JPS62217692A - 両面印刷回路基板モジユ−ル - Google Patents
両面印刷回路基板モジユ−ルInfo
- Publication number
- JPS62217692A JPS62217692A JP62003085A JP308587A JPS62217692A JP S62217692 A JPS62217692 A JP S62217692A JP 62003085 A JP62003085 A JP 62003085A JP 308587 A JP308587 A JP 308587A JP S62217692 A JPS62217692 A JP S62217692A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- circuit
- pcb
- pins
- module assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 238000012360 testing method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US817635 | 1986-01-10 | ||
| US06/848,878 US4689721A (en) | 1986-01-10 | 1986-04-07 | Dual printed circuit board module |
| US848878 | 1986-04-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62217692A true JPS62217692A (ja) | 1987-09-25 |
| JPH0415999B2 JPH0415999B2 (enExample) | 1992-03-19 |
Family
ID=25304525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62003085A Granted JPS62217692A (ja) | 1986-01-10 | 1987-01-09 | 両面印刷回路基板モジユ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62217692A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02247995A (ja) * | 1989-02-22 | 1990-10-03 | Amp Inc | 多接点電気コネクタ |
-
1987
- 1987-01-09 JP JP62003085A patent/JPS62217692A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02247995A (ja) * | 1989-02-22 | 1990-10-03 | Amp Inc | 多接点電気コネクタ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415999B2 (enExample) | 1992-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4689721A (en) | Dual printed circuit board module | |
| US4084869A (en) | Interconnector for integrated circuit package | |
| JPH0236595A (ja) | 回路板接続装置 | |
| US20050048805A1 (en) | Apparatus interconnecting circuit board and mezzanine card or cards | |
| JP2004523908A (ja) | プラスチックリード付きチップキャリア(plcc)および他の表面実装技術(smt)チップキャリアのためのアダプタ | |
| US20080045052A1 (en) | Planar Array Contact Memory Cards | |
| US5497027A (en) | Multi-chip module packaging system | |
| US4834660A (en) | Flexible zero insertion force interconnector between circuit boards | |
| US5429510A (en) | High-density interconnect technique | |
| US7285729B2 (en) | Printed circuit board | |
| US6108228A (en) | Quad in-line memory module | |
| JPS62217692A (ja) | 両面印刷回路基板モジユ−ル | |
| US4763298A (en) | Memory assembly with cooling insert | |
| JPH04290258A (ja) | マルチチップモジュール | |
| KR100347444B1 (ko) | 기판의 1차 및 2차 측면 상의 동일한 커넥터 포인트레이아웃을 위한 라우팅 토폴로지 | |
| JPH0138920Y2 (enExample) | ||
| JPS5855767Y2 (ja) | バックパネルへのプリント板実装構造 | |
| JPS6154697A (ja) | オプシヨンコンソ−ルの実装方式 | |
| JPH02189992A (ja) | 基板組立方法 | |
| JP2979618B2 (ja) | プリント基板実装法 | |
| JPH0668942A (ja) | カードエッジコネクタ | |
| JPS635597A (ja) | 高密度実装装置 | |
| JPH0438155B2 (enExample) | ||
| JPS62265797A (ja) | バツクボ−ド構造 | |
| JPH04310194A (ja) | Icカード用コネクタ |