JPH04164953A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH04164953A JPH04164953A JP29076690A JP29076690A JPH04164953A JP H04164953 A JPH04164953 A JP H04164953A JP 29076690 A JP29076690 A JP 29076690A JP 29076690 A JP29076690 A JP 29076690A JP H04164953 A JPH04164953 A JP H04164953A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- thermal conductivity
- fused silica
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 22
- 239000000203 mixture Substances 0.000 title claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 13
- 229910002026 crystalline silica Inorganic materials 0.000 claims abstract description 11
- 239000005350 fused silica glass Substances 0.000 claims abstract description 11
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract description 5
- 229930185605 Bisphenol Natural products 0.000 abstract description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000012778 molding material Substances 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、熱伝導性か良く、耐クラ・ツク性に良好な半
導体用封止樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a encapsulating resin composition for semiconductors that has good thermal conductivity and good scratch resistance.
従来より、エポキシ樹脂組成物はエポキシ樹脂に硬化剤
等を配合し、充填材として結晶シリカや破砕タイプの溶
融シリカを用いる事が知られている。Conventionally, it has been known that epoxy resin compositions are made by blending an epoxy resin with a curing agent, etc., and using crystalline silica or crushed type fused silica as a filler.
しかし、最近の電子部品の急速な進歩及び、高機能化等
により、樹脂特性として、機械特性、電気特性、密着性
、耐湿性、耐クラツク性、成形性に加えて熱伝導性に優
れていることが要求されてきている。However, due to recent rapid progress and increased functionality in electronic components, resin properties such as mechanical properties, electrical properties, adhesion, moisture resistance, crack resistance, moldability, and thermal conductivity are now excellent. There is a growing demand for this.
つまりＩＣの高集積化、ハイパワー化によりチップより
の発熱か大きくなり、この熱をパッケージを通して放熱
する必要がでてきた。In other words, as ICs become more highly integrated and have more power, the chips generate more heat, and it has become necessary to dissipate this heat through the package.
従来の結晶シリカ又は破砕タイプの溶融シリカきないと
いう欠点があった。There is a drawback that conventional crystalline silica or crushed type fused silica cannot be used.
本発明の目的は充填材として結晶シリカと球状の溶融シ
リカを併用することにより機械特性、耐クラツク性、熱
伝導性、成形性に優れたエポキシ樹脂組成物を提供する
ことにある。An object of the present invention is to provide an epoxy resin composition that has excellent mechanical properties, crack resistance, thermal conductivity, and moldability by using both crystalline silica and spherical fused silica as fillers.
本発明者は、これらの問題を解決するために研究を進め
、以下の組成物を見出した。The present inventor conducted research to solve these problems and discovered the following composition.
エポキシ樹脂、硬化剤、硬化促進剤及び充填材からなる
エポキシ樹脂組成物において平均粒径か５〜３０μの結
晶シリカと平均粒径か５〜４０μの球状の溶融シリカと
からなり、球状の溶融シリカの配合割合か充填材中に５
〜５０容量％となるエポキシ樹脂組成物である。An epoxy resin composition consisting of an epoxy resin, a curing agent, a curing accelerator, and a filler is composed of crystalline silica with an average particle size of 5 to 30 μm and spherical fused silica with an average particle size of 5 to 40 μm. 5 in the filler
It is an epoxy resin composition with a concentration of 50% by volume.
本発明において用いられるエポキシ樹脂としては、ビス
フェノール型エポキシ樹脂、ノボラック型エポキシ樹脂
、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹
脂等か挙げられる。Examples of the epoxy resin used in the present invention include bisphenol type epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin, and naphthalene type epoxy resin.
本発明に用いられる硬化剤としては、前記硬化性樹脂に
用いられる一般的硬化剤例えば無水フタル酸、無水へキ
サヒドロフタル酸、無水トリメリット酸、無水ピロメリ
ット酸、無水ベンゾフェノンテトラカルボン酸等の酸無
水物や芳香族アミン類やフェノールノボラック樹脂、ク
レゾールノボラック樹脂、各種変性フェノールノボラッ
ク樹脂等のノボラック樹脂かあり、特に限定されるもの
ではなく、２種以上併用しても良いか、前記オルソクレ
ゾールノボラック型エポキシ樹脂の硬化剤としてはノボ
ラック型樹脂、中でもフェノールノボラック樹脂かコス
ト、作業性信頼性等の点て好ましい。Examples of the curing agent used in the present invention include general curing agents used in the above-mentioned curable resins, such as phthalic anhydride, hexahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic anhydride. There are novolak resins such as acid anhydrides, aromatic amines, phenol novolak resins, cresol novolak resins, various modified phenol novolak resins, etc., but there are no particular limitations, and two or more types may be used in combination. As the curing agent for the novolac type epoxy resin, novolac type resins, especially phenol novolac resins, are preferred from the viewpoint of cost, reliability of workability, and the like.
又、エポキシ樹脂とフェノールノボラック樹脂の配合比
はエポキシ当量ｌに対しフェノールノボラック樹脂の水
酸基当量が０．５〜１．２当量か好ましくこの範囲外で
は硬化特性に不良を来たす。また、硬化促進剤としては
、２−メチルイミダゾール、ベンジルジメチルアミン（
ＢＤＭＡ）、トリフェニルホスフィン等を挙げることが
できる。Further, the compounding ratio of the epoxy resin and the phenol novolac resin is preferably such that the hydroxyl equivalent of the phenol novolak resin is 0.5 to 1.2 equivalents per 1 of the epoxy equivalent, and outside this range, the curing properties will be poor. In addition, as a curing accelerator, 2-methylimidazole, benzyldimethylamine (
BDMA), triphenylphosphine, and the like.
本発明に使用する充填材としては、平均粒径が５〜３０
μの結晶シリカと平均粒径か５〜４０μの球状の溶融シ
リカを混合して使用する。The filler used in the present invention has an average particle size of 5 to 30
A mixture of crystalline silica with a particle diameter of 5 to 40 microns is used.
結晶シリカの平均粒径が５μ未満の場合は成形材料化し
た場合、成形材料の粘度か上りすぎ、ワイヤー流れや未
充填不良の原因となり好ましくない。If the average particle size of the crystalline silica is less than 5 μm, when it is made into a molding material, it is not preferable because the viscosity of the molding material increases too much, causing wire flow and non-filling defects.
一方、平均粒径か３０μを越えた場合は、ゲートの狭い
金型ては流動性か低下し、成形性劣化の原因になり好ま
しくない。On the other hand, if the average particle size exceeds 30 μm, the fluidity in a mold with a narrow gate decreases, which is undesirable as it causes deterioration of moldability.
同様に球状シリカの場合も平均粒径か５μ未満になると
成形材料の粘度が上り、ワイヤー流れ等の成形不良の原
因となり好ましくない。Similarly, in the case of spherical silica, if the average particle diameter is less than 5 μm, the viscosity of the molding material increases, which is undesirable as it causes molding defects such as wire flow.
平均粒径か４０μを越えるとゲートの狭い金型等では流
動性低下の原因となり成形性上好ましくない。球状の混
合比率か５０容量％を越えると樹脂のパリか多くなり成
形上好ましくない。一方、５容量％未渦の場合は球状の
特性がうまく引き出せず好ましくない結果となる。If the average particle size exceeds 40 μm, it will cause a decrease in fluidity in molds with narrow gates, which is unfavorable in terms of moldability. If the spherical mixing ratio exceeds 50% by volume, resin particles will increase, which is unfavorable for molding. On the other hand, when 5% by volume is not swirled, the spherical characteristics cannot be brought out well, resulting in unfavorable results.
上記の混合率で配合すると熱伝導率を結晶シリカのレベ
ルに維持し、熱膨張率を溶融シリカなみに小さくおさえ
ることができると共に、流動性か向上するため成形性も
優れたものとなる。When blended at the above mixing ratio, the thermal conductivity can be maintained at the level of crystalline silica, the coefficient of thermal expansion can be kept as low as that of fused silica, and the fluidity is improved, resulting in excellent moldability.
本発明の組成物は上記のものの他、必要に応じて、シラ
ンカップリング剤、離型剤、着色剤、難−燃剤なとを配
合し、混合混練しエポキシ樹脂組成物とする。In addition to the above-mentioned compositions, the composition of the present invention may contain, if necessary, a silane coupling agent, a mold release agent, a coloring agent, a flame retardant, etc., and are mixed and kneaded to form an epoxy resin composition.
以下に本発明を実施例で説明する。The present invention will be explained below using examples.
実施例１
クレゾールノボラック型エポキン樹脂（エポキシ当量２
００、軟化点６５°Ｃ）１００重量部、フェノ−
ヘルツボラック樹脂（ＯＨ当ｊｉ１０４、軟化点１０５
°Ｃ）５０重量部、ＢＤＭＡ （ベンジルジメチルアミ
ン）２重量部、充填材として結晶ソリ力（平均粒径１５
μ）と粒状の溶融シリカ（平均粒径２０μ）とを混合し
た合計か７００重量部のものを第１表に示す割合で配合
し７０〜１００℃の混線機で混合した後冷却して粉砕し
成形材料を得た。得られた成形材料についてはスバラル
フロー、熱膨張係数、熱伝導率、耐クラツク性を評価し
た。評価結果を第１表に示す。Example 1 Cresol novolak type epochine resin (epoxy equivalent 2
00, softening point 65°C) 100 parts by weight, pheno-Hertzborac resin (OH per ji104, softening point 105
°C) 50 parts by weight, 2 parts by weight of BDMA (benzyldimethylamine), crystal warp strength (average particle size 15°C) as a filler,
A total of 700 parts by weight of granular fused silica (average particle size 20μ) was mixed in the proportions shown in Table 1, mixed in a mixer at 70 to 100°C, cooled and pulverized. A molding material was obtained. The resulting molding material was evaluated for its sparral flow, coefficient of thermal expansion, thermal conductivity, and crack resistance. The evaluation results are shown in Table 1.
実施例２、比較例１〜３
第１表に示した充填材の配合割合、種類を変えた以外は
実施例１と同一とし同様にして成形材料を得、評価した
。評価結果を第１表に示す。Example 2, Comparative Examples 1 to 3 Molding materials were obtained and evaluated in the same manner as in Example 1, except that the blending ratio and type of filler shown in Table 1 were changed. The evaluation results are shown in Table 1.
※１ パッケージ １６ｐｉｎ ＤＩＰチップ
３．５ Ｘ ３． Ｏｍｍ硬化時間 −！−１７５
°Ｃ１３分ポストキュア １７５℃、８時間
パッケージクラックの温度条件
一６５°Ｃ（１５分） １５０’Ｃ（１５分）※２
スパイラルフロー
渦巻き状の金型て型温１７５±２℃、圧カフ０：２ ｋ
ｇ ／ ｃｍ２て硬化して、成形された連続スパイラル
の先端までの長さ。*1 Package 16pin DIP chip
3.5 X 3. Omm curing time -! -175
°C 13 minutes post cure 175 °C, 8 hours Package crack temperature conditions - 65 °C (15 minutes) 150'C (15 minutes) *2
Spiral flow spiral mold mold temperature 175±2℃, pressure cuff 0:2k
Length to the tip of the formed continuous spiral after curing in g/cm2.
※３ α１ （熱膨張係数）及びＴｇ
一定の寸法の成形品をポストキュアした後、ＴＭＡによ
り５℃／分の昇温スピードで室温から約３００°Ｃまて
電気炉中て試料を加熱し、温度−伸び曲線を記録しα１
とＴｇを求める。*3 α1 (coefficient of thermal expansion) and Tg After post-curing a molded product of a certain size, the sample was heated in an electric furnace from room temperature to approximately 300°C at a heating rate of 5°C/min using TMA. Record the temperature-elongation curve and α1
and find Tg.
※４ 熱伝導率 ＰＲＯＢ法により測定する。*4 Thermal conductivity Measured by PROB method.
厚み１５ｍｍの試験片にプローブを押し立てヒーターか
ら一定の電力を与える。ヒーターは試験片の熱伝導率に
対応して上昇する。A probe is pressed onto a test piece with a thickness of 15 mm, and a constant power is applied from a heater. The heater increases in response to the thermal conductivity of the specimen.
１０秒間の温度上昇を測定する。Measure the temperature rise for 10 seconds.
Ｃ発明の効果〕
本発明によると熱伝導率を結晶シリカ並みのレベルに維
持したまま、熱膨張率を溶融シリカ並みに小さくおさえ
る事かできるとともに流動性か向上するため、充填性等
の成形性にも優れた成形材料か得られる。C Effects of the invention] According to the present invention, while maintaining thermal conductivity at a level comparable to that of crystalline silica, the coefficient of thermal expansion can be suppressed to a level comparable to that of fused silica, and fluidity is improved, resulting in improved moldability such as filling properties. It can also be used as an excellent molding material.
Claims (1)
らなるエポキシ樹脂組成物において、平均粒径が５〜３
０μの結晶シリカと平均粒径が５〜４０μの球状の溶融
シリカとからなり、球状の溶融シリカの配合割合が充填
材中に５〜５０容量％となることを特徴とするエポキシ
樹脂組成物。(1) In an epoxy resin composition consisting of an epoxy resin, a curing agent, a curing accelerator, and a filler, the average particle size is 5 to 3.
An epoxy resin composition comprising crystalline silica of 0 μm and spherical fused silica with an average particle size of 5 to 40 μm, and characterized in that the proportion of the spherical fused silica in the filler is 5 to 50% by volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29076690A JP2938177B2 (en) | 1990-10-30 | 1990-10-30 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29076690A JP2938177B2 (en) | 1990-10-30 | 1990-10-30 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04164953A true JPH04164953A (en) | 1992-06-10 |
| JP2938177B2 JP2938177B2 (en) | 1999-08-23 |
Family
ID=17760256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29076690A Expired - Fee Related JP2938177B2 (en) | 1990-10-30 | 1990-10-30 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2938177B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07173372A (en) * | 1993-12-20 | 1995-07-11 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JP2002338788A (en) * | 2001-05-16 | 2002-11-27 | Mitsui Chemicals Inc | Epoxy resin composition and hollow package housing semiconductor element using the composition |
| SG103883A1 (en) * | 2002-07-29 | 2004-05-26 | Sumitomo Bakelite Singapore Pt | Epoxy resin composition |
| JP2017110089A (en) * | 2015-12-16 | 2017-06-22 | 株式会社日立産機システム | Resin composition for electric insulation |
| JP2019001841A (en) * | 2017-06-12 | 2019-01-10 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device having cured product of composition |
| CN111234465A (en) * | 2020-01-16 | 2020-06-05 | 厦门稀土材料研究所 | Rare earth modified high-thermal-conductivity epoxy composite material and preparation method thereof |
-
1990
- 1990-10-30 JP JP29076690A patent/JP2938177B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07173372A (en) * | 1993-12-20 | 1995-07-11 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
| JP2002338788A (en) * | 2001-05-16 | 2002-11-27 | Mitsui Chemicals Inc | Epoxy resin composition and hollow package housing semiconductor element using the composition |
| SG103883A1 (en) * | 2002-07-29 | 2004-05-26 | Sumitomo Bakelite Singapore Pt | Epoxy resin composition |
| JP2017110089A (en) * | 2015-12-16 | 2017-06-22 | 株式会社日立産機システム | Resin composition for electric insulation |
| WO2017104727A1 (en) * | 2015-12-16 | 2017-06-22 | 株式会社日立産機システム | Electrical insulation resin composition |
| JP2019001841A (en) * | 2017-06-12 | 2019-01-10 | 信越化学工業株式会社 | Epoxy resin composition and semiconductor device having cured product of composition |
| CN111234465A (en) * | 2020-01-16 | 2020-06-05 | 厦门稀土材料研究所 | Rare earth modified high-thermal-conductivity epoxy composite material and preparation method thereof |
| CN111234465B (en) * | 2020-01-16 | 2022-05-24 | 厦门稀土材料研究所 | Rare earth modified high-thermal-conductivity epoxy composite material and preparation method thereof |
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|---|---|
| JP2938177B2 (en) | 1999-08-23 |
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