JPH0434901A - Electronic part and its mounting method - Google Patents
Electronic part and its mounting methodInfo
- Publication number
- JPH0434901A JPH0434901A JP14210290A JP14210290A JPH0434901A JP H0434901 A JPH0434901 A JP H0434901A JP 14210290 A JP14210290 A JP 14210290A JP 14210290 A JP14210290 A JP 14210290A JP H0434901 A JPH0434901 A JP H0434901A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- mounting
- mounting surface
- electronic part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
皮果上り月月全１
本発明は、半固定抵抗器、コネクタ、スイッチ等の電子
部品及びその実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electronic components such as semi-fixed resistors, connectors, and switches, and a method for mounting the same.
従来り技豊亙！１
一般に、インサートタイプの電子部品２１は、第５図に
実線で示すように、そのリード端子２２を基板２４に設
けた孔に挿入した状態で半田付けされ、実装きれる。Conventional technique toyohei! 1. In general, an insert type electronic component 21 is soldered and mounted with its lead terminal 22 inserted into a hole provided in a substrate 24, as shown by the solid line in FIG.
ところで、従来の調整部を有する電子部品２１は、側面
方向から加えられる押力Ｆを基板２４の孔に挿入してい
るリード端子２２で受は止めていた。そのため、リード
端子２２の許容限界値を越える大きさの押力Ｆが加わる
と、図中−点鎖線で示すようにリード端子２２はその根
元付近で破損あるいは変形していた、しかも、リード端
子２２の許容限界値は比較的低いものであった。By the way, in the conventional electronic component 21 having an adjustment section, the pushing force F applied from the side direction is not received by the lead terminal 22 inserted into the hole of the board 24. Therefore, when a pushing force F exceeding the allowable limit value of the lead terminal 22 is applied, the lead terminal 22 is damaged or deformed near its base, as shown by the dotted chain line in the figure. The acceptable limit value for was relatively low.
また、電子部品本体からリード端子を引き出す部分にお
いては、リード端子の引出し位置調整と固定強度アップ
のために、リード端子に折り曲げ部を設け、この折り曲
げ部を部品本体に設けた突起でかしめたり、封止剤で埋
め込んだりしているが、いずれの方法も煩雑な作業が伴
い、しかも、これらの方法で得られたリード端子と電子
部品本体との固定強度は前記押力に対して不充分な強度
であった。In addition, in the part where the lead terminal is pulled out from the electronic component body, in order to adjust the pull-out position of the lead terminal and increase the fixing strength, the lead terminal is provided with a bent part, and this bent part is caulked with a protrusion provided on the component body. Both methods involve complicated work, and the fixing strength between the lead terminal and the electronic component body obtained by these methods is insufficient to withstand the pressing force. It was strength.
そこで、本発明の課題は、プリント配線板等の基板への
実装強度が大きい電子部品及びその実装方法を提供する
ことにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component with high mounting strength on a substrate such as a printed wiring board, and a method for mounting the electronic component.
課 を 決するための手段
以上の課題を解決するため、本発明に係る第１の電子部
品は、リード端子を備えた電子部品本体の実装面に半硬
化状態の熱硬化性樹脂膜を形成したことを特徴とする。In order to solve the above problems, a first electronic component according to the present invention has a semi-hardened thermosetting resin film formed on the mounting surface of an electronic component body provided with lead terminals. It is characterized by
以上の構成からなる第１の電子部品の実装方法は、電子
部品のリード端子を基板に設けた孔に挿入して電子部品
を基板上に載置し、加熱処理により熱硬化性樹脂膜を本
硬化させた接着層を電子部品本体の実装面と基板との間
に形成することを特徴とする。The first electronic component mounting method having the above configuration involves inserting the lead terminals of the electronic component into holes provided in the board, placing the electronic component on the board, and applying heat treatment to the thermosetting resin film. The method is characterized in that a hardened adhesive layer is formed between the mounting surface of the electronic component body and the substrate.
また、本発明に係る第２の電子部品は、リード端子を備
えた電子部品本体と、前記電子部品本体の実装面に配設
可能なようにリード端子挿入孔を設けた半硬化状態の熱
硬化性樹脂からなる成形板と、から構成されることを特
徴とする。Further, a second electronic component according to the present invention includes an electronic component main body provided with a lead terminal, and a semi-hardened thermoset having a lead terminal insertion hole so as to be disposed on the mounting surface of the electronic component main body. and a molded plate made of a synthetic resin.
以上の構成からなる第２の電子部品の実装方法は、電子
部品のリード端子を成形板に設けたリード端子挿入孔と
基板に設けた孔に挿入して電子部品を成形板を介して基
板上に載置し、加熱処理により成形板を本硬化許せた接
着層を電子部品本体の実装面と基板との間に形成するこ
とを特徴とする。The second electronic component mounting method having the above configuration is to insert the lead terminal of the electronic component into the lead terminal insertion hole provided in the molded plate and the hole provided in the board, and then place the electronic component on the board via the molded plate. It is characterized by forming an adhesive layer between the mounting surface of the electronic component main body and the substrate, which allows the molded plate to be fully cured by heat treatment.
生−月
以上の構成により、電子部品本体の実装面に半硬化状態
の熱硬化性樹脂膜を形成したり、半硬化状態の熱硬化性
樹脂からなる成形板を配設したため、電子部品を基板上
に載置して加熱処理することにより、熱硬化性樹脂膜や
成形板を本硬化させた接着層が電子部品本体の実装面と
基板との間に形成される。この接着層は基板に実装され
た電子部品に加えられる側面方向からの押力に対抗する
働きをする。With the configuration described above, a semi-hardened thermosetting resin film is formed on the mounting surface of the electronic component body, and a molded plate made of semi-hardened thermosetting resin is provided, so that the electronic component can be mounted on the board. By placing the electronic component on top and subjecting it to heat treatment, an adhesive layer is formed between the mounting surface of the electronic component main body and the substrate by fully curing the thermosetting resin film or the molded plate. This adhesive layer functions to resist the pressing force applied from the side to the electronic components mounted on the board.
夾農忽
以下、本発明に係る電子部品及びその実装方法の実施例
を添付図面を参照して説明する。Embodiments of the electronic component and its mounting method according to the present invention will be described below with reference to the accompanying drawings.
［第１実施例、第１図及び第２図参照］第１図に示す電
子部品は、電子部品本体から３本の金属製リード端子２
を一方に引き出しているインサートタイプの電子部品で
ある。ＩＥ電子部品本体の実装面には塗布後予備加熱さ
れた半硬化状態の熱硬化性樹脂！Ｎ３（例えば、エポキ
シ樹脂膜等）が形成されている。[Refer to the first embodiment, FIGS. 1 and 2] The electronic component shown in FIG. 1 has three metal lead terminals 2 from the electronic component body.
It is an insert type electronic component that is pulled out on one side. The mounting surface of the IE electronic component body is a semi-cured thermosetting resin that is preheated after application! N3 (for example, an epoxy resin film, etc.) is formed.
以上の構成の電子部品は、そのリード端子２をプリント
配線板等の基板４に設けた孔４ａに挿入することにより
、基板４の上面に載置される。基板４に載置された電子
部品は、デイツプ式あるいはりフロー式半田付けがされ
る。このとき、第２図に示すように、電子部品本体１の
実装面と基板４の上面との間に挾まれた熱硬化性樹脂膜
３は、半田付は時の熱により、−時粘度が低下して電子
部品本体１の実装面と基板４との間に充填した後、本硬
化する。The electronic component having the above configuration is placed on the upper surface of the substrate 4 by inserting its lead terminal 2 into the hole 4a provided in the substrate 4 such as a printed wiring board. The electronic components placed on the board 4 are soldered using dip or flow soldering. At this time, as shown in FIG. 2, the thermosetting resin film 3 sandwiched between the mounting surface of the electronic component main body 1 and the upper surface of the board 4 has a viscosity at - due to the heat during soldering. After the resin is lowered and filled between the mounting surface of the electronic component body 1 and the substrate 4, it is fully cured.
こうして電子部品本体１の実装面と基板４との間に、電
子部品と基板４とを固着する接着層３′が形成される。In this way, an adhesive layer 3' is formed between the mounting surface of the electronic component main body 1 and the substrate 4, which fixes the electronic component and the substrate 4.
この接着層３′は電子部品のリード端子２の根元部分を
被覆し、かつ電子部品本体１の実装面全面に形成きれて
いる。この接着層３′はリード端子２と共に電子部品に
加えられる側面方向からの押力に対抗する働きをするの
で、基板４に取付けられた電子部品の実装強度が著しく
アップされる。即ち、押力の殆どは接着層３′で受は止
められ、リード端子２が破損又は変形しにくく、電気的
信頼性の高い電子部品となる。This adhesive layer 3' covers the root portions of the lead terminals 2 of the electronic component and is completely formed on the entire mounting surface of the electronic component body 1. This adhesive layer 3' works together with the lead terminals 2 to resist the pressing force applied to the electronic component from the side, so that the mounting strength of the electronic component attached to the substrate 4 is significantly increased. That is, most of the pushing force is absorbed by the adhesive layer 3', and the lead terminals 2 are not easily damaged or deformed, resulting in an electronic component with high electrical reliability.
［第２実施例、第３図参照］
第３図に示す電子部品は、リード端子１２を備えた電子
部品本体１１の実装面に、リード端子挿入孔１３ａを設
けた半硬化状態の熱硬化性樹脂からなる成形板１３を配
設するものである。成形板１３は電子部品のリード端子
１２にその挿入孔１３ａを嵌め込み、電子部品本体１１
の実装面に装着される０以上の構成の電子部品は、その
リード端子１２を基板４の孔４ａに挿入することにより
、基板４の上面に載置される。次に、電子部品が基板４
に半田付けされ、成形板１３は半田付は時の熱により本
硬化する。こうして電子部品本体１１の実装面と基板４
との間に電子部品と基板４とを固着する接着層が形成さ
れる。[Second Embodiment, see FIG. 3] The electronic component shown in FIG. 3 is a semi-cured thermosetting material in which a lead terminal insertion hole 13a is provided on the mounting surface of an electronic component body 11 provided with a lead terminal 12. A molded plate 13 made of resin is provided. The molded plate 13 has its insertion hole 13a fitted into the lead terminal 12 of the electronic component, and the electronic component main body 11
Electronic components having zero or more configurations to be mounted on the mounting surface of the board 4 are placed on the upper surface of the board 4 by inserting their lead terminals 12 into the holes 4a of the board 4. Next, the electronic components are placed on the board 4.
The molded plate 13 is fully cured by the heat of soldering. In this way, the mounting surface of the electronic component body 11 and the board 4
An adhesive layer is formed between the substrate 4 and the electronic component to fix the electronic component and the substrate 4.
［他の実施例コ
本発明に係る電子部品及びその実装方法は前記実施例に
限定するものではなく、その要旨の範囲内で種々に変形
することができる。[Other Embodiments] The electronic component and its mounting method according to the present invention are not limited to the embodiments described above, and can be modified in various ways within the scope of the gist.
熱硬化性樹脂を本硬化するための加熱は半田付は時の熱
とは別に、熱硬化性樹脂を硬化するための加熱工程を設
けてもよい。The heating for curing the thermosetting resin may be performed separately from the heat used during soldering, and a heating step for curing the thermosetting resin may be provided.
また、リード端子が実装面から一方向に引き出される電
子部品に限定されるものではなく、第４図に示すように
、リード端子が側面から二方向に引き出される電子部品
であってもよい、第４図に示す電子部品は、電子部品本
体１５の側面から二方向にリード端子１６が引き出きれ
、その本体１５の実装面には半硬化状態の熱硬化性樹脂
膜１７が形成きれている。Furthermore, the present invention is not limited to electronic components in which the lead terminals are drawn out in one direction from the mounting surface, but may be electronic components in which the lead terminals are drawn out in two directions from the side surface, as shown in FIG. In the electronic component shown in FIG. 4, lead terminals 16 can be pulled out in two directions from the side surface of an electronic component main body 15, and a semi-hardened thermosetting resin film 17 is completely formed on the mounting surface of the main body 15.
光ｊじυ１呆
以上のように、本発明によれば、電子部品本体の実装面
に半硬化状態の熱硬化性樹脂膜を形成したり、半硬化状
態の熱硬化性樹脂からなる成形板を配設する構造とした
ため、電子部品をプリント配線板等の基板に載置して加
熱することにより電子部品と基板との間に挾まれた前記
熱硬化性樹脂膜や成形板が半硬化状態から本硬化状態と
なり、電子部品と基板とを固着する接着層を形成する。As described above, according to the present invention, a semi-cured thermosetting resin film is formed on the mounting surface of an electronic component body, or a molded plate made of a semi-cured thermosetting resin is formed. Because of the structure in which electronic components are placed on a substrate such as a printed wiring board and heated, the thermosetting resin film or molded plate sandwiched between the electronic component and the substrate changes from a semi-hardened state. This is in a fully cured state, forming an adhesive layer that fixes the electronic component and the board.
この結果、本硬化した接着層がリード端子と共に電子部
品に加えられる側面方向からの押力に対抗する働きをす
るので、基板に取り付けられた電子部品の実装強度が著
しく大きくなり、しかも押力の殆どが接着層で受は止め
られるため、リード端子が破損又は変形しにくく、電気
的信頼性の高い電子部品となる。As a result, the fully cured adhesive layer works together with the lead terminals to resist the pushing force applied to the electronic component from the side, so the mounting strength of the electronic component attached to the board is significantly increased. Since most of the lead terminals are held in place by the adhesive layer, the lead terminals are unlikely to be damaged or deformed, resulting in an electronic component with high electrical reliability.
第１図及び第２図は本発明に係る電子部品及びその実装
方法の第１実施例を示すもので、第１図は電子部品実装
前の状態を示す斜視図、第２図は実装後の状態を示す正
面図である。第３図は本発明に係る電子部品及びその実
装方法の第２実施例を示すもので、電子部品実装前の状
態を示す斜視図である。第４図は本発明に係る電子部品
の他の実施例を示す斜視図である。第５図は従来の電子
部品及びその実装方法を示す正面図である。
１・・・電子部品本体、２・・・リード端子、３・・・
熱硬化性樹脂膜、３′・・・接着層、４・・・基板、１
１・・・電子部品本体、１２・・・リード端子、１３・
・・成形板、１３ａ・・・リード端子挿入孔、１５・・
・電子部品本体、１６・・・リード端子、１７・・・熱
硬化性樹脂膜。
特許出願人 株式会社村田製作所1 and 2 show a first embodiment of the electronic component and its mounting method according to the present invention, FIG. 1 is a perspective view showing the electronic component before mounting, and FIG. 2 is a perspective view after mounting. It is a front view showing a state. FIG. 3 shows a second embodiment of the electronic component and its mounting method according to the present invention, and is a perspective view showing the state before the electronic component is mounted. FIG. 4 is a perspective view showing another embodiment of the electronic component according to the present invention. FIG. 5 is a front view showing a conventional electronic component and its mounting method. 1... Electronic component body, 2... Lead terminal, 3...
Thermosetting resin film, 3'... Adhesive layer, 4... Substrate, 1
1... Electronic component body, 12... Lead terminal, 13...
... Molded plate, 13a... Lead terminal insertion hole, 15...
- Electronic component body, 16... Lead terminal, 17... Thermosetting resin film. Patent applicant Murata Manufacturing Co., Ltd.
Claims (4)
状態の熱硬化性樹脂膜を形成したことを特徴とする電子
部品。1. An electronic component characterized in that a semi-hardened thermosetting resin film is formed on the mounting surface of an electronic component body having lead terminals.
部品のリード端子を基板に設けた孔に挿入して電子部品
を基板上に載置し、加熱処理により熱硬化性樹脂膜を本
硬化させた接着層を電子部品本体の実装面と基板との間
に形成することを特徴とする電子部品の実装方法。2. 2. The method of mounting an electronic component according to claim 1, wherein the lead terminal of the electronic component is inserted into a hole provided in the substrate, the electronic component is placed on the substrate, and the thermosetting resin film is fully cured by heat treatment. 1. A method for mounting an electronic component, comprising forming an adhesive layer between a mounting surface of an electronic component body and a substrate.
本体の実装面に配設可能なようにリード端子挿入孔を設
けた半硬化状態の熱硬化性樹脂からなる成形板と、から
構成されることを特徴とする電子部品。3. Consisting of an electronic component body equipped with lead terminals, and a molded plate made of semi-hardened thermosetting resin and provided with lead terminal insertion holes so that it can be placed on the mounting surface of the electronic component body. Electronic components featuring:
部品のリード端子を成形板に設けたリード端子挿入孔と
基板に設けた孔に挿入して電子部品を成形板を介して基
板上に載置し、加熱処理により成形板を本硬化させた接
着層を電子部品本体の実装面と基板との間に形成するこ
とを特徴とする電子部品の実装方法。4. 4. The electronic component mounting method according to claim 3, wherein the lead terminal of the electronic component is inserted into a lead terminal insertion hole provided in the molded plate and a hole provided in the board, and the electronic component is mounted on the board via the molded board. A method for mounting an electronic component, comprising: placing the molded plate on the board and fully curing the molded plate through heat treatment to form an adhesive layer between the mounting surface of the electronic component body and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14210290A JPH0434901A (en) | 1990-05-30 | 1990-05-30 | Electronic part and its mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14210290A JPH0434901A (en) | 1990-05-30 | 1990-05-30 | Electronic part and its mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434901A true JPH0434901A (en) | 1992-02-05 |
Family
ID=15307479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14210290A Pending JPH0434901A (en) | 1990-05-30 | 1990-05-30 | Electronic part and its mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434901A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183250B1 (en) | 1995-12-27 | 2001-02-06 | Shofu, Inc. | Lock for orthodontic treatment |
| JPWO2015001667A1 (en) * | 2013-07-05 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | Mounting board manufacturing method and mounting board |
-
1990
- 1990-05-30 JP JP14210290A patent/JPH0434901A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6183250B1 (en) | 1995-12-27 | 2001-02-06 | Shofu, Inc. | Lock for orthodontic treatment |
| JPWO2015001667A1 (en) * | 2013-07-05 | 2017-02-23 | 日立オートモティブシステムズ株式会社 | Mounting board manufacturing method and mounting board |
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