mentioned conventional example, the amount of swelling of the solder 5 in each connection terminal 4 is the same,
In addition, the arrangement of the pins 3 is simply based on the circuit pattern of the integrated circuit board 2.
【０００４】このため、プリント基板１と集積回路基板
２の熱膨張率の差によって、ピン３と接続ターミナル４
の半田５に過度の応力が発生し、そこで半田クラックが
生じるという問題があった。このような、熱膨張の差
は、通電と非通電時に起こり、通電と非通電が繰り返し
行われる混成集積回路基板モジュールにとっては宿命的
なものである。Therefore, due to the difference in coefficient of thermal expansion between the printed circuit board 1 and the integrated circuit board 2, the pin 3 and the connection terminal 4 are
There was a problem that excessive stress was generated in the solder 5 and solder cracks were generated there. Such a difference in thermal expansion occurs during energization and de-energization, and is fatal for a hybrid integrated circuit board module in which energization and de-energization are repeated.
【０００５】本発明は、上記の点に鑑みてなされたもの
であり、熱膨張に基づく、集積回路基板２のピン３とプ
リント基板１の接続ターミナル４とを接続する半田５の
クラックを防止することができる混成集積回路基板モジ
ュールを提供せんとするものである。The present invention has been made in view of the above points, and prevents cracks in the solder 5 connecting the pins 3 of the integrated circuit board 2 and the connection terminals 4 of the printed board 1 due to thermal expansion. A hybrid integrated circuit board module is provided.
【０００６】[0006]
【課題を解決するための手段】この出願に係る発明は、
プリント基板１に、三本以上並設したピン３を介して集
積回路基板２を半田付けにより立設接続した混成集積回
路基板モジュールにおいて、各ピン３をプリント基板１
の接続ターミナル４に挿通し、並設した中央部のピン３
から外端部のピン３にかけて半田５の盛り量を増加させ
て接続して成ることを特徴とする混成集積回路基板モジ
ュールである。The invention according to this application is
In a hybrid integrated circuit board module in which an integrated circuit board 2 is vertically connected by soldering to a printed board 1 through three or more pins 3 arranged in parallel, each pin 3 is connected to the printed board 1
Pin 3 in the central part, which is inserted side by side into the connection terminal 4 of
To the pin 3 at the outer end of the hybrid integrated circuit board module.
【０００７】なお、上記の場合、並設したピン３間のピ
ッチを中央から外側端部にかけて大きくすることが望ま
しい。In the above case, it is desirable to increase the pitch between the pins 3 arranged in parallel from the center to the outer end.
【０００８】この出願に係る他の発明は、プリント基板
１に、三本以上並設したピン３を介して集積回路基板２
を半田付けにより立設接続した混成集積回路基板モジュ
ールにおいて、各ピン３をプリント基板１の接続ターミ
ナル４に挿通し、並設したピン３間のピッチを中央から
外側端部かけて大きくして成ることを特徴とする混成集
積回路基板モジュールである。Another invention according to this application is that an integrated circuit board 2 is provided on a printed board 1 with three or more pins 3 arranged in parallel.
In a hybrid integrated circuit board module in which the pins are vertically connected by soldering, each pin 3 is inserted into the connection terminal 4 of the printed board 1, and the pitch between the pins 3 arranged in parallel is increased from the center to the outer end. It is a hybrid integrated circuit board module characterized by the above.
【０００９】[0009]
【作 用】この出願に係る一つの発明によれば、並設し
た中央部のピン３から外端部のピン３にかけて半田５の
盛り量を増加させたことにより、半田付け部の接合面積
が増加し、集積回路基板２のピン３の並設方向の外側端
部に発生する熱応力を中心部のピン３の半田５の付部の
方に緩和することができる。[Operation] According to one invention of this application, the amount of solder 5 is increased from the pin 3 at the central portion and the pin 3 at the outer end, which are juxtaposed, so that the joint area of the soldering portion is increased. It is possible to increase the thermal stress generated at the outer ends of the pins 3 of the integrated circuit board 2 in the juxtaposed direction, and to reduce the solder 5 of the pins 3 at the center.
【００１０】また、この出願に係る他の一つの発明によ
れば、並設したピン３間のピッチを中央から外側端部か
けて大きくしたことにより、並設方向の外側端部に位置
するピン３に柔軟性（コンプライアンス）が生じ、熱応
力を中心部のピン３の半田付部の方に緩和することがで
きる。According to another invention of the present application, the pitch between the pins 3 arranged in parallel is increased from the center to the outer end, so that the pins located at the outer end in the juxtaposed direction. 3 has flexibility, and thermal stress can be relaxed toward the soldered portion of the pin 3 at the center.
【００１１】さらに、上記の二つの発明を同時に実施す
ることにより、一層、集積回路基板２のピン３の並設方
向の外側端部に発生する熱応力を中心部のピン３の半田
付部の方に緩和することができる。Further, by carrying out the above two inventions at the same time, the thermal stress generated at the outer end portion of the pin 3 of the integrated circuit board 2 in the juxtaposed direction is further increased by the soldering portion of the pin 3 at the center portion. It can be eased to one side.
【００１２】[0012]
【実施例】以下、本発明を実施例に基づき説明する。EXAMPLES The present invention will be described below based on examples.
【００１３】図１および図２に示す混成集積回路基板モ
ジュールは、プリント基板１に、一側縁部に沿って九本
並設したピン３を介して集積回路基板２を半田付けによ
り立設接続した混成集積回路基板モジュールであって、
各ピン３をプリント基板１の接続ターミナル４に挿通
し、並設した中央部のピン３から外端部のピン３にかけ
て半田５の盛り量を増加させて接続して成るものであ
る。In the hybrid integrated circuit board module shown in FIGS. 1 and 2, the integrated circuit board 2 is vertically connected to the printed board 1 by soldering via nine pins 3 arranged in parallel along one side edge. Which is a hybrid integrated circuit board module,
Each pin 3 is inserted into the connection terminal 4 of the printed circuit board 1 and is connected by increasing the amount of solder 5 from the pin 3 at the central portion arranged side by side to the pin 3 at the outer end portion.
【００１４】中央部の三本のピン３の半田５の盛り量が
最も少なく、外端部のピン３にかけて半田５の盛り量を
増加させ、両外端部のピン３の半田５の盛り量が最も多
いものである。The amount of solder 5 on the three pins 3 in the central portion is the smallest, and the amount of solder 5 is increased to reach the pins 3 on the outer ends, and the amount of solder 5 on the pins 3 on both outer ends is increased. Is the most common one.
【００１５】図３に示す混成集積回路基板モジュール
は、プリント基板１に、一側縁に沿って八本並設したピ
ン３をプリント基板１に半田付けにより立設接続した混
成集積回路基板モジュールあって、各ピン３をプリント
基板１の接続ターミナル４に挿通し、並設した中央部の
ピン３から外端部のピン３にかけて、ピン３間のピッチ
を大きくして成るものである。The hybrid integrated circuit board module shown in FIG. 3 is a hybrid integrated circuit board module in which eight pins 3 arranged in parallel along one side edge are vertically connected to the printed board 1 by soldering. Then, each pin 3 is inserted into the connection terminal 4 of the printed circuit board 1, and the pitch between the pins 3 is increased from the pin 3 at the central portion arranged side by side to the pin 3 at the outer end portion.
【００１６】中央部の二本のピン３間のピッチが最も小
さく、両外端部に位置するピン３に向けてピン３間のピ
ッチを大きくしている。The pitch between the two pins 3 in the center is the smallest, and the pitch between the pins 3 is increased toward the pins 3 located at both outer ends.
【００１７】なお、この実施例においても、並設した中
央部のピン３から外端部のピン３にかけて半田５の盛り
量を増加させてもよいのである。In this embodiment as well, the amount of solder 5 may be increased from the pin 3 at the central portion arranged side by side to the pin 3 at the outer end portion.
【００１８】[0018]
【発明の効果】この出願に係る一つの発明によれば、並
設した中央部のピン３から外端部のピン３にかけて半田
５の盛り量を増加させたことにより、半田付け部の接合
面積が増加し、集積回路基板２のピン３の並設方向の外
側端部に発生する熱応力を中心部のピン３の半田付部の
方に緩和することができる。According to one aspect of the present invention, the amount of solder 5 is increased from the pin 3 at the central portion and the pin 3 at the outer end, which are arranged side by side, to increase the joint area of the soldered portion. Therefore, the thermal stress generated at the outer end portion of the pin 3 of the integrated circuit board 2 in the juxtaposed direction can be relaxed toward the soldered portion of the pin 3 at the central portion.
【００１９】また、この出願に係る他の一つの発明によ
れば、並設したピン３間のピッチを中央から外側端部か
けて大きくしたことにより、並設方向の外側端部に位置
するピン３に柔軟性（コンプライアンス）が生じ、熱応
力を中心部のピン３の半田付部の方に緩和することがで
きる。According to another invention of this application, the pitch between the pins 3 arranged in parallel is increased from the center to the outer end, so that the pins located at the outer end in the parallel direction are arranged. 3 has flexibility, and thermal stress can be relaxed toward the soldered portion of the pin 3 at the center.
【００２０】さらに、上記の二つの発明を同時に実施す
ることにより、一層、集積回路基板２のピン３の並設方
向の外側端部に発生する熱応力を中心部のピン３の半田
付部の方に緩和することができる。Further, by carrying out the above-mentioned two inventions at the same time, the thermal stress generated at the outer end portion of the pin 3 of the integrated circuit board 2 in the juxtaposed direction is further increased by the soldering portion of the pin 3 at the center portion. It can be eased to one side.
【００２１】以上のように、本願の発明によれば、熱膨
張に基づく、集積回路基板２のピン３とプリント基板１
の接続ターミナル４とを接続する半田５のクラックを防
止することができる混成集積回路基板モジュールが提供
できた。As described above, according to the invention of the present application, the pins 3 of the integrated circuit board 2 and the printed circuit board 1 are based on thermal expansion.
It was possible to provide a hybrid integrated circuit board module capable of preventing cracks in the solder 5 connecting to the connection terminal 4 of FIG.
【図 １】本発明の一実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図 ２】同上の要部を示す平面図。FIG. 2 is a plan view showing the main part of the same.
【図 ３】本発明の異なる実施例を示す断面図。FIG. 3 is a sectional view showing another embodiment of the present invention.
【図 ４】従来例を示す示す断面図。FIG. 4 is a sectional view showing a conventional example.
【図 ５】同上の要部を示す平面図。FIG. 5 is a plan view showing the main part of the same.
１ プリント基板 ２ 集積回路基板 ３ ピン ４ 接続ターミナル ５ 半田 1 Printed circuit board 2 Integrated circuit board 3 Pin 4 Connection terminal 5 Solder
Claims (3)
ン３を介して、集積回路基板２を半田付けにより立設接
続した混成集積回路基板モジュールにおいて、各ピン３
をプリント基板１の接続ターミナル４に挿通し、並設し
た中央部のピン３から外端部のピン３にかけて半田５の
盛り量を増加させて接続して成ることを特徴とする混成
集積回路基板モジュール。1. A hybrid integrated circuit board module in which an integrated circuit board 2 is vertically connected by soldering to a printed circuit board 1 via three or more pins 3 arranged in parallel.
Is inserted into the connection terminal 4 of the printed circuit board 1 and is connected by increasing the amount of the solder 5 from the pin 3 at the central portion arranged side by side to the pin 3 at the outer end portion. module.
側端部にかけて大きくして成ることを特徴とする請求項
１記載の混成集積回路基板モジュール。2. The hybrid integrated circuit board module according to claim 1, wherein the pitch between the pins 3 arranged in parallel is increased from the center to the outer end.
ン３を介して、集積回路基板２を半田付けにより立設接
続した混成集積回路基板モジュールにおいて、各ピン３
をプリント基板１の接続ターミナル４に挿通し、並設し
たピン３間のピッチを中央から外側端部かけて大きくし
て成ることを特徴とする混成集積回路基板モジュール。3. A hybrid integrated circuit board module in which an integrated circuit board 2 is vertically connected by soldering to a printed board 1 via three or more pins 3 arranged in parallel.
Is inserted into the connection terminal 4 of the printed circuit board 1 and the pitch between the pins 3 arranged in parallel is increased from the center to the outer end portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263393A JPH08125323A (en) | 1994-10-27 | 1994-10-27 | Hybrid integrated circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263393A JPH08125323A (en) | 1994-10-27 | 1994-10-27 | Hybrid integrated circuit board module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08125323A true JPH08125323A (en) | 1996-05-17 |
Family
ID=17388876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6263393A Withdrawn JPH08125323A (en) | 1994-10-27 | 1994-10-27 | Hybrid integrated circuit board module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08125323A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112531A1 (en) * | 2004-05-17 | 2005-11-24 | Nec Corporation | Circuit board and electronic apparatus employing it |
-
1994
- 1994-10-27 JP JP6263393A patent/JPH08125323A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005112531A1 (en) * | 2004-05-17 | 2005-11-24 | Nec Corporation | Circuit board and electronic apparatus employing it |
| JPWO2005112531A1 (en) * | 2004-05-17 | 2008-03-27 | 日本電気株式会社 | Circuit board and electronic device using the circuit board |
| JP4735538B2 (en) * | 2004-05-17 | 2011-07-27 | 日本電気株式会社 | Electronics |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020115 |