JPH041467U - - Google Patents
Info
- Publication number
- JPH041467U JPH041467U JP4104090U JP4104090U JPH041467U JP H041467 U JPH041467 U JP H041467U JP 4104090 U JP4104090 U JP 4104090U JP 4104090 U JP4104090 U JP 4104090U JP H041467 U JPH041467 U JP H041467U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- tape substrate
- test
- electrodes
- aligned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Description
第１図は本考案によるテープ基板検査装置の構
成図、第２図はテープ基板と検査針の横断面図を
示している。
１……ＩＣ、２，３……リード、４……テープ
基板（フイルム）、５，５′……検査針、６……
ベース板、７……ハンドラ・コントローラ、８…
…ＩＣ電気特性検査装置、９……電気導通判定装
置。
FIG. 1 is a block diagram of a tape substrate inspection apparatus according to the present invention, and FIG. 2 is a cross-sectional view of a tape substrate and an inspection needle. 1...IC, 2,3...Lead, 4...Tape substrate (film), 5,5'...Test needle, 6...
Base plate, 7... Handler controller, 8...
...IC electrical property testing device, 9...Electrical continuity determination device.
Claims (1)
装されたＩＣの電気特性検査で、該ＩＣの電極に
接続された複数のリードと対になる複数の検査針
とを位置合わせし、前記リードと前記検査針とを
接触させて電気的に接続する検査装置において、
前記ＩＣの電極と接続するリードと検査針の他に
、電気導通を確認する為の複数のリードと該リー
ドと対になる検査針を設けたことを特徴とするテ
ープ基板検査装置。 In testing the electrical characteristics of an IC mounted on a tape substrate using the film carrier method, a plurality of leads connected to the electrodes of the IC are aligned with a plurality of paired test needles, and the leads and the test needles are aligned. In an inspection device that connects electrically by contacting
A tape substrate inspection device characterized in that, in addition to the leads and test needles connected to the electrodes of the IC, a plurality of leads for checking electrical continuity and a test needle paired with the leads are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4104090U JPH041467U (en) | 1990-04-17 | 1990-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4104090U JPH041467U (en) | 1990-04-17 | 1990-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH041467U true JPH041467U (en) | 1992-01-08 |
Family
ID=31551361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4104090U Pending JPH041467U (en) | 1990-04-17 | 1990-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH041467U (en) |
-
1990
- 1990-04-17 JP JP4104090U patent/JPH041467U/ja active Pending
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