JPH041737Y2 - - Google Patents
Info
- Publication number
- JPH041737Y2 JPH041737Y2 JP1982081159U JP8115982U JPH041737Y2 JP H041737 Y2 JPH041737 Y2 JP H041737Y2 JP 1982081159 U JP1982081159 U JP 1982081159U JP 8115982 U JP8115982 U JP 8115982U JP H041737 Y2 JPH041737 Y2 JP H041737Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- terminal
- recess
- substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8115982U JPS58184844U (ja) | 1982-06-01 | 1982-06-01 | セラミツクパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8115982U JPS58184844U (ja) | 1982-06-01 | 1982-06-01 | セラミツクパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58184844U JPS58184844U (ja) | 1983-12-08 |
| JPH041737Y2 true JPH041737Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-21 |
Family
ID=30090280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8115982U Granted JPS58184844U (ja) | 1982-06-01 | 1982-06-01 | セラミツクパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58184844U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711144B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-03-08 | 1982-03-02 |
-
1982
- 1982-06-01 JP JP8115982U patent/JPS58184844U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58184844U (ja) | 1983-12-08 |