JPH041736Y2 - - Google Patents
Info
- Publication number
- JPH041736Y2 JPH041736Y2 JP11744987U JP11744987U JPH041736Y2 JP H041736 Y2 JPH041736 Y2 JP H041736Y2 JP 11744987 U JP11744987 U JP 11744987U JP 11744987 U JP11744987 U JP 11744987U JP H041736 Y2 JPH041736 Y2 JP H041736Y2
- Authority
- JP
- Japan
- Prior art keywords
- marking
- resin
- resin layer
- black
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000005011 phenolic resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 21
- 229920001568 phenolic resin Polymers 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 description 17
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 3
- 230000001427 coherent effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11744987U JPH041736Y2 (enExample) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11744987U JPH041736Y2 (enExample) | 1987-07-30 | 1987-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422037U JPS6422037U (enExample) | 1989-02-03 |
| JPH041736Y2 true JPH041736Y2 (enExample) | 1992-01-21 |
Family
ID=31360918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11744987U Expired JPH041736Y2 (enExample) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041736Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05306568A (ja) * | 1992-04-30 | 1993-11-19 | Tostem Sera Kk | 密嵌連結用金属サイディング |
-
1987
- 1987-07-30 JP JP11744987U patent/JPH041736Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6422037U (enExample) | 1989-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6372293B1 (en) | Test tube with data matrix code markings | |
| CN101371266B (zh) | 存储卡 | |
| JPH041736Y2 (enExample) | ||
| US3952410A (en) | Probe card including a multiplicity of probe contacts and method of making | |
| JPH01144695A (ja) | 印刷基板の識別方法 | |
| JPH0353858U (enExample) | ||
| JPS5839494A (ja) | マ−キング方法 | |
| KR20060052300A (ko) | 반도체 장치 및 그 제조 방법 | |
| JPS62221138A (ja) | 半導体装置およびその製造に用いるモ−ルド金型 | |
| JPH06177268A (ja) | 半導体装置の製造方法 | |
| JPH0436148Y2 (enExample) | ||
| JPH08148804A (ja) | 電気回路の作成方法 | |
| KR20020045675A (ko) | 핫 스탬핑호일을 이용한 표면인쇄방법 | |
| KR100530959B1 (ko) | 금속표면의 칼라패턴 형성방법 | |
| JPH08156321A (ja) | Ｌｅｄアレイヘッドの構造 | |
| JPS61230980A (ja) | ホツトスタンピング方法 | |
| JPS61198186A (ja) | 表示パネル等の表示面加工方法 | |
| JPS6233353Y2 (enExample) | ||
| JPS60234618A (ja) | 鍋の刻印 | |
| JPS5936599B2 (ja) | 凸状の金属光沢模様およびその金属光沢模様の現出方法 | |
| JPH0563111A (ja) | 半導体装置 | |
| JPS6315446A (ja) | 半導体装置の製造方法 | |
| JPH0370115A (ja) | 電子部品 | |
| JPS63107599A (ja) | 金属箔押表示体及びその製造方法 | |
| JPS5839859U (ja) | 色彩模様を有する金属箔積層装飾板 |