JPH041757Y2 - - Google Patents
Info
- Publication number
- JPH041757Y2 JPH041757Y2 JP6963086U JP6963086U JPH041757Y2 JP H041757 Y2 JPH041757 Y2 JP H041757Y2 JP 6963086 U JP6963086 U JP 6963086U JP 6963086 U JP6963086 U JP 6963086U JP H041757 Y2 JPH041757 Y2 JP H041757Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- heat
- fins
- window
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 29
- 238000001816 cooling Methods 0.000 claims description 27
- 238000009423 ventilation Methods 0.000 claims description 11
- 210000002105 tongue Anatomy 0.000 description 10
- 230000005855 radiation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6963086U JPH041757Y2 (zh) | 1986-05-09 | 1986-05-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6963086U JPH041757Y2 (zh) | 1986-05-09 | 1986-05-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62182600U JPS62182600U (zh) | 1987-11-19 |
| JPH041757Y2 true JPH041757Y2 (zh) | 1992-01-21 |
Family
ID=30910535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6963086U Expired JPH041757Y2 (zh) | 1986-05-09 | 1986-05-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041757Y2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636585Y2 (ja) * | 1989-05-17 | 1994-09-21 | 三菱アルミニウム株式会社 | 電気素子用放熱器 |
| KR100674135B1 (ko) | 2005-04-18 | 2007-01-24 | (주) 대홍기업 | 히트 싱크 |
| JP5599235B2 (ja) * | 2010-06-14 | 2014-10-01 | 下西技研工業株式会社 | 放熱板 |
-
1986
- 1986-05-09 JP JP6963086U patent/JPH041757Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62182600U (zh) | 1987-11-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6967845B2 (en) | Integrated heat dissipating device with curved fins | |
| US7339792B2 (en) | Graphics card apparatus with improved heat dissipating assemblies | |
| KR100622793B1 (ko) | 열 발생소자가 내부에 수납된 박스의 냉각 장치 및 이의냉각 방법 | |
| US7131487B2 (en) | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers | |
| US6510053B1 (en) | Circuit board cooling system | |
| JPH03268483A (ja) | 電子機器の冷却装置 | |
| JPH041757Y2 (zh) | ||
| JP2003258463A (ja) | 筐体の熱交換構造 | |
| JP4320401B2 (ja) | 電子機器およびその実装方法 | |
| JPH0595062A (ja) | Ｌｓｉ空冷機構 | |
| JP2002271073A (ja) | 電子機器筐体の冷却装置 | |
| JPH0611585Y2 (ja) | 風向調整具 | |
| JP3225738U (ja) | 電子機器 | |
| JPH0560680B2 (zh) | ||
| JP2003008274A (ja) | 電子機器装置 | |
| US7362584B2 (en) | Heat relief socket | |
| JP3261820B2 (ja) | 発熱素子搭載基板 | |
| JPH04266091A (ja) | 電子装置の冷却機構 | |
| CN211671161U (zh) | 一种高性能集成电路板 | |
| WO2024062574A1 (ja) | 電子制御装置 | |
| JPH05198714A (ja) | 電子機器の冷却構造 | |
| JPH06260784A (ja) | 冷却装置 | |
| JP3711032B2 (ja) | 発熱性の電子部品の冷却構造 | |
| JP2017162892A (ja) | 電子機器筐体 | |
| JP2003243860A (ja) | 電子機器 |