JPH0416945B2 - - Google Patents

Info

Publication number
JPH0416945B2
JPH0416945B2 JP57075438A JP7543882A JPH0416945B2 JP H0416945 B2 JPH0416945 B2 JP H0416945B2 JP 57075438 A JP57075438 A JP 57075438A JP 7543882 A JP7543882 A JP 7543882A JP H0416945 B2 JPH0416945 B2 JP H0416945B2
Authority
JP
Japan
Prior art keywords
circuit
input
circuits
gnd
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57075438A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194363A (ja
Inventor
Yoji Nishio
Shigeo Kuboki
Ikuro Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7543882A priority Critical patent/JPS58194363A/ja
Publication of JPS58194363A publication Critical patent/JPS58194363A/ja
Publication of JPH0416945B2 publication Critical patent/JPH0416945B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP7543882A 1982-05-07 1982-05-07 半導体集積回路装置 Granted JPS58194363A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7543882A JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7543882A JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS58194363A JPS58194363A (ja) 1983-11-12
JPH0416945B2 true JPH0416945B2 (US06486227-20021126-C00005.png) 1992-03-25

Family

ID=13576233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7543882A Granted JPS58194363A (ja) 1982-05-07 1982-05-07 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS58194363A (US06486227-20021126-C00005.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169464A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 半導体集積回路装置
JP3132635B2 (ja) * 1995-02-22 2001-02-05 日本電気株式会社 半導体集積回路の試験方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (US06486227-20021126-C00005.png) * 1972-09-18 1974-05-17
JPS52119802A (en) * 1976-04-01 1977-10-07 Matsushita Electronics Corp Semiconductor ic device
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4950878A (US06486227-20021126-C00005.png) * 1972-09-18 1974-05-17
JPS52119802A (en) * 1976-04-01 1977-10-07 Matsushita Electronics Corp Semiconductor ic device
JPS5420680A (en) * 1977-07-18 1979-02-16 Hitachi Ltd Large scale integrated circuit

Also Published As

Publication number Publication date
JPS58194363A (ja) 1983-11-12

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