JPH0260262U - - Google Patents

Info

Publication number
JPH0260262U
JPH0260262U JP13886388U JP13886388U JPH0260262U JP H0260262 U JPH0260262 U JP H0260262U JP 13886388 U JP13886388 U JP 13886388U JP 13886388 U JP13886388 U JP 13886388U JP H0260262 U JPH0260262 U JP H0260262U
Authority
JP
Japan
Prior art keywords
light
container
lead
emitting element
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13886388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13886388U priority Critical patent/JPH0260262U/ja
Publication of JPH0260262U publication Critical patent/JPH0260262U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第３図は、本考案の実施例を示す断
面図、第４図は、その製造工程の一部を示す上面
図、第５図及び第６図は従来の半導体光結合装置
の要部を示す断面図である。 １……容器、２……窓部、３……透明キヤツプ
、４……光フアイバー、５……透明樹脂、６……
リード、７……発光素子、８……受光素子、１０
……凹部、１１……足部、１２……横部、１３…
…蓋部、１４……液状エポキシ。 1 to 3 are cross-sectional views showing an embodiment of the present invention, FIG. 4 is a top view showing a part of the manufacturing process, and FIGS. 5 and 6 are views of a conventional semiconductor optical coupling device. FIG. 3 is a cross-sectional view showing main parts. 1... Container, 2... Window, 3... Transparent cap, 4... Optical fiber, 5... Transparent resin, 6...
Lead, 7... Light emitting element, 8... Light receiving element, 10
... recessed part, 11 ... foot part, 12 ... side part, 13 ...
...Lid part, 14...Liquid epoxy.

補正 平１．２．１７ 図面の簡単な説明を次のように補正する。Correction: Heisei 1.2.17 The brief description of the drawing has been amended as follows.

【図面の簡単な説明】 第１図乃至第３図は、本考案の実施例を示す断
面図、第４図は、その製造工程の一部を示す上面
図、第５図、第６図及び第７図は、従来の半導体
光結合装置の要部を示す断面図である。 １……容器、２……窓部、３……透明キヤツプ
、４……光フアイバー、５……透明樹脂、６……
リード、７……発光素子、８……受光樹脂、１０
……凹部素子、１１……足部、１２……横部、１
３……蓋部、１４……液状エポキシ。[Brief Description of the Drawings] Figures 1 to 3 are cross-sectional views showing embodiments of the present invention, Figure 4 is a top view showing a part of the manufacturing process, and Figures 5, 6, and FIG. 7 is a sectional view showing the main parts of a conventional semiconductor optical coupling device. 1... Container, 2... Window, 3... Transparent cap, 4... Optical fiber, 5... Transparent resin, 6...
Lead, 7... Light emitting element, 8... Light receiving resin, 10
...Recessed element, 11... Foot part, 12... Lateral part, 1
3...Lid part, 14...Liquid epoxy.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードにマウントする受光素子及び発光素子と
、相対向して配置する両素子を夫々固着する透明
樹脂層と、この両樹脂層間を結んで配置し光軸を
形成する光フアイバーと、この両素子と光フアイ
バーを収容し、リードを導出する開孔部を備えた
容器と、発光素子に対応するこの容器に形成して
可視光波長をモニタリングする窓部と、この開孔
部を覆う蓋部と、前記容器、蓋部及びリード間を
塞ぐ封止樹脂層とを具備することを特徴とする半
導体光結合素子。 A light-receiving element and a light-emitting element mounted on a lead, a transparent resin layer that fixes both elements arranged facing each other, an optical fiber that connects these two resin layers and forms an optical axis, and these two elements. A container containing an optical fiber and having an opening for leading out a lead, a window formed in the container corresponding to a light emitting element to monitor visible light wavelengths, and a lid covering the opening. A semiconductor optical coupling device comprising the container, a lid, and a sealing resin layer that closes between the leads.
JP13886388U 1988-10-25 1988-10-25 Pending JPH0260262U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13886388U JPH0260262U (en) 1988-10-25 1988-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13886388U JPH0260262U (en) 1988-10-25 1988-10-25

Publications (1)

Publication Number Publication Date
JPH0260262U true JPH0260262U (en) 1990-05-02

Family

ID=31401595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13886388U Pending JPH0260262U (en) 1988-10-25 1988-10-25

Country Status (1)

Country Link
JP (1) JPH0260262U (en)

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