JPH0416468Y2 - - Google Patents
Info
- Publication number
- JPH0416468Y2 JPH0416468Y2 JP1986118584U JP11858486U JPH0416468Y2 JP H0416468 Y2 JPH0416468 Y2 JP H0416468Y2 JP 1986118584 U JP1986118584 U JP 1986118584U JP 11858486 U JP11858486 U JP 11858486U JP H0416468 Y2 JPH0416468 Y2 JP H0416468Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- mask plate
- light emitting
- display
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 230000008602 contraction Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986118584U JPH0416468Y2 (US20110009641A1-20110113-C00256.png) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986118584U JPH0416468Y2 (US20110009641A1-20110113-C00256.png) | 1986-07-31 | 1986-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6324857U JPS6324857U (US20110009641A1-20110113-C00256.png) | 1988-02-18 |
JPH0416468Y2 true JPH0416468Y2 (US20110009641A1-20110113-C00256.png) | 1992-04-13 |
Family
ID=31005173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986118584U Expired JPH0416468Y2 (US20110009641A1-20110113-C00256.png) | 1986-07-31 | 1986-07-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0416468Y2 (US20110009641A1-20110113-C00256.png) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3041882B2 (ja) * | 1990-05-08 | 2000-05-15 | ソニー株式会社 | 脈診装置 |
KR100496066B1 (ko) * | 2002-06-04 | 2005-06-16 | 에이피전자 주식회사 | 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡 |
JP4574694B2 (ja) * | 2003-01-09 | 2010-11-04 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
WO2004071141A2 (en) * | 2003-02-07 | 2004-08-19 | Matsushita Electric Industrial Co., Ltd. | Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus |
JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2006120691A (ja) * | 2004-10-19 | 2006-05-11 | Matsushita Electric Ind Co Ltd | 線状光源装置 |
JP2006210624A (ja) * | 2005-01-27 | 2006-08-10 | Toshiba Lighting & Technology Corp | 発光装置 |
KR101210090B1 (ko) | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법 |
JP2007123939A (ja) * | 2007-01-29 | 2007-05-17 | Kyocera Corp | 発光装置 |
JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
JP2007142477A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
JP2008294309A (ja) * | 2007-05-25 | 2008-12-04 | Showa Denko Kk | 発光装置、表示装置 |
JP5653893B2 (ja) * | 2011-12-07 | 2015-01-14 | 信越化学工業株式会社 | 積層基板 |
CN104718634A (zh) * | 2012-10-19 | 2015-06-17 | 夏普株式会社 | 发光装置以及发光装置向散热器安装的安装构造 |
JP6171360B2 (ja) * | 2013-01-28 | 2017-08-02 | 大日本印刷株式会社 | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体、樹脂付きリードフレーム、光半導体装置 |
JP6139278B2 (ja) * | 2013-05-31 | 2017-05-31 | 三菱電機株式会社 | 映像表示装置 |
JP6186904B2 (ja) | 2013-06-05 | 2017-08-30 | 日亜化学工業株式会社 | 発光装置 |
JP6173179B2 (ja) * | 2013-11-15 | 2017-08-02 | 三菱電機株式会社 | 表示装置 |
JP6384508B2 (ja) | 2016-04-06 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
JP2017187710A (ja) * | 2016-04-08 | 2017-10-12 | 三菱電機株式会社 | 表示装置 |
JP6411685B1 (ja) * | 2017-10-12 | 2018-10-24 | ルーメンス カンパニー リミテッド | ディスプレイ用ledモジュール組立体 |
-
1986
- 1986-07-31 JP JP1986118584U patent/JPH0416468Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6324857U (US20110009641A1-20110113-C00256.png) | 1988-02-18 |
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