JPH0413413B2 - - Google Patents

Info

Publication number
JPH0413413B2
JPH0413413B2 JP58120936A JP12093683A JPH0413413B2 JP H0413413 B2 JPH0413413 B2 JP H0413413B2 JP 58120936 A JP58120936 A JP 58120936A JP 12093683 A JP12093683 A JP 12093683A JP H0413413 B2 JPH0413413 B2 JP H0413413B2
Authority
JP
Japan
Prior art keywords
palladium
silver
alloy
thermal expansion
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58120936A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6013038A (ja
Inventor
Mitsuhiko Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuyama Corp
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Priority to JP58120936A priority Critical patent/JPS6013038A/ja
Publication of JPS6013038A publication Critical patent/JPS6013038A/ja
Publication of JPH0413413B2 publication Critical patent/JPH0413413B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Contacts (AREA)
  • Conductive Materials (AREA)
JP58120936A 1983-07-05 1983-07-05 低熱膨張性銀パラジウム合金 Granted JPS6013038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58120936A JPS6013038A (ja) 1983-07-05 1983-07-05 低熱膨張性銀パラジウム合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58120936A JPS6013038A (ja) 1983-07-05 1983-07-05 低熱膨張性銀パラジウム合金

Publications (2)

Publication Number Publication Date
JPS6013038A JPS6013038A (ja) 1985-01-23
JPH0413413B2 true JPH0413413B2 (enrdf_load_stackoverflow) 1992-03-09

Family

ID=14798629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58120936A Granted JPS6013038A (ja) 1983-07-05 1983-07-05 低熱膨張性銀パラジウム合金

Country Status (1)

Country Link
JP (1) JPS6013038A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59900542D1 (de) * 1999-05-22 2002-01-24 Omg Ag & Co Kg Verwendung eines Katalysators für die Dampfreformierung von Methanol
JP4252582B2 (ja) * 2005-05-12 2009-04-08 マブチモーター株式会社 直流小型モータ用整流子材料及び刷子材料、クラッド複合材並びにそれを使用した直流小型モータ
US8511535B1 (en) * 2010-04-19 2013-08-20 Aegis Technology Inc. Innovative braze and brazing process for hermetic sealing between ceramic and metal components in a high-temperature oxidizing or reducing atmosphere

Also Published As

Publication number Publication date
JPS6013038A (ja) 1985-01-23

Similar Documents

Publication Publication Date Title
US4399096A (en) High temperature brazing alloys
US4576790A (en) Low gold dental alloys
JPS62227051A (ja) Cu合金製電気機器用コネクタ
JPH0413413B2 (enrdf_load_stackoverflow)
JPH04311543A (ja) Ag−SnO−InO電気接点材料とその製法
JPS6215621B2 (enrdf_load_stackoverflow)
JPS6256937B2 (enrdf_load_stackoverflow)
JPS58107438A (ja) 歯科用低カラツト焼付合金
JPS61501932A (ja) 歯に適用するための合金
JPS594493B2 (ja) 半導体機器のリ−ド材用銅合金
JPS6130014B2 (enrdf_load_stackoverflow)
JPH039741B2 (enrdf_load_stackoverflow)
JP3483736B2 (ja) 銀合金の製造方法
JP2667689B2 (ja) 低融点Agはんだ
JPS60145343A (ja) 半導体機器のリ−ド材用銅合金
JPS5947016B2 (ja) 金属酸化物分散強化型銅合金の製造法
JPS63161134A (ja) 電気部品用銅合金
JP2667690B2 (ja) 低融点Agはんだ
JPS63230837A (ja) ヒユ−ズ用銅合金
JPS63161135A (ja) 電気部品用銅合金
WO2011155509A1 (ja) 耐火花消耗特性に優れた点火プラグ電極用の材料
JPH0465135B2 (enrdf_load_stackoverflow)
JPS5940897B2 (ja) 配線接続用銅合金
JP4057162B2 (ja) 高強度高導電性の高Cr含有銅合金
JPS6242976B2 (enrdf_load_stackoverflow)