JPH03109795A - Mounting of electronic parts - Google Patents
Mounting of electronic partsInfo
- Publication number
- JPH03109795A JPH03109795A JP24763589A JP24763589A JPH03109795A JP H03109795 A JPH03109795 A JP H03109795A JP 24763589 A JP24763589 A JP 24763589A JP 24763589 A JP24763589 A JP 24763589A JP H03109795 A JPH03109795 A JP H03109795A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electronic parts
- bonding material
- wiring conductor
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 30
- 230000001070 adhesive effect Effects 0.000 description 30
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、電子部品を印刷回路基板に実装する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a method of mounting electronic components on a printed circuit board.
（ロ）従来の技術
従来、印刷回路基板に電子部品を実装するには、はんだ
が用いられており、リフロー又はデイツプによる方法が
知られている。リフローによる方法は、印刷回路基板の
配線導体上に、はんだペーストをスクリーン印刷し、真
空式又は機械式チャックで電子部品を搬送し、この配線
導体上に載置する。そしてこの印刷回路基板をリフロー
炉内に導入し、はんだ溶融温度まで加熱してはんだペー
ストを溶融した後、基板をリフロー炉より取り出しては
んだを固化させる。(B) Prior Art Conventionally, solder has been used to mount electronic components on printed circuit boards, and methods using reflow or dip are known. In the reflow method, solder paste is screen printed on the wiring conductor of a printed circuit board, and the electronic component is conveyed using a vacuum or mechanical chuck and placed on the wiring conductor. The printed circuit board is then introduced into a reflow oven, heated to the solder melting temperature to melt the solder paste, and then taken out from the reflow oven to solidify the solder.
一方、デイツプによる方法では、基板の配線導体の電子
部品接続部以外をマスクすると共に、基板上に接着剤を
塗布しておき、やはり真空式又は機械式のチャックによ
り電子部品を基板上に配置し、接着剤により電子部品を
基板上に固定する。On the other hand, in the dip method, the parts of the wiring conductors on the board other than the electronic component connections are masked, adhesive is applied on the board, and the electronic components are placed on the board using a vacuum or mechanical chuck. , the electronic components are fixed onto the substrate using adhesive.
そして、基板を溶融はんだ槽に導入、又ははんだ噴流中
に導入する。この時電子部品の電極部と配線導体とがは
んだでつながり、電子部品が基板上に実装されることに
なる。Then, the substrate is introduced into a molten solder bath or into a solder jet. At this time, the electrode portion of the electronic component and the wiring conductor are connected by solder, and the electronic component is mounted on the board.
（ハ）発明が解決しようとする課題
上記電子部品の実装方法では、リフローやデイツプの際
に、はんだ溶融温度まで加熱する必要がある。このため
、電子部品に大きな熱衝撃が加わり信頼性が低下すると
ともに、基板やその他の部品にまで耐熱性が要求されコ
ストが上昇する問題点があった。(c) Problems to be Solved by the Invention In the electronic component mounting method described above, it is necessary to heat the solder to the melting temperature during reflow or dipping. As a result, electronic components are subject to large thermal shocks, reducing their reliability, and the substrate and other components are also required to have heat resistance, resulting in an increase in cost.
この発明は上記に鑑みなされたもので、電子部品の信頼
性をｔＪＩｌなうことなく、かつコストの軽減を可能と
する電子部品の実装方法の提供を目的としている。The present invention has been made in view of the above, and an object of the present invention is to provide a mounting method for electronic components that does not impair the reliability of electronic components and can reduce costs.
（ニ）課題を解決するための手段及び作用上記課題を解
決するため、この発明の電子部品の実装方法は、電子部
品、基板の配線導体の少なくとも１方に、接着性及び導
電性を有する接合材料を付着し、この電子部品は電子部
品装着手段により搬送されて前記配線導体上に配置され
、さらにこの電子部品装着手段が電子部品を配線導体に
圧着させつつ、前記接合材料を低温加熱して、前記接合
材料を硬化させるものである。従って、電子部品に加わ
る熱衝撃が小さくなり、信頼性が損なわれにくくなると
共に、基板やその他の部品にもそれほど高い耐熱性が要
求されなくなり、コストを低減することが可能となる。(d) Means and operation for solving the problems In order to solve the above problems, the electronic component mounting method of the present invention provides adhesive and conductive bonding to at least one of the electronic component and the wiring conductor of the board. The electronic component is transferred by an electronic component mounting means and placed on the wiring conductor, and the electronic component mounting means crimps the electronic component onto the wiring conductor while heating the bonding material at a low temperature. , for curing the bonding material. Therefore, the thermal shock applied to the electronic components is reduced, reliability is less likely to be impaired, and the substrate and other components are no longer required to have such high heat resistance, making it possible to reduce costs.
（ホ）実施例
〈実施例１〉
この発明の第１の実施例を第１図に基づいて以下に説明
する。(E) Examples (Example 1) A first example of the present invention will be described below based on FIG. 1.
この実施例では、接合材料として異方性導電接着剤を用
いている。第１図（ａ）は、基板１にこの異方性導電接
着剤３を塗布する工程を示している。In this embodiment, an anisotropic conductive adhesive is used as the bonding material. FIG. 1(a) shows the process of applying this anisotropic conductive adhesive 3 to a substrate 1. As shown in FIG.
異方性導電接着剤３は、シリンジ５により供給され、シ
リンジ５内に空気圧（背圧）を加えることにより、ニー
ドル５ａより異方性導電接着剤３が基板１上に吐出され
る。異方性導電接着剤３は、基板１の全面に亘って塗布
され、配線導体２を覆う。ここで、異方性導電接着剤３
は、面方向に対しては絶縁性を有するが、厚さ方向に対
しては導電性を有している。The anisotropic conductive adhesive 3 is supplied by a syringe 5, and by applying air pressure (back pressure) into the syringe 5, the anisotropic conductive adhesive 3 is discharged onto the substrate 1 from the needle 5a. Anisotropic conductive adhesive 3 is applied over the entire surface of substrate 1 and covers wiring conductor 2 . Here, anisotropic conductive adhesive 3
has insulating properties in the plane direction, but conductivity in the thickness direction.
第１図（ｂ）は、チップ状の電子部品４を熱圧着する工
程を示している。電子部品４は、真空チャンク６で吸着
されて基板ｌ上に搬送され、電極４ａ。FIG. 1(b) shows the process of bonding the chip-shaped electronic component 4 by thermocompression. The electronic component 4 is sucked by the vacuum chunk 6 and transferred onto the substrate l, and is attached to the electrode 4a.
４ａが配線導体２上にくるように位置決めされる。4a is positioned above the wiring conductor 2.
その状態で真空チャック６が下降し、電子部品４が基板
１に圧着される。真空チャック６側方には、熱風ヒータ
７．７が配備され、電子部品４周辺に熱風を噴出する。In this state, the vacuum chuck 6 is lowered and the electronic component 4 is pressed onto the substrate 1. A hot air heater 7.7 is provided on the side of the vacuum chuck 6, and blows hot air around the electronic component 4.
この熱風により、電子部品４周辺の異方性導電接着剤３
が加熱されて硬化し、電子部品４が基板１に固定される
。もちろん、電子部品電極４ａは、異方性導電接着剤３
により配線導体２と電気的に接続する。This hot air causes the anisotropic conductive adhesive 3 around the electronic component 4 to
is heated and hardened, and the electronic component 4 is fixed to the substrate 1. Of course, the electronic component electrode 4a is made of anisotropic conductive adhesive 3.
It is electrically connected to the wiring conductor 2 by.
上記異方性導電接着剤３には、例えば積水ファインケミ
カル株式会社製異方性導電インクＵｌ−０３を使用する
。この異方性導電インクＵ’！−０３は圧力１５ｋｇ／
ｃｎ１以上、温度１４０°Ｃ以上で熱圧着を行うことが
できるので、電子部品４や基板■に加わる温度は、はん
だを用いる場合よりも十分低くすることが可能となる。As the anisotropic conductive adhesive 3, for example, anisotropic conductive ink Ul-03 manufactured by Sekisui Fine Chemical Co., Ltd. is used. This anisotropic conductive ink U'! -03 is pressure 15kg/
Since thermocompression bonding can be performed at a temperature of cn1 or higher and a temperature of 140°C or higher, the temperature applied to the electronic component 4 and the board 1 can be made sufficiently lower than when using solder.
なお、異方性導電接着剤３を塗布するかわりに、異方性
導電膜を基板に貼着してもよく、適宜設計変更可能であ
る。Note that instead of applying the anisotropic conductive adhesive 3, an anisotropic conductive film may be attached to the substrate, and the design can be changed as appropriate.
〈実施例２〉 この発明の第２の実施例を第２図に基づいて説明する。<Example 2> A second embodiment of the invention will be described based on FIG.
この実施例では、接合材料として異方性でない導電接着
剤を使用しており、第２図（ａ）は基板１１に、この導
電接着剤１３を塗布する工程を示している。導電接着剤
１３は、第１の実施例と同様のシリンジ１５を用いて、
配線導体Ｉ２、・・・ Ｉ２上に塗布される。In this embodiment, a non-anisotropic conductive adhesive is used as the bonding material, and FIG. 2(a) shows the process of applying this conductive adhesive 13 to the substrate 11. The conductive adhesive 13 is applied using the same syringe 15 as in the first embodiment.
Wiring conductors I2, . . . are applied on I2.
第２図（ｂ）は、チップ状の電子部品１４を熱圧着する
構成を示している。１６は、熱圧着実装機であり、電子
部品１４を挟持する、開閉自在のチャック１６ａ及び加
熱ツール１６ｂとを備えている。この加熱ツール１６ｂ
は、ヒータ１７を内蔵しており、このヒータ１７は、電
子部品１４を加熱して、導電接着剤１３を硬化させるに
十分な発熱量を有している。FIG. 2(b) shows a configuration in which chip-shaped electronic components 14 are bonded by thermocompression. 16 is a thermocompression bonding mounting machine, which is equipped with a chuck 16a that can be opened and closed and a heating tool 16b that clamps the electronic component 14. This heating tool 16b
has a built-in heater 17, and this heater 17 has a sufficient amount of heat to heat the electronic component 14 and harden the conductive adhesive 13.
電子部品１４は、この熱圧着実装ｖＪ１６により、基板
１１上に搬送され、電子部品電極１４ａを配線導体１２
上に位置させる。その後、熱圧着実装機１６が下降し、
電子部品１４が基板１１に接する。さらに、チャック１
６ａ、１６ａが開き、加熱ツール１６ｂが電子部品１４
を基板１１に押圧すると共に、ヒータ１７の熱により、
導電接着剤１３を硬化させる。もちろん、この時の温度
ははんだ溶融温度よりかなり低いので、電子部品１４の
受ける熱衝撃を従来と比較して小さいものとすることが
でき、また基板１１等の耐熱性も従来はどは要求されな
くなる。The electronic component 14 is transported onto the substrate 11 by this thermocompression mounting vJ16, and the electronic component electrode 14a is connected to the wiring conductor 12.
position it above. After that, the thermocompression bonding mounting machine 16 descends,
Electronic component 14 is in contact with substrate 11 . In addition, chuck 1
6a and 16a are opened, and the heating tool 16b is heated to the electronic component 14.
is pressed against the substrate 11, and due to the heat of the heater 17,
The conductive adhesive 13 is cured. Of course, since the temperature at this time is considerably lower than the solder melting temperature, the thermal shock to which the electronic component 14 is subjected can be reduced compared to the conventional one, and the heat resistance of the board 11 etc. is also not required in the past. It disappears.
〈実施例３〉
この発明の第３の実施例を第３図乃至第５図に基づいて
以下に説明する。<Embodiment 3> A third embodiment of the present invention will be described below based on FIGS. 3 to 5.
第３図は、電子部品２４−１．２４−２．２４４を実装
機２６に吸着する工程を示している。電子部品２４−１
．２４−２．２し、は、空気圧によりエアチューブ２８
−Ｉ、２８−２．２８−３内を搬送されて、実装仮置き
台２９上に複数個一括して並べられる〔第３図（ａ）参
照〕。実装仮置き台２９上には、凹部３０−１．３０−
２．３Ｏ−ｆｆが設けられており、これら凹部３０−１
．３０−２．３０−３のそれぞれに、電子部品２１．
２４−２．２４−３が収まって位置決めされる。FIG. 3 shows the process of sucking the electronic components 24-1.24-2.244 onto the mounting machine 26. Electronic parts 24-1
．． 24-2.2 The air tube 28 is opened by air pressure.
-I, 28-2, 28-3, and are arranged in a plurality on the temporary mounting stand 29 [see FIG. 3(a)]. On the temporary mounting stand 29, there is a recess 30-1.30-
2.3O-ff is provided, and these recesses 30-1
．． 30-2 and 30-3, each of the electronic components 21.
24-2 and 24-3 are fitted and positioned.
次に、この実施例仮置き台２８上に熱圧着実装機２６が
下降して、電子部品２４−Ｉ、２４−２．２４−３を配
列されたままの状態で吸着する〔第３図（ｂ）参照〕。Next, the thermocompression bonding mounting machine 26 descends onto the temporary holding table 28 of this embodiment and adsorbs the electronic components 24-I, 24-2, and 24-3 in the arranged state [Fig. b) see].
熱圧着実装機２６には、各電子部品２４−１．２４−２
．２４−３に・対応して吸着ノズル２６ａ、２５ｂ、２
６ｃが設けられており、また底面には押圧力伝達のため
のシリコンゴム２５が取り付けられている。また、熱圧
着実装機２６はヒータ２７を有している（第５図参照）
。Each electronic component 24-1, 24-2 is mounted on the thermocompression mounting machine 26.
．． Suction nozzles 26a, 25b, 2 correspond to 24-3.
6c, and a silicone rubber 25 for transmitting pressing force is attached to the bottom surface. Furthermore, the thermocompression bonding mounting machine 26 has a heater 27 (see FIG. 5).
.
第４図は、異方性導電接着剤２３を各電子部品２４の電
極部に付着する工程を示している。まず、スタンプ台３
１に、異方性導電接着剤２３を投入し、スキージ３２よ
り異方性導電接着剤２３を均一にのばす〔第４図（ａ）
参照〕。この時、異方性導電接着剤２３は、厚さ方向に
のみ導電性を有している。FIG. 4 shows the process of attaching the anisotropic conductive adhesive 23 to the electrode portions of each electronic component 24. First, stamp pad 3
1, add the anisotropic conductive adhesive 23 and spread the anisotropic conductive adhesive 23 uniformly using the squeegee 32 [Figure 4 (a)
reference〕. At this time, the anisotropic conductive adhesive 23 has conductivity only in the thickness direction.
次に、電子部品２４−１．２４−２．２４−３を吸着し
ている熱圧着実装機２６がこのスタンプ台３１上に位置
する〔第４図（ｂ）参照〕。そして、熱圧着実装機２６
が下降して、電子部品２４−３．２４−２．２１’３に
異方性導電接着剤２３を付着させる。Next, the thermocompression mounting machine 26, which is sucking the electronic components 24-1, 24-2, 24-3, is positioned on the stamp stand 31 [see FIG. 4(b)]. Then, the thermocompression mounting machine 26
descends to attach the anisotropic conductive adhesive 23 to the electronic component 24-3.24-2.21'3.
第５図は、熱圧着工程を示している。基板２１は、ヒー
タプレート３４上に載置される。このヒータプレート３
４も、ヒータ３５を内蔵している。FIG. 5 shows the thermocompression bonding process. The substrate 21 is placed on the heater plate 34. This heater plate 3
4 also has a built-in heater 35.
前記熱圧着実装機２６は、ヒータプレート３４上に位置
し、電子部品２４−７．２４−２．２４４の電極部が配
線導体２２に接するように、ヒータプレート３４に押圧
される。そして、ヒータ２７．３５により、異方性導電
接着剤２３が加熱されて硬化する。The thermocompression mounting machine 26 is located on the heater plate 34 and is pressed against the heater plate 34 so that the electrode portions of the electronic components 24-7, 24-2, 244 come into contact with the wiring conductors 22. Then, the anisotropic conductive adhesive 23 is heated and cured by the heaters 27 and 35.
この第３の実施例では、複数個の電子部品を同時に実装
することができ、第１及び第２の実施例の場合に比べて
製造効率を高めることができる。In this third embodiment, a plurality of electronic components can be mounted simultaneously, and manufacturing efficiency can be improved compared to the first and second embodiments.
（へ）発明の詳細
な説明したように、この発明の電子部品の実装方法は、
電子部品、基板の配線導体の少なくとも１方に、接着性
及び導電性を有する接合材料を付着し、この電子部品は
電子部品装着手段により搬送されて前記配線導体上に配
置され、さらにこの電子部品装着手段が電子部品を配線
導体に圧着させつつ、前記接合材料を低温加熱して硬化
させるものであり、電子部品に加わる熱衝撃を小さくし
、信頼性を損なうのを防止すると共に、基板やその他の
部品にもそれほどの耐熱性が要求されなくなり、コスト
を低減することができる。また、電子部品の搬送、位置
決め、熱圧着を一体化された電子部品装着手段により行
うことができ、製造工程の簡素化、効率化を図ることも
できる。(to) As described in detail of the invention, the electronic component mounting method of this invention is as follows:
An adhesive and conductive bonding material is adhered to at least one of the wiring conductors of the electronic component and the board, and the electronic component is transported by an electronic component mounting means and placed on the wiring conductor, and the electronic component is then placed on the wiring conductor. The mounting means press-bonds the electronic component to the wiring conductor while heating the bonding material at a low temperature to harden it. This reduces the thermal shock applied to the electronic component, prevents loss of reliability, and protects the board and other parts. Components are no longer required to have such high heat resistance, and costs can be reduced. Moreover, the electronic component can be transported, positioned, and thermocompressed by an integrated electronic component mounting means, and the manufacturing process can be simplified and made more efficient.
第１図（ａ）及び第１図ら）は、この発明の第１の実施
例を示し、それぞれ異方性導電接着剤塗布工程及び熱圧
着工程を説明する図、第２図（ａ）及び第２図（ｂ）は
、この発明の第２の実施例を示し、それぞれ導電接着剤
塗布工程及び熱圧着工程を説明する図、第３図乃至第５
図は、この発明の第３の実施例を示し、第３図（ａ）及
び第３図（ｂ）は、それぞれ電子部品配列工程及び電子
部品吸着工程を説明する図、第４図（ａ）及び第４図（
ｂ）は、それぞれ異方性導電接着剤のばし工程及び異方
性導電接着剤の付着工程を説明する図、第５図は、熱圧
着工程を説明する図である。
１・１１・２１：基板、
２・１２・２２：配線導体、
３・２３・：異方性導電接着剤、
１３：導電接着剤、
４・１４・２４−７・２４−２・２，１．：電子部品、
６：真空チャック、１６・２６：熱圧着実装機、７：熱
風ヒータ、 １７・２７・３５：ヒータ。FIG. 1(a) and FIG. 1 et al.) show a first embodiment of the present invention, and are diagrams illustrating an anisotropic conductive adhesive coating step and a thermocompression bonding step, respectively, and FIG. 2(a) and FIG. FIG. 2(b) shows a second embodiment of the present invention, and FIGS.
The figure shows a third embodiment of the present invention, and FIG. 3(a) and FIG. 3(b) are diagrams explaining an electronic component arrangement step and an electronic component suction step, respectively, and FIG. 4(a) and Figure 4 (
b) is a diagram illustrating the anisotropic conductive adhesive stretching process and the anisotropic conductive adhesive adhesion process, respectively, and FIG. 5 is a diagram illustrating the thermocompression bonding process. 1.11.21: Substrate, 2.12.22: Wiring conductor, 3.23.: Anisotropic conductive adhesive, 13: Conductive adhesive, 4.14.24-7.24-2.2,1 ．． :Electronic parts,
6: Vacuum chuck, 16/26: Thermocompression bonding mounting machine, 7: Hot air heater, 17/27/35: Heater.
Claims (3)
接着性及び導電性を有する接合材料を付着し、この電子
部品は電子部品装着手段により搬送されて前記配線導体
上に配置され、さらにこの電子部品装着手段が電子部品
を配線導体に圧着させつつ、前記接合材料を低温加熱し
て硬化させる電子部品の実装方法。(1) At least one of the electronic components and the wiring conductor of the board,
A bonding material having adhesiveness and conductivity is attached, and the electronic component is transported by an electronic component mounting means and placed on the wiring conductor, and further, while the electronic component mounting means pressure-bonds the electronic component to the wiring conductor, A method for mounting an electronic component in which the bonding material is hardened by heating at a low temperature.
する異方性接合材料であり、前記配線導体を覆うように
基板の全面に亘り塗布される特許請求の範囲第１項記載
の電子部品の実装方法。(2) The bonding material is an anisotropic bonding material having conductivity only in the thickness direction, and is applied over the entire surface of the substrate so as to cover the wiring conductor. How to mount electronic components.
おり、前記電子部品装着手段で搬送中の電子部品をこの
スタンプ台上の接合材料に接触させ、電子部品に接合材
料を付着する特許請求の範囲第１項記載の電子部品の実
装方法。(3) The bonding material is spread uniformly on the stamp pad, and the electronic component being transported by the electronic component mounting means is brought into contact with the bonding material on the stamp pad to adhere the bonding material to the electronic component. A method for mounting electronic components according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24763589A JPH03109795A (en) | 1989-09-22 | 1989-09-22 | Mounting of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24763589A JPH03109795A (en) | 1989-09-22 | 1989-09-22 | Mounting of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109795A true JPH03109795A (en) | 1991-05-09 |
Family
ID=17166439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24763589A Pending JPH03109795A (en) | 1989-09-22 | 1989-09-22 | Mounting of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109795A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016651A (en) * | 2006-07-06 | 2008-01-24 | Dainippon Printing Co Ltd | Component built-in wiring board and its manufacturing method |
-
1989
- 1989-09-22 JP JP24763589A patent/JPH03109795A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016651A (en) * | 2006-07-06 | 2008-01-24 | Dainippon Printing Co Ltd | Component built-in wiring board and its manufacturing method |
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