JPH0415236U - - Google Patents
Info
- Publication number
- JPH0415236U JPH0415236U JP5679090U JP5679090U JPH0415236U JP H0415236 U JPH0415236 U JP H0415236U JP 5679090 U JP5679090 U JP 5679090U JP 5679090 U JP5679090 U JP 5679090U JP H0415236 U JPH0415236 U JP H0415236U
- Authority
- JP
- Japan
- Prior art keywords
- ultraviolet
- transmitting window
- transmitting
- light
- shielding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000012945 sealing adhesive Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Description
第１図ａは本案の一実施例の略断面図、同図ｂ
はその分解斜視図、第２図は他の実施例の略断面
図、第３図はその他の実施例の略断面図、第４図
及び第５図は従来の例の略断面図である。
１……ボンデイングワイヤー、２……素子、３
……ガラスキヤツプ、４ａ，４ｂ……パツケージ
、５ａ……キヤツプ封止接着剤、５ｂ……低温硬
化型キヤツプ封止接着剤、６ｂ……紫外線硬化型
接着剤、８……紫外線透過窓、９……裏面遮光材
。
Figure 1a is a schematic sectional view of an embodiment of the present invention, Figure 1b
2 is a schematic sectional view of another embodiment, FIG. 3 is a schematic sectional view of another embodiment, and FIGS. 4 and 5 are schematic sectional views of a conventional example. 1... Bonding wire, 2... Element, 3
...Glass cap, 4a, 4b...Package, 5a...Cap sealing adhesive, 5b...Low temperature curing type cap sealing adhesive, 6b...Ultraviolet curing adhesive, 8...Ultraviolet transmission window, 9 ...Back side light shielding material.
Claims (1)
るパツケージと、紫外線透過窓の上方に紫外線硬
化型接着剤を介して固着された素子と、紫外線透
過窓の外部に設けた裏面遮光材とよりなる半導体
装置。 A package including a light-transmitting part on the upper part and an ultraviolet-transmitting window on the lower part, an element fixed to the upper part of the ultraviolet-transmitting window via an ultraviolet-curable adhesive, and a back light-shielding material provided outside the ultraviolet-transmitting window. A semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5679090U JPH0415236U (en) | 1990-05-29 | 1990-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5679090U JPH0415236U (en) | 1990-05-29 | 1990-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415236U true JPH0415236U (en) | 1992-02-06 |
Family
ID=31580933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5679090U Pending JPH0415236U (en) | 1990-05-29 | 1990-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415236U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278447A (en) * | 2005-03-28 | 2006-10-12 | Kyocera Corp | Package for storing electronic component and electronic device |
-
1990
- 1990-05-29 JP JP5679090U patent/JPH0415236U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278447A (en) * | 2005-03-28 | 2006-10-12 | Kyocera Corp | Package for storing electronic component and electronic device |
| JP4511399B2 (en) * | 2005-03-28 | 2010-07-28 | 京セラ株式会社 | Electronic component storage package and electronic device |