JPS54146581A - Electric chracteristic measuring device for semiconductor chip - Google Patents

Electric chracteristic measuring device for semiconductor chip

Info

Publication number
JPS54146581A
JPS54146581A JP5513478A JP5513478A JPS54146581A JP S54146581 A JPS54146581 A JP S54146581A JP 5513478 A JP5513478 A JP 5513478A JP 5513478 A JP5513478 A JP 5513478A JP S54146581 A JPS54146581 A JP S54146581A
Authority
JP
Japan
Prior art keywords
semiconductor chip
measuring needle
pressure contact
electric
chracteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5513478A
Other languages
Japanese (ja)
Inventor
Toshiyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5513478A priority Critical patent/JPS54146581A/en
Publication of JPS54146581A publication Critical patent/JPS54146581A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To ensure a quick measurement of the characteristics of each chip by providing the measuring needle which features a simultaneous pressure contact to each electrode and the semiconductor chip inserted into the pocket of the container.
CONSTITUTION: A pressure contact is decured for measuring needle 5a and 5b of measurement plate 10a to cathode K and gate G of each semiconductor chip 4 within each pocket 2 of insulating substance 1. At the same time, a pressure contact is given between measuring needle 7 of measurement plate 10b and anode A through the pierced hole of substance 1. Then the connection between each measuring needle and measuring instrument 9 is switched in sequence with every chip 4 to measure the electric characteristics. With this method, the intermittent feeding mechasnism can be omitted, thus ensuring a quick measurement.
COPYRIGHT: (C)1979,JPO&Japio
JP5513478A 1978-05-09 1978-05-09 Electric chracteristic measuring device for semiconductor chip Pending JPS54146581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5513478A JPS54146581A (en) 1978-05-09 1978-05-09 Electric chracteristic measuring device for semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5513478A JPS54146581A (en) 1978-05-09 1978-05-09 Electric chracteristic measuring device for semiconductor chip

Publications (1)

Publication Number Publication Date
JPS54146581A true JPS54146581A (en) 1979-11-15

Family

ID=12990301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5513478A Pending JPS54146581A (en) 1978-05-09 1978-05-09 Electric chracteristic measuring device for semiconductor chip

Country Status (1)

Country Link
JP (1) JPS54146581A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883153U (en) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 Wafer inspection equipment
JPS642333A (en) * 1987-06-24 1989-01-06 Tokyo Electron Ltd Element containing tray
JPH0233437U (en) * 1988-08-26 1990-03-02
WO1996038858A2 (en) * 1995-05-26 1996-12-05 Formfactor, Inc. Method and probe card for testing semiconductor devices
US5634267A (en) * 1991-06-04 1997-06-03 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US5656537A (en) * 1994-11-28 1997-08-12 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a semiconductor device having SOI structure
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6252175B1 (en) 1993-11-16 2001-06-26 Igor Y. Khandros Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate
US6640415B2 (en) 1999-06-07 2003-11-04 Formfactor, Inc. Segmented contactor
US6669489B1 (en) 1993-11-16 2003-12-30 Formfactor, Inc. Interposer, socket and assembly for socketing an electronic component and method of making and using same
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6956174B2 (en) 1993-11-16 2005-10-18 Formfactor, Inc. Tip structures
JP4437508B1 (en) * 2009-02-27 2010-03-24 株式会社アドバンテスト Test equipment
CN105080861A (en) * 2014-05-12 2015-11-25 泰克元有限公司 Test handler and electronic device test method using the same
JP2016184454A (en) * 2016-05-23 2016-10-20 日本発條株式会社 Piezoelectric element supply method
JP2018021801A (en) * 2016-08-02 2018-02-08 株式会社デンソー Semiconductor element inspection device

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883153U (en) * 1981-11-30 1983-06-06 日本電気ホームエレクトロニクス株式会社 Wafer inspection equipment
JPS642333A (en) * 1987-06-24 1989-01-06 Tokyo Electron Ltd Element containing tray
JPH0233437U (en) * 1988-08-26 1990-03-02
US5634267A (en) * 1991-06-04 1997-06-03 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7140883B2 (en) 1993-11-16 2006-11-28 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6956174B2 (en) 1993-11-16 2005-10-18 Formfactor, Inc. Tip structures
US5806181A (en) * 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US6252175B1 (en) 1993-11-16 2001-06-26 Igor Y. Khandros Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate
US6913468B2 (en) 1993-11-16 2005-07-05 Formfactor, Inc. Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
US6669489B1 (en) 1993-11-16 2003-12-30 Formfactor, Inc. Interposer, socket and assembly for socketing an electronic component and method of making and using same
US5656537A (en) * 1994-11-28 1997-08-12 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a semiconductor device having SOI structure
WO1996038858A2 (en) * 1995-05-26 1996-12-05 Formfactor, Inc. Method and probe card for testing semiconductor devices
WO1996038858A3 (en) * 1995-05-26 1997-03-20 Formfactor Inc Method and probe card for testing semiconductor devices
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
US7578057B2 (en) 1999-06-07 2009-08-25 Formfactor, Inc. Method of fabricating segmented contactor
US7065870B2 (en) 1999-06-07 2006-06-27 Formfactor, Inc. Segmented contactor
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
US6640415B2 (en) 1999-06-07 2003-11-04 Formfactor, Inc. Segmented contactor
JP4437508B1 (en) * 2009-02-27 2010-03-24 株式会社アドバンテスト Test equipment
WO2010097841A1 (en) * 2009-02-27 2010-09-02 株式会社アドバンテスト Testing apparatus and testing method
CN105080861A (en) * 2014-05-12 2015-11-25 泰克元有限公司 Test handler and electronic device test method using the same
CN105080861B (en) * 2014-05-12 2018-04-20 泰克元有限公司 Testing, sorting machine and utilize this electronic unit test method
JP2016184454A (en) * 2016-05-23 2016-10-20 日本発條株式会社 Piezoelectric element supply method
JP2018021801A (en) * 2016-08-02 2018-02-08 株式会社デンソー Semiconductor element inspection device

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