JPH0371613A - Manufacture of chip type film capacitor - Google Patents

Abstract

PURPOSE:To contrive reduction in cost by a method wherein a composition is supported by a lead wire of metal material, and after it is hardened by impregnation, the lead wire is cut off at the base part. CONSTITUTION:The part 10B on one side of an electrode terminal board 10 is welded to a metallicon electrode 1A on the edge face of a capacitor element 1. The protruding tips of the lead wire 11 of a plurality of compositions are fixed to a supporting member 13 with a tape 14, they are set in such a manner that they can be impregnated easily, they are hardened by impregnation, an electric inspection is conducted, and a non-defective lead wire 11 is cut off at its base section. No complicated process is necessary for the capacitor formed as abovementioned when compared with the type of capacitor using the metallicon electrode directly. Moreover, as the plating of the electrode is unnecessary, the above-mentioned capacitor is advantageous from the view point of cost.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a chip-type film capacitor, and particularly to a method for forming terminals thereof.

[Conventional technology]

Chip-type film capacitors are used for surface mounting on printed circuit boards. A conventionally well-known type is a type in which a frame lead terminal is welded to a metallicon electrode formed by winding a metallized film and spraying metal onto the end surface, and then bending the frame lead terminal inside the bottom surface of the capacitor element. According to the document, a thick layer of metallicon is applied to the edge of the film, the metallicon surface is polished and plated to form an electrode, and this electrode can be soldered directly to a printed circuit board.

The manufacturing method of the first lead terminal type capacitor will be explained in the order of steps with reference to FIG. A plate-shaped frame lead terminal 2 is attached to a capacitor element 1 on which an electrode LA is formed by winding a metallized film and spraying metallicon on its end face. This frame lead terminal 2 is L-shaped, and one side of the L shape is welded to the electrode IA. Next, the entire frame is covered with a resin mold 3 so that the tip of the frame lead terminal 2 protrudes from the element, and finally the tip of the frame lead terminal 2 protruding from the resin mold 3 is placed on the bottom side of the capacitor element 1. , by bending it inward to make it suitable for flat surface mounting.

The second type of manufacturing method for a chip capacitor without lead wires is shown in the order of steps in FIG.

In this case, a particularly thick metal 1B is formed on the end face of the capacitor element 1 by metal spraying, and then the element is impregnated in low-viscosity epoxy. After impregnation, the metallicon surface is polished to form an electrode surface IC, and then this electrode surface IC is further plated to form an electrode ID.

[Problem to be solved by the invention]

The first type of manufacturing method of the prior art described above involves welding the frame lead terminal 2 to the metallic electrode IA.
It is not possible to impregnate the capacitor element l before welding. For this reason, even if the resin mold 3 is applied, there is a problem in moisture resistance, and there are also disadvantages in that the shape of the finished product becomes large. Next, the second type of manufacturing method is,
Since the electrode ID is directly soldered to the Bunritto board during mounting, a step is provided so that the peripheral edge of the electrode ID protrudes from the bottom surface of the film laminate of the capacitor element 1. This is done using jigs and tools during metal spraying, but the process becomes complicated. Finally, plate the electrode ID.
This has the disadvantage of high cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method that eliminates the above-mentioned drawbacks and allows chip-type capacitors with good moisture resistance to be manufactured through simple steps.

[Means to solve the problem]

The manufacturing method of the present invention includes a step of forming an element electrode by metal spraying on the end face of a film laminate made of laminated metallized films, and a step of forming a terminal metal member with a lead wire attached to an electrode terminal plate having a rectangular cross section. A step in which the cross-sectional corner of the terminal plate is brought into close contact with the corner of the film laminate and welded to the element electrode at the portion in contact with the element electrode, and the surface of the electrode terminal plate on the element electrode side is covered with a fibrous adhesive tape. After passing through a step of covering with water and a step of holding the composition obtained in the above step by a lead wire of a terminal metal member and impregnating and hardening it, the lead wire is cut at its base to obtain a finished product.

[Effect]

The electrode terminal plate has a rectangular cross-section, and is combined with the film laminate and welded to the element electrode of the film laminate, thereby forming a terminal structure as a completed product at that stage. After welding, the electrode terminal plate is covered with a fibrous adhesive tape on the element electrode side, and the impregnating process is performed by holding the element that has undergone the above process using the lead wire attached to the electrode terminal plate.

Since the electrode terminal plate is welded to the element electrode before impregnation and is held by the impregnated adhesive tape after the impregnation process, high mechanical strength can be achieved.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an example in the order of steps. An electrode terminal plate 10 having the shape shown in FIG. 2 is welded to the metallized electrode IA on the end face of the capacitor element 1 of the same figure (al) wrapped with a metallized film at a portion 10B forming one side of the metallized film. Figure (b)).

Here, the electrode terminal plate 10 has an L-shaped cross section, and its corner is formed so as to exactly match the corner of the capacitor element 1.
Lead wires 11 are connected as shown. In the finished product, lead wire 11 is cut off! A portion 10A forming one side of the terminal plate 10 serves as a terminal.

In FIG. 1 (C1 is a side view, a mold release agent is applied to the portion 10A of the electrode terminal plate 10 in this state, so that the impregnated resin does not stick to this portion in the subsequent impregnation step. As shown in FIG. 1 fd), the portion 1 of the electrode terminal plate 10
A fibrous adhesive tape 12 is attached so as to cover 0B. A plurality of pieces of the composition obtained through the above steps are taped onto a support 13 with tape 14 at the tip of each protruding wire 11 as shown in FIG. 1(e), and set to facilitate impregnation. do.

Next, in FIG. 1(f), the material is impregnated and cured, and an electrical test is performed. This process can be performed in exactly the same way as for lead-type capacitors. For non-defective products, the lead wire 11 is cut at its base in the following process shown in FIG.

In the capacitor formed in this manner, the electrode terminal plate has an L-shape, and the portion 10A thereof serves as a terminal disposed inside the bottom surface of the element.

〔Effect of the invention〕

In the present invention, an electrode terminal plate is welded to a metallicon electrode, and a lead wire attached to the electrode terminal plate is used to hold the element and impregnate and harden the element. Therefore, sufficient moisture resistance can be obtained. This electrode terminal plate has an L-shaped cross section and has a terminal structure suitable for surface mounting without requiring any processing by simply cutting the lead wire after impregnation and hardening. In addition, the part of the electrode terminal plate that is welded to the electrode on one side of the L-shape is covered with adhesive tape, and during the impregnation process, the epoxy resin penetrates into this adhesive tape and firmly maintains the contact between the electrode terminal plate and the capacitor element. , increasing mechanical strength.

Compared to the conventional type in which metallicon electrodes are directly used as terminals, there is no need for complicated processes such as forming a step between the metallicon electrodes and the film laminate, which were necessary in the conventional examples. Furthermore, electrode plating is not required, which is advantageous in terms of cost.

Next, compared to the frame lead terminal type, the element is impregnated, so it is highly reliable, and the electrode terminal plate has a terminal structure from the beginning due to the shape of the electrode terminal plate. is unnecessary.

[Brief explanation of drawings]

FIG. 1 is a process sequence diagram of an embodiment of the present invention, FIG. 2 is an outline diagram of a terminal metal member, and FIGS. 3 and 4 are process sequence diagrams of a conventional example. 1 - capacitor element, IA - electrode, 10 - electrode terminal board, 11 - lead wire, 12 - adhesive tape, 1
3-support, 14-tape.

Claims (1)

[Claims] On the end face of a film laminate in which metallized films are laminated,
A step of forming an element electrode by metal spraying, and a terminal metal member having a lead wire attached to an electrode terminal plate having an L-shaped cross section, with the cross-sectional corner of the electrode terminal plate being brought into close contact with the corner of the film laminate. , a step of welding to the device electrode at a portion in contact with the device electrode, a step of covering the surface of the electrode terminal plate on the device electrode side with a fibrous adhesive tape, and a step of applying the composition from the above step to the lead wire of the terminal metal member. A method for manufacturing a chip-type film capacitor, which is characterized in that after passing through a process of holding and impregnating and hardening, the lead wire is cut at its base to produce a finished product.