JPH0415999B2 - - Google Patents
Info
- Publication number
- JPH0415999B2 JPH0415999B2 JP62003085A JP308587A JPH0415999B2 JP H0415999 B2 JPH0415999 B2 JP H0415999B2 JP 62003085 A JP62003085 A JP 62003085A JP 308587 A JP308587 A JP 308587A JP H0415999 B2 JPH0415999 B2 JP H0415999B2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- module
- circuit
- flexible interconnect
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 238000012360 testing method Methods 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US817635 | 1986-01-10 | ||
| US06/848,878 US4689721A (en) | 1986-01-10 | 1986-04-07 | Dual printed circuit board module |
| US848878 | 1986-04-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62217692A JPS62217692A (ja) | 1987-09-25 |
| JPH0415999B2 true JPH0415999B2 (enExample) | 1992-03-19 |
Family
ID=25304525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62003085A Granted JPS62217692A (ja) | 1986-01-10 | 1987-01-09 | 両面印刷回路基板モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62217692A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4927369A (en) * | 1989-02-22 | 1990-05-22 | Amp Incorporated | Electrical connector for high density usage |
-
1987
- 1987-01-09 JP JP62003085A patent/JPS62217692A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62217692A (ja) | 1987-09-25 |
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