JPH0414503B2 - - Google Patents
Info
- Publication number
- JPH0414503B2 JPH0414503B2 JP57042460A JP4246082A JPH0414503B2 JP H0414503 B2 JPH0414503 B2 JP H0414503B2 JP 57042460 A JP57042460 A JP 57042460A JP 4246082 A JP4246082 A JP 4246082A JP H0414503 B2 JPH0414503 B2 JP H0414503B2
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- plating
- metallized
- die stage
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042460A JPS58158951A (ja) | 1982-03-16 | 1982-03-16 | 半導体パッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042460A JPS58158951A (ja) | 1982-03-16 | 1982-03-16 | 半導体パッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58158951A JPS58158951A (ja) | 1983-09-21 |
| JPH0414503B2 true JPH0414503B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-13 |
Family
ID=12636678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57042460A Granted JPS58158951A (ja) | 1982-03-16 | 1982-03-16 | 半導体パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158951A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2617518B2 (ja) * | 1988-04-19 | 1997-06-04 | 新光電気工業株式会社 | セラミックパッケージおよびその製造方法 |
| JP2819570B2 (ja) * | 1988-11-22 | 1998-10-30 | ミノルタ株式会社 | プリント基板の製造方法 |
| US5206188A (en) * | 1990-01-31 | 1993-04-27 | Ibiden Co., Ltd. | Method of manufacturing a high lead count circuit board |
| JP6298363B2 (ja) * | 2014-06-03 | 2018-03-20 | 日本特殊陶業株式会社 | 配線基板 |
-
1982
- 1982-03-16 JP JP57042460A patent/JPS58158951A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58158951A (ja) | 1983-09-21 |
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