JPS5883153U - Wafer inspection equipment - Google Patents
Wafer inspection equipmentInfo
- Publication number
- JPS5883153U JPS5883153U JP17973281U JP17973281U JPS5883153U JP S5883153 U JPS5883153 U JP S5883153U JP 17973281 U JP17973281 U JP 17973281U JP 17973281 U JP17973281 U JP 17973281U JP S5883153 U JPS5883153 U JP S5883153U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer inspection
- inspection equipment
- stage
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来のウェーハ検査装置のウェーハ真空吸着
ステージの要部断面図、第２図はその要部斜視図、第３
図はこの考案の一実施例を示すウェーハ検査装置のウェ
ーハ真空吸着ステージの平面図、第４図は、半導体素子
形成済みのウェーハの平面図、第５図は一実施例を示し
たウェーハ真空吸着ステージの要部拡大断面図、第６図
はウェーハ検査状態を示すウェーハを断面視した模式図
゛である。
８・・・・・・ウェーハ、９・・・・・・ステージ、１
０・・・・・・多分割された小弁、１４・・・・・・通
電検査用触子（平行ピン）、１８・・・・・・無接点切
換素子、２３・・・・・・電圧検出用検針、２４．２６
・・・・・・電流駆動用検針。
第３図Figure 1 is a sectional view of the main part of a wafer vacuum suction stage of a conventional wafer inspection system, Figure 2 is a perspective view of the main part, and Figure 3 is a perspective view of the main part.
The figure is a plan view of a wafer vacuum suction stage of a wafer inspection system showing an embodiment of this invention, FIG. 4 is a plan view of a wafer on which semiconductor elements have been formed, and FIG. FIG. 6, which is an enlarged cross-sectional view of the main part of the stage, is a schematic cross-sectional view of the wafer showing the wafer inspection state. 8...Wafer, 9...Stage, 1
0...Multi-divided small valve, 14...Contactor for current testing (parallel pin), 18...Non-contact switching element, 23... Meter reading for voltage detection, 24.26
・・・・・・Meter reading for current drive. Figure 3
Claims (1)
着して固定し、ウェーハへ検針を接触させて通電し特性
検査を行う装置において、前記ステージを多分割形成す
るとともに、夫々を別個の通電検査用触子として接点切
換を行い検針と共働させることを特徴とするウェーハ検
査装置。In an apparatus in which a wafer on which semiconductor elements have been formed is fixed by vacuum suction on a stage, and a probe is brought into contact with the wafer to conduct a characteristic test, the stage is formed into multiple parts, and each part is used for a separate energization test. A wafer inspection device characterized by switching contacts as a probe and cooperating with needle detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17973281U JPS5883153U (en) | 1981-11-30 | 1981-11-30 | Wafer inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17973281U JPS5883153U (en) | 1981-11-30 | 1981-11-30 | Wafer inspection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5883153U true JPS5883153U (en) | 1983-06-06 |
Family
ID=29975690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17973281U Pending JPS5883153U (en) | 1981-11-30 | 1981-11-30 | Wafer inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5883153U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018021801A (en) * | 2016-08-02 | 2018-02-08 | 株式会社デンソー | Semiconductor element inspection device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54146581A (en) * | 1978-05-09 | 1979-11-15 | Mitsubishi Electric Corp | Electric chracteristic measuring device for semiconductor chip |
| JPS5599734A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Pattern-sheet for characteristic test of semiconductor element |
| JPS5545247B2 (en) * | 1971-09-30 | 1980-11-17 |
-
1981
- 1981-11-30 JP JP17973281U patent/JPS5883153U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5545247B2 (en) * | 1971-09-30 | 1980-11-17 | ||
| JPS54146581A (en) * | 1978-05-09 | 1979-11-15 | Mitsubishi Electric Corp | Electric chracteristic measuring device for semiconductor chip |
| JPS5599734A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Pattern-sheet for characteristic test of semiconductor element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018021801A (en) * | 2016-08-02 | 2018-02-08 | 株式会社デンソー | Semiconductor element inspection device |
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