JPH0414803A - Mounting method of ultrathin inductance element - Google Patents

Abstract

PURPOSE:To sufficiently make use of a feature of the thickness of an ultrathin resistance element when a powdery resisn is used by a method wherein a part between a printed-circuit board and the ultrathin inductance element is filled with a resin for adhesive use. CONSTITUTION:A copper-wire terminal 2b of an ultrathin inductance element 3 is first soldered to a printed-circuit board 4. A part between the ultrathin inductance element 3 and the printed-circuit board 4 is then coated with a resin 5a for adhesive use; they are pressed from the direction of the arrow; the ultrathin inductance element 3 is brought into close contact with the printed- circuit board 4. After that, the outer circumference of the ultrathin inductance element 3 is coated with a resin 5b for adhesive use so as to reduce uneven parts at the outer circumference as far as possible. After that, the resin for adhesive use is cured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of mounting an ultra-thin inductance element.

[Prior art] Figure 2 shows a hybrid integrated circuit (hereinafter referred to as H) according to the prior art.
FIG. 2 is a perspective view with a part of the powder resin exterior of the IC (hereinafter referred to as an IC) removed. Conventionally, in HIC, as shown in Figure 2, the method of mounting electronic components (6) and terminals (7) for surface mounting on a printed circuit board (4) and then applying a powder resin exterior (8) has been common. It was carried out in The powder resin sheath (8) is provided to protect the board and mounted electronic components from the external environment.

Recently, in order to reduce the thickness of inductance elements, ultra-thin inductance elements have been developed by combining amorphous metal fibers and copper wires in a woven fabric. Figure 3 is a front view (a) and a side view (b) of an ultra-thin inductance element.
It is. (1) is an amorphous metal fiber, (2a) is a copper wire, and (2b) is a terminal portion of the copper wire. While I was there,
Since the ultra-thin inductance element has a shape not found in conventional commercially available inductance elements, a method for packaging it with powder resin has not yet been established.

[Problems to be Solved by the Invention] The ultra-thin inductance element simply has a copper wire terminal (2b) soldered to the board as shown in Figure 1(a), so it is not enough to ensure that it is firmly attached to the printed board. If the powder resin exterior is applied using the conventional method described above, there will be a space between the printed circuit board and the ultra-thin inductance element. This will add some extra thickness. Furthermore, since the ultra-thin inductance element is a combination of amorphous metal fibers (1) and copper wires (2a) in the form of a woven fabric, there are always irregularities in the weave.

As a result, the resin powder cannot sufficiently penetrate into the weave, resulting in pinholes, which deteriorate the appearance and eliminate the purpose of the exterior, which was originally meant to protect from external environmental conditions.

An object of the present invention is to tightly fix a printed circuit board and an ultra-thin inductance element, to fully utilize the thin feature of the ultra-thin inductance element, and to prevent the occurrence of pinholes.

[Means for Solving the Problems] The present invention provides a method for plugging a copper wire terminal of an ultra-thin inductance element in which an amorphous metal fiber and a copper wire are combined in a woven form.
,,' 7/ In the mounting method of an ultra-thin inductance element that is conductively fixed to a printed circuit board and then coated with powder resin, an adhesive resin is used between the printed circuit board and the ultra-thin inductance element. It is filled with That is, as a pre-process to apply the powder resin exterior, an adhesive resin is applied between the printed circuit board and the ultra-thin inductance element, and in order to eliminate the difference in thickness (approximately 1 mm) of the ultra-thin inductance element itself. Apply adhesive resin to the outer periphery of the ultra-thin inductance element. After coating, it is cured to ensure the bond between the printed circuit board and the ultra-thin inductance element, and to minimize unevenness.

[Function] According to the present invention, the printed circuit board and the ultra-thin inductance element are reliably bonded and unevenness is minimized, so when a powder resin exterior is applied, the thin feature of the ultra-thin inductance element can be fully utilized. Can be pinhole (perforated)
It is also possible to prevent the occurrence of

〔Example〕

FIG. 1 is a process schematic diagram for explaining a method of mounting an ultra-thin inductance element (3) on a printed circuit board (4) according to an embodiment of the present invention.

In the method of this embodiment, first, the copper wire terminal (2b) of the ultra-thin inductance element (3) is soldered to the printed circuit board (4). Next, adhesive resin (5a) is applied between the ultra-thin inductance element (3) and the printed circuit board (4), and the first
Press in the direction of the arrow in Figure (b) to bring the ultra-thin inductance element (3) and printed circuit board (4) into close contact. Thereafter, an adhesive resin (5b) is applied to the outer periphery of the ultra-thin inductance element (3) to minimize irregularities on the outer periphery.

After passing through the above steps, the adhesive resin is cured by heating. After curing, proceed to the usual powder resin exterior process.

f Effect of invention] According to the present invention, there are the following effects.

l) The ultra-thin inductance element can be made sufficiently thin.

2) Prevents the occurrence of pinholes (holes) and provides a clean appearance.

[Brief explanation of drawings]

FIGS. 1(a), 1(b), and 1(c) are process schematic diagrams for explaining one embodiment of the present invention, and FIG. 1(d) is a side view of FIG. 1(c). FIG. 2 is a perspective view of a HIC according to the prior art. Figure 3 shows a front view (a) and a side view (b) of an ultra-thin inductance element.
). (]) ...Amorphous metal fiber (2a)...
Copper wire (2b)...Copper wire terminal (3)...Ultra-thin inductance element (4) -Printed circuit board 5b 3 Figure 2 (b)

Claims (1)

[Claims] In the mounting method for ultra-thin inductance elements, the copper wire terminals of ultra-thin inductance elements made by combining amorphous metal fibers and copper wires in a woven form are conductively fixed to a printed circuit board, and then coated with powder resin. A method for mounting an ultra-thin inductance element, characterized by filling a space between a substrate and the ultra-thin inductance element with an adhesive resin.