JPH08186337A - Printed wiring board structure - Google Patents

Abstract

PURPOSE: To provide a printed wiring board structure which prevents the inclination of an electronic component to be mounted on a printed wiring board by utilizing an insertion hole in the printed wiring board with reference to the component generating the inclination in a mounting operation and performs a designing operation and an assembly operation without trouble. CONSTITUTION: Insertion holes 11A, 12A in the mounting part on a printed wiring board of an electronic component are formed in two or more kinds of hole diameters D, D', the hole diameter D of the mounting holes 11A on one side is formed to a hole diameter (d)+α in which a margin value α has been added to a size (d) for every lead 8 for the electronic component, and the insertion holes 11A of the hole diameter (d)+α are arranged in the same size as the electronic component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board structure used in electronic equipment.

[0002]

2. Description of the Related Art The insertion hole of a discrete component to be mounted on a printed wiring board is determined by adding a margin value to the lead diameter of an electronic component to determine the hole diameter. It was arranged with the same dimensions as the electronic component 2.

In Japanese Utility Model Laid-Open No. 3-75561,
As shown in (1) and (2) of FIG. 10, the insertion hole 15 of the component mounting portion is divided into a pair of adjacent parallel lines so that the center of the insertion hole 15 is located. . Reference numeral 8 is a lead of the electronic component 2.

[0004]

Generally, the insertion holes for discrete components mounted on this type of printed wiring board are
In consideration of workability in the process of assembling a printed wiring board, the hole diameter is determined by a dimension obtained by adding a margin value to the lead dimension of the electronic component. Therefore, some electronic components in which the leads are in a straight line or in parallel are tilted back and forth due to their own weight after mounting. As in the electronic component 2 shown in FIG. 9, when the electronic component located next to the electronic component 2 enters the area 14 and is soldered, the electronic component located next to the electronic component 2 is attached in the soldering process or less. Two
It could not be implemented.

Further, the electronic component 2 is connected to the printed wiring board 1
When the electronic device is mounted near the end face of the electronic device, the device may be tilted and protrude from the end face, and when the electronic device is attached to the main body, the electronic device may not be attached by hitting a component of the main body.

[0006] In order to avoid such a problem, when designing the printed wiring board 1, there is arranged a component which is not problematic even if it is tilted next to the electronic component 2 as described above, and there is a problem in assembly work. In some places, the inclination was corrected to be vertical, and both design work and assembly work were troublesome.

In addition, in the insertion hole 15 shown in the known example of FIG. 10, since the insertion hole 15 is divided and arranged on parallel lines, the wiring area of the pattern becomes small when the pattern of the printed wiring board 1 is designed. , Design work will be difficult.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component to be mounted on a printed wiring board, which is printed with respect to a component which is inclined during mounting. An object of the present invention is to provide a printed wiring board structure that can prevent the components from being inclined by using the insertion holes of the board and save the design work and the assembly work.

[0009]

In order to achieve the above object, the printed wiring board structure according to the present invention has two or more kinds of hole diameters for the insertion holes of the mounting portion of the electronic component to the printed wiring board. It is characterized in that the hole diameter of one of the insertion holes is a hole diameter obtained by adding a margin value to the size of the lead of the electronic component, and the insertion holes having this hole diameter are arranged in the same size as the electronic component.

Further, in the printed wiring board structure according to the first aspect, the leads of the electronic components may be arranged in a straight line or may be arranged in parallel.

Further, claim 1 or claim 2 or claim 3
In the printed wiring board structure described above, assuming that the hole diameter of one insertion hole is D and the margin value to be added to the lead dimension d is α, the hole diameter of one insertion hole is determined by D = d + α and the other insertion hole is determined. Suppose that the hole diameter of D is D ′ and the margin value to be added is α ′, the hole diameter of the other insertion hole is determined by D ′ = d + α ′, and one insertion hole <the other insertion hole. Good.

[0012]

With this structure, by using a hole diameter obtained by adding a margin value to the size of the lead for the insert hole, the gap between the insert hole and the lead is small when the lead is inserted into the insert hole and electronic components are attached. As a result, the insertion hole comes to hold the lead, and the electronic component is prevented from tilting.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view showing a state in which electronic parts are mounted on a printed wiring board structure according to the present invention, FIG. 2 is a view from the direction of the arrow A in FIG. 1, and FIG. 3 is an insertion of the printed wiring board structure according to the present invention. It is a top view which shows the arrangement | sequence of the lead insertion of a hole.

As shown in FIG. 1, a plurality of electronic components 2, 2-1, 3, 4, 4-1, 5 and 6 are mounted on a printed wiring board 1 by soldering 10 and have a circuit function. There is. Among them, when the electronic components are attached, the electronic components 2 and 2-1 which are inclined by their own weight are vertically attached as shown in FIG. I can not be installed. 7 is a mounting hole.

To prevent this, the insertion holes for mounting the electronic parts 2 and 2-1 are as shown in FIG.
Two kinds of hole diameters of the insertion holes 11A and 12A are arranged in the printed wiring board 1 with the same size as the electronic components 2 and 2-1.

In this case, if the hole diameter of the insertion hole 11A is D and the margin value to be added to the dimension d of the lead 8 of the electronic component 2 is α, then D = d + α α = 0 to 0.15 mm The pore size of the can be determined.

Further, although the insertion hole 12A shows the hole diameter used conventionally, the hole diameter may be newly determined. In this case, if the hole diameter of the insertion hole 12 is D ′ and the margin value to be added is α ′, the hole diameter of the insertion hole 11A can be determined by D ′ = d + α ′ α ′ = 0.2 mm or more. That is, the sizes of the insertion hole 11A and the insertion hole 12A are such that the relationship of insertion hole 11A <insertion hole 12A is satisfied.

The arrangement of the insertion holes 11A and 12A is shown in FIG.
As shown in (2), two insertion holes 11A are provided at each end, and all the other insertion holes are the insertion holes 12A.

As the arrangement of the insertion holes 11A and 12A, as shown in FIG. 4, three insertion holes 11A may be provided at both ends, and all the other insertion holes may be the insertion holes 12A. As shown in FIG. 5, the insertion holes 11A and the insertion holes 12A may be provided alternately.

The above-mentioned arrangement of the insertion holes 11A and 12A is an example, and in the present invention, at least one insertion hole 11A is provided, and two kinds of holes are provided according to the lead arrangement of the electronic component 2. Depending on how they are combined, various arrangements can be made.

Insertion holes 11A and 1A shown in FIGS. 3, 4 and 5.
The electronic component 2 that can use 2A is the electronic component 2 shown in FIG.
It is a component having such a shape, and can be mainly used for an electronic component 2 in which leads 8 such as a SIP type IC and a collective resistor are arranged in a line and tilt when mounting the component.

In addition, mainly when the ZIP type IC and the lead 8 are used for the electronic component 2 in which the leads 8 are arranged in parallel, the insertion holes are arranged in two rows as shown in FIG. One insertion hole 11A is provided at each end, and all the other insertion holes are used as the insertion hole 12A. Also in this case, the insertion holes 11A, 1
The arrangement of 2A is an example, and in the present invention, the insertion hole 11
At least one A is provided, and two types of holes are combined according to the lead arrangement of the electronic component.
There are many ways to arrange.

In the above embodiment, two types of insertion holes 11A and 12A are provided for the same shaped lead of one electronic component.
However, it is also possible to determine the hole diameter in the above manner and arrange two or more kinds of insertion holes in accordance with the electronic component.

As shown in FIG. 7, the printed wiring board 1 is prepared with materials (step S100) and holes (step S10).
1), catalyst (step S102), circuit formation (step S103), etching (step S104), chemical plating (step S105), resist printing (step S)
106), silk printing (step S107), outer shape processing (step S108), board inspection (step S109).
Although it is manufactured through the respective steps of
The formation of A is performed in the punching step of step S101.

Therefore, by using the hole diameter D in which the margin value α is added to the dimension of the lead 8 for the insertion hole 11A, the lead 8 is inserted into the insertion hole 11A and the electronic component 2 is attached to the insertion hole 11A. The gap between the leads 8 becomes smaller, the insertion hole 11A presses the leads 8, and the electronic component 2 does not tilt.

[0026]

As described above, according to the present invention,
By using a hole diameter with a margin added to the lead size for the insertion hole, the gap between the insertion hole and the lead becomes smaller when the lead is inserted into the insertion hole and the electronic components are attached, and the insertion hole It will be pressed down and the electronic parts will not tilt.

As described above, in the electronic component to be mounted on the printed wiring board, it is possible to prevent the component from tilting by utilizing the insertion hole of the printed wiring board for the component which is tilted at the time of mounting. In addition, the assembly work can be done without any trouble.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which electronic components are mounted on a printed wiring board structure according to the present invention.

FIG. 2 is a view from the direction A in FIG.

FIG. 3 is a plan view showing an example of a lead insertion arrangement of insertion holes of the printed wiring board structure according to the present invention.

FIG. 4 is a plan view showing another example of the lead insertion arrangement of the insertion holes of the printed wiring board structure according to the present invention.

FIG. 5 is a plan view showing another example of the lead insertion arrangement of the insertion holes of the printed wiring board structure according to the present invention.

FIG. 6 is a plan view showing another example of the lead insertion arrangement of the insertion holes of the printed wiring board structure according to the present invention.

FIG. 7 is a flowchart of a manufacturing process of a printed wiring board.

FIG. 8 is a plan view showing a lead insertion arrangement of insertion holes of a conventional printed wiring board structure.

FIG. 9 is an explanatory diagram showing a state in which electronic components are mounted on a conventional printed wiring board structure.

FIG. 10A is a plan view showing a lead insertion arrangement of insertion holes of a conventional printed wiring board structure. (2) is a plan view showing a lead insertion arrangement of insertion holes of a conventional printed wiring board structure.

[Explanation of reference numerals] 1 printed wiring board 2 electronic component 8 lead 11A insertion hole 12A insertion hole

Claims (4)

[Claims] 1. An insertion hole for mounting an electronic component on a printed wiring board has two or more types of hole diameters, and one of the insertion holes has a hole diameter obtained by adding a margin value to a dimension of a lead of the electronic component. A printed wiring board structure characterized in that insertion holes of this hole diameter are arranged in the same size as an electronic component. 2. The printed wiring board structure according to claim 1, wherein the leads of the electronic component are arranged in a straight line. 3. The printed wiring board structure according to claim 1, wherein the leads of the electronic component are arranged in parallel. 4. D = d +, where D is the hole diameter of one of the insertion holes and α is the margin value to be added to the lead dimension d.
If the hole diameter of one insertion hole is determined by α, the hole diameter of the other insertion hole is D ′, and the margin value to be added is α ′, then D ′ = d
Use + α 'to determine the diameter of the other insertion hole, and
The printed wiring board structure according to claim 1, 2 or 3, wherein the other insertion hole is provided.