SG103883A1 - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
SG103883A1
SG103883A1 SG200206255A SG200206255A SG103883A1 SG 103883 A1 SG103883 A1 SG 103883A1 SG 200206255 A SG200206255 A SG 200206255A SG 200206255 A SG200206255 A SG 200206255A SG 103883 A1 SG103883 A1 SG 103883A1
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
epoxy
composition
resin
Prior art date
Application number
SG200206255A
Inventor
Tan David
Naoki Mogi
Original Assignee
Sumitomo Bakelite Singapore Pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002219679A external-priority patent/JP4188634B2/en
Application filed by Sumitomo Bakelite Singapore Pt filed Critical Sumitomo Bakelite Singapore Pt
Priority to SG200206255A priority Critical patent/SG103883A1/en
Publication of SG103883A1 publication Critical patent/SG103883A1/en

Links

SG200206255A 2002-07-29 2002-10-14 Epoxy resin composition SG103883A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200206255A SG103883A1 (en) 2002-07-29 2002-10-14 Epoxy resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002219679A JP4188634B2 (en) 2001-07-30 2002-07-29 Epoxy resin composition
SG200206255A SG103883A1 (en) 2002-07-29 2002-10-14 Epoxy resin composition

Publications (1)

Publication Number Publication Date
SG103883A1 true SG103883A1 (en) 2004-05-26

Family

ID=33455392

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200206255A SG103883A1 (en) 2002-07-29 2002-10-14 Epoxy resin composition

Country Status (1)

Country Link
SG (1) SG103883A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPH04164953A (en) * 1990-10-30 1992-06-10 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH05239190A (en) * 1992-02-28 1993-09-17 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device
JPH07273251A (en) * 1994-03-30 1995-10-20 Hitachi Chem Co Ltd Resin sealed type semiconductor device
JPH1030049A (en) * 1996-07-15 1998-02-03 Toshiba Chem Corp Epoxy resin composition and material for sealing electronic parts
JP2000178412A (en) * 1998-12-15 2000-06-27 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor, and semiconductor device
JP2002128991A (en) * 2000-10-27 2002-05-09 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPH04164953A (en) * 1990-10-30 1992-06-10 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH05239190A (en) * 1992-02-28 1993-09-17 Toshiba Chem Corp Epoxy resin composition and sealed semiconductor device
JPH07273251A (en) * 1994-03-30 1995-10-20 Hitachi Chem Co Ltd Resin sealed type semiconductor device
JPH1030049A (en) * 1996-07-15 1998-02-03 Toshiba Chem Corp Epoxy resin composition and material for sealing electronic parts
JP2000178412A (en) * 1998-12-15 2000-06-27 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor, and semiconductor device
JP2002128991A (en) * 2000-10-27 2002-05-09 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device

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